WO2010134734A3 - 기판 표면 실장용 도전성 접촉 단자 - Google Patents

기판 표면 실장용 도전성 접촉 단자 Download PDF

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Publication number
WO2010134734A3
WO2010134734A3 PCT/KR2010/003114 KR2010003114W WO2010134734A3 WO 2010134734 A3 WO2010134734 A3 WO 2010134734A3 KR 2010003114 W KR2010003114 W KR 2010003114W WO 2010134734 A3 WO2010134734 A3 WO 2010134734A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact terminal
conductive contact
substrate surface
metal layer
elastic core
Prior art date
Application number
PCT/KR2010/003114
Other languages
English (en)
French (fr)
Other versions
WO2010134734A2 (ko
Inventor
김선태
이형춘
이상원
Original Assignee
두성산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 두성산업주식회사 filed Critical 두성산업주식회사
Priority to EP10777921.7A priority Critical patent/EP2434859B1/en
Priority to JP2012511757A priority patent/JP5286447B2/ja
Priority to CN2010800220406A priority patent/CN102428767A/zh
Priority to US13/321,303 priority patent/US20120118608A1/en
Publication of WO2010134734A2 publication Critical patent/WO2010134734A2/ko
Publication of WO2010134734A3 publication Critical patent/WO2010134734A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

본 발명은 기판 표면 실장용 도전성 접촉 단자를 제공한다. 본 발명의 기판 표면 실장용 도전성 접촉 단자는 접촉 단자에 탄성을 부여하는 탄성 코어; 상기 탄성코어의 외측을 감싸도록 형성된 금속층; 및 상기 탄성 코어와 상기 금속층 사이에 상기 탄성 코어와 상기 금속층을 서로 접착시키는 전도성 접착제층;을 포함한다. 본 발명의 기판 표면 실장용 도전성 접촉 단자는 전기 저항이 낮고, 고열