MX2013009014A - Composicion de soldadura sin plomo. - Google Patents

Composicion de soldadura sin plomo.

Info

Publication number
MX2013009014A
MX2013009014A MX2013009014A MX2013009014A MX2013009014A MX 2013009014 A MX2013009014 A MX 2013009014A MX 2013009014 A MX2013009014 A MX 2013009014A MX 2013009014 A MX2013009014 A MX 2013009014A MX 2013009014 A MX2013009014 A MX 2013009014A
Authority
MX
Mexico
Prior art keywords
weight
lead
solder composition
free solder
composition
Prior art date
Application number
MX2013009014A
Other languages
English (en)
Other versions
MX344239B (es
Inventor
John Pereira
Jennie S Hwang
Alexandra M Mackin
Joseph C Golsalves
Original Assignee
Antaya Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Antaya Technologies Corp filed Critical Antaya Technologies Corp
Publication of MX2013009014A publication Critical patent/MX2013009014A/es
Publication of MX344239B publication Critical patent/MX344239B/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2410/00—Constructional features of vehicle sub-units
    • B60Y2410/115—Electric wiring; Electric connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Una composición de soldadura incluye aproximadamente 4% a aproximadamente 25% en peso de estaño, aproximadamente 0.1% a aproximadamente 8% en peso de antimonio, aproximadamente 0.03% a aproximadamente 4% en peso de cobre, aproximadamente 0.03% a aproximadamente 4% en peso de níquel, aproximadamente 66% a aproximadamente 90% en peso de indio, y aproximadamente 0.5% a aproximadamente 9% en peso de plata; la composición además puede incluir aproximadamente 0.2% a aproximadamente 6% en peso de zinc, e, independientemente, aproximadamente 0.01% a aproximadamente 0.3% en peso de germanio; la composición se puede usar para soldar un conector eléctrico a una superficie de contacto eléctrico en un componente de vidrio.
MX2013009014A 2011-02-04 2012-02-01 Composicion de soldadura sin plomo. MX344239B (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161439538P 2011-02-04 2011-02-04
US201161540213P 2011-09-28 2011-09-28
PCT/US2012/023492 WO2012106434A1 (en) 2011-02-04 2012-02-01 Lead-free solder composition

Publications (2)

Publication Number Publication Date
MX2013009014A true MX2013009014A (es) 2013-12-06
MX344239B MX344239B (es) 2016-12-07

Family

ID=45755521

Family Applications (2)

Application Number Title Priority Date Filing Date
MX2013009014A MX344239B (es) 2011-02-04 2012-02-01 Composicion de soldadura sin plomo.
MX2016013906A MX356849B (es) 2011-02-04 2012-02-01 Composicion de soldadura sin plomo.

Family Applications After (1)

Application Number Title Priority Date Filing Date
MX2016013906A MX356849B (es) 2011-02-04 2012-02-01 Composicion de soldadura sin plomo.

Country Status (9)

Country Link
US (4) US8771592B2 (es)
EP (2) EP2990155B1 (es)
JP (4) JP2014509944A (es)
CN (1) CN103476539B (es)
CA (1) CA2825629A1 (es)
MX (2) MX344239B (es)
PL (2) PL2990155T3 (es)
TW (3) TWI583481B (es)
WO (1) WO2012106434A1 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112009002570B4 (de) * 2008-10-24 2024-05-23 Mitsubishi Electric Corporation Lötmetalllegierung und Halbleiterbauteil
JP2014509944A (ja) * 2011-02-04 2014-04-24 アンタヤ・テクノロジーズ・コープ 無鉛はんだ組成物
WO2012150452A1 (en) * 2011-05-03 2012-11-08 Pilkington Group Limited Glazing with a soldered connector
KR101438897B1 (ko) 2012-08-13 2014-09-17 현대자동차주식회사 유리용 무연솔더 조성물
CN105473266A (zh) * 2013-07-31 2016-04-06 安塔亚技术公司 包括带焊剂储集部的预焊表面的电气部件
JP6062905B2 (ja) * 2013-10-16 2017-01-18 スマート エレクトロニクス インク 表面実装用ヒューズおよびそれを含む構造体
KR102272298B1 (ko) * 2015-05-15 2021-07-05 앱티브 테크놀러지스 리미티드 인듐-주석-은 베이스 무연 솔더
JP6725971B2 (ja) * 2015-07-14 2020-07-22 日本板硝子株式会社 ガラス板モジュール
KR20170108766A (ko) * 2016-03-18 2017-09-27 헤베이 리신 테크놀로지 컴퍼니 리미티드 높은 연성을 가지는 무연 솔더 조성물
EP3492217B1 (en) * 2017-03-17 2021-03-03 Fuji Electric Co., Ltd. Solder material
US11121487B2 (en) 2017-11-07 2021-09-14 Central Glass Company, Limited Car window glass assembly
CN108326464A (zh) * 2018-03-13 2018-07-27 苏州塞澳电气有限公司 一种汽车玻璃专用的无铅焊锡
CN112638575A (zh) * 2018-09-07 2021-04-09 中央硝子株式会社 车窗用玻璃组件
CN111250893A (zh) * 2020-03-12 2020-06-09 南通欢腾机电科技有限公司 一种无铅焊料、其制备方法、其应用及金属端子
CN111872596A (zh) * 2020-07-29 2020-11-03 昆山市宏嘉焊锡制造有限公司 一种铟、铅、银、锑低温钎焊料
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition
JP2022036898A (ja) * 2021-05-26 2022-03-08 内橋エステック株式会社 鉛フリーはんだ
CN117139917B (zh) * 2023-10-31 2024-03-08 苏州塞一澳电气有限公司 一种汽车玻璃用无铅焊料及其制备方法和应用

Family Cites Families (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US785137A (en) * 1903-04-01 1905-03-21 James G Westbrook Valve.
DE1555053B1 (de) 1964-04-23 1970-04-30 Saint Gobain Verfahren zur Herstellung einer heizbaren Autoscheibe
US3721594A (en) 1969-07-01 1973-03-20 Ppg Industries Inc Applying electroconductive heating circuits to glass
US3671311A (en) 1969-07-01 1972-06-20 Ppg Industries Inc Applying electroconductive heating circuits to glass
US3721595A (en) 1969-07-01 1973-03-20 Ppg Industries Inc Applying electroconductive heating circuits to glass
SU637217A1 (ru) 1977-04-18 1978-12-15 Педприятие П/Я В-8584 Припой дл пайки деталей электровакуумных приборов
US4362903A (en) 1980-12-29 1982-12-07 General Electric Company Electrical conductor interconnect providing solderable connections to hard-to-contact substrates, such as liquid crystal cells
US4785137A (en) * 1984-04-30 1988-11-15 Allied Corporation Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices
JPH02217193A (ja) 1989-02-17 1990-08-29 Matsushita Electric Works Ltd インジウム系粉末状ハンダ
JPH03209793A (ja) 1989-10-18 1991-09-12 Nippondenso Co Ltd ガラス基板の半田接続構造
DE3940748A1 (de) 1989-12-09 1991-06-13 Ver Glaswerke Gmbh Elektrisch beheizbare autoglasscheibe aus verbundglas
KR100205160B1 (ko) 1991-04-09 1999-07-01 마스나가멘로파크가부시끼가이샤 Ni-ti계 합금과 이종금속의 접합부 및 그 접합방법
US5120498A (en) 1991-05-15 1992-06-09 C-Innovations, Inc. Solders having exceptional adhesion to glass
DE4126533A1 (de) 1991-08-10 1993-02-11 Ver Glaswerke Gmbh Verfahren zum kontaktieren von elektrisch heizbaren glasscheiben mit transparenten heizwiderstandsschichten
DE69632866T2 (de) 1995-09-29 2005-07-14 Matsushita Electric Industrial Co., Ltd., Kadoma Bleifreies lot
US5863493A (en) 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
JP3601278B2 (ja) * 1996-12-17 2004-12-15 ソニー株式会社 はんだ材料
US6179935B1 (en) * 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
DE19729545A1 (de) 1997-07-10 1999-01-14 Euromat Gmbh Lotlegierung
ES2224609T3 (es) * 1998-03-26 2005-03-01 Nihon Superior Sha Co., Ltd Aleacion de soldadura exenta de plomo.
US6176947B1 (en) 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
US20030007885A1 (en) 1999-03-16 2003-01-09 Shinjiro Domi Lead-free solder
US6253988B1 (en) 1999-03-29 2001-07-03 Antaya Technologies Corporation Low temperature solder
US6197434B1 (en) 2000-01-07 2001-03-06 Joseph M. E. Hsu Glazing covered ferrite core electrode terminal of a surface mounting inductor
WO2001053847A1 (en) 2000-01-19 2001-07-26 Millennium Technology Inc. C-shaped magnetic resonance imaging system
BR0107834A (pt) 2000-01-25 2003-01-14 It Vetro Siv S P A Soc Envidraçamento provido com um circuito elétrico e método para sua produção
JP3630400B2 (ja) * 2000-01-31 2005-03-16 三菱電機株式会社 可溶栓用低温溶融合金、この合金を用いた可溶栓、および、この可溶栓を用いた冷凍装置
DE10020931C1 (de) 2000-04-28 2001-08-09 Heinrich Zitzmann Temperaturmessfühler und Verfahren zur Kontaktierung eines Temperaturmessfühlers
JP2002096191A (ja) 2000-09-18 2002-04-02 Matsushita Electric Ind Co Ltd はんだ材料およびこれを利用する電気・電子機器
EP1207539A1 (en) 2000-11-18 2002-05-22 Joseph M.E. Hsu Glazing covered ferrite core electrode terminal of a surface mounting inductor
JP4273199B2 (ja) * 2001-03-06 2009-06-03 Ｄｏｗａホールディングス株式会社 分離組織を有する部材およびその製造方法
JP4911836B2 (ja) * 2001-06-28 2012-04-04 ソルダーコート株式会社 温度ヒューズ用可溶性合金および温度ヒューズ用線材および温度ヒューズ
CN1242869C (zh) * 2001-07-25 2006-02-22 邓和升 无铅焊料
EP1439024B1 (en) * 2001-08-30 2005-03-30 Sumida Corporation Nonleaded solder alloy and electronic parts using it
JP2003332731A (ja) 2002-05-09 2003-11-21 Murata Mfg Co Ltd Ｐｂフリー半田付け物品
JP4360666B2 (ja) * 2002-07-16 2009-11-11 内橋エステック株式会社 合金型温度ヒューズ及び温度ヒューズエレメント用線材
DE10249992C1 (de) 2002-10-26 2003-12-24 Saint Gobain Sekurit D Gmbh Durchsichtige Scheibe mit einer undurchsichtigen Kontaktfläche für eine Lötverbindung
JP4204852B2 (ja) 2002-11-26 2009-01-07 内橋エステック株式会社 合金型温度ヒューズ及び温度ヒューズエレメント用材料
GB0302230D0 (en) 2003-01-30 2003-03-05 Pilkington Plc Vehicular glazing panel
US20050029675A1 (en) * 2003-03-31 2005-02-10 Fay Hua Tin/indium lead-free solders for low stress chip attachment
TWI222910B (en) * 2003-08-04 2004-11-01 Univ Nat Central Constituents of solder
US7132746B2 (en) 2003-08-18 2006-11-07 Delphi Technologies, Inc. Electronic assembly with solder-bonded heat sink
US7159756B2 (en) * 2003-08-29 2007-01-09 Ppg Industries Ohio, Inc. Method of soldering and solder compositions
JP2005154797A (ja) 2003-11-21 2005-06-16 Anzen Dengu Kk 温度ヒューズ用可溶性合金および温度ヒューズ
US7410833B2 (en) 2004-03-31 2008-08-12 International Business Machines Corporation Interconnections for flip-chip using lead-free solders and having reaction barrier layers
JP2007536088A (ja) 2004-05-04 2007-12-13 エス−ボンド テクノロジーズ、エルエルシー インジウム、ビスマス及び／またはカドミウムを含有する低温活性半田を用いて形成した電子パッケージ
WO2006016588A1 (ja) 2004-08-10 2006-02-16 Asahi Glass Company, Limited 車両用窓ガラス
GB2419137A (en) * 2004-10-15 2006-04-19 Alpha Fry Ltd Solder alloy
US7268415B2 (en) 2004-11-09 2007-09-11 Texas Instruments Incorporated Semiconductor device having post-mold nickel/palladium/gold plated leads
US20070224842A1 (en) 2004-11-12 2007-09-27 Agc Automotive Americas R&D, Inc. Electrical Connector For A Window Pane Of A Vehicle
US20070105412A1 (en) * 2004-11-12 2007-05-10 Agc Automotive Americas R&D, Inc. Electrical Connector For A Window Pane Of A Vehicle
US20070013054A1 (en) * 2005-07-12 2007-01-18 Ruchert Brian D Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages
US20070036670A1 (en) 2005-08-12 2007-02-15 John Pereira Solder composition
EP1922175B1 (en) 2005-08-12 2019-09-04 Aptiv Technologies Limited Solder composition
US7628871B2 (en) 2005-08-12 2009-12-08 Intel Corporation Bulk metallic glass solder material
US20070037004A1 (en) * 2005-08-12 2007-02-15 Antaya Technologies Corporation Multilayer solder article
US20080175748A1 (en) 2005-08-12 2008-07-24 John Pereira Solder Composition
US7749336B2 (en) 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
TWI311451B (en) 2005-11-30 2009-06-21 Murata Manufacturing Co Ceramic substrate, electronic device, and manufacturing method of ceramic substrate
GB0605884D0 (en) 2006-03-24 2006-05-03 Pilkington Plc Electrical connector
GB0605883D0 (en) 2006-03-24 2006-05-03 Pilkington Plc Electrical connector
CN101437971B (zh) 2006-05-08 2015-07-08 美国铟泰公司 用以降低金属间化合物厚度和金属及合金氧化的合金组合物和技术
TW200810869A (en) * 2006-08-17 2008-03-01 Po-Shan Huang Soldering paste and hot-pressing method for soldering using same
DE102007029031A1 (de) 2007-06-23 2008-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum dauerhaften Verbinden zweier Komponenten durch Löten mit Glas- oder Metalllot
US8888932B2 (en) 2007-07-18 2014-11-18 Senju Metal Industry Co., Ltd. Indium-containing lead-free solder for vehicle-mounted electronic circuits
CN101239425A (zh) * 2008-03-13 2008-08-13 浙江省冶金研究院有限公司 一种无铅高温电子钎料及制备方法
MY153585A (en) 2008-04-23 2015-02-27 Senju Metal Industry Co Lead-free solder alloy having reduced shrinkage cavities
DE112009002570B4 (de) * 2008-10-24 2024-05-23 Mitsubishi Electric Corporation Lötmetalllegierung und Halbleiterbauteil
US8304291B2 (en) 2009-06-29 2012-11-06 Advanced Micro Devices, Inc. Semiconductor chip thermal interface structures
EP2365730A1 (de) 2010-03-02 2011-09-14 Saint-Gobain Glass France Scheibe mit einem elektrischen Anschlusselement
JP2014509944A (ja) * 2011-02-04 2014-04-24 アンタヤ・テクノロジーズ・コープ 無鉛はんだ組成物
WO2012150452A1 (en) 2011-05-03 2012-11-08 Pilkington Group Limited Glazing with a soldered connector
FR3004710B1 (fr) 2013-04-19 2017-01-27 Saint Gobain Vitrage de controle solaire comprenant deux couches metalliques a base de nickel

Also Published As

Publication number Publication date
PL2670560T3 (pl) 2016-04-29
BR112013019849A2 (pt) 2016-10-11
TW201238696A (en) 2012-10-01
CN103476539B (zh) 2016-08-17
JP6243893B2 (ja) 2017-12-06
TWI505897B (zh) 2015-11-01
TW201538263A (zh) 2015-10-16
EP2670560B1 (en) 2016-01-13
JP6928062B2 (ja) 2021-09-01
TW201726291A (zh) 2017-08-01
JP6846328B2 (ja) 2021-03-24
PL2990155T3 (pl) 2018-01-31
US20120222893A1 (en) 2012-09-06
TWI583481B (zh) 2017-05-21
US9975207B2 (en) 2018-05-22
CN103476539A (zh) 2013-12-25
EP2670560A1 (en) 2013-12-11
JP2020040127A (ja) 2020-03-19
MX344239B (es) 2016-12-07
US20180207753A1 (en) 2018-07-26
JP2018039053A (ja) 2018-03-15
JP2014509944A (ja) 2014-04-24
CA2825629A1 (en) 2012-08-09
US20170190004A1 (en) 2017-07-06
EP2990155A1 (en) 2016-03-02
EP2990155B1 (en) 2017-09-27
WO2012106434A1 (en) 2012-08-09
JP2016052684A (ja) 2016-04-14
TWI642510B (zh) 2018-12-01
US8771592B2 (en) 2014-07-08
US10105794B2 (en) 2018-10-23
MX356849B (es) 2018-06-15
US20140271343A1 (en) 2014-09-18

Similar Documents

Publication Publication Date Title
MX344239B (es) Composicion de soldadura sin plomo.
MX370004B (es) Cristal con elemento de conexión eléctrica.
MY154044A (en) Solder alloy, solder paste, and electronic circuit board
MY154361A (en) Solder alloy, solder paste, and electronic circuit board
MY162879A (en) Solder alloy, solder paste, and electronic circuit board
EA201590995A1 (ru) Оконное стекло с электрическим присоединительным элементом и компенсационными пластинками
MX347252B (es) Cristal con un elemento de conexion electrica.
MY154604A (en) Solder alloy, solder paste, and electronic circuit board
MY163084A (en) Conductive paste
WO2013056155A3 (en) Opto -electrical devices with electrode incorporating metal nanowires
MX2011011353A (es) Aleacion de soldura de bajo contenido de plata y composicion de pasta de soldadura.
GB2478892A (en) Doping of lead-free solder alloys and structures formed thereby
WO2011142848A3 (en) Nanoparticle electrodes and methods of preparation
WO2010134734A3 (ko) 기판 표면 실장용 도전성 접촉 단자
MX2019001008A (es) Acristalamiento equipado con un dispositivo electricamente conductor con zonas de soldadura mejoradas.
WO2012091331A3 (ko) 태양전지의 전극 형성용 페이스트 조성물 및 이를 이용한 전극
MX2015016392A (es) Dispositivo interruptor electrico.
MX2017007920A (es) Sustrato de vidrio proporcionado con tiras conductoras de cobre.
GB201207840D0 (en) Electrical equipotential mural apparatus
WO2012106589A3 (en) Solar cell electrode, and method for manufacturing the same, and paste for the solar cell electrode
WO2015191955A3 (en) Aluminum-tin paste and its use in manufacturing solderable electrical conductors
WO2012024557A3 (en) Photovoltaic device front contact
WO2013080072A3 (de) Solarzelle und verfahren zum herstellen einer solarzelle
PH12016502241B1 (en) Connecting component material
WO2014033753A3 (en) "a process for the preparation of transparent conductive oxides".

Legal Events

Date Code Title Description
HH Correction or change in general
HH Correction or change in general
FG Grant or registration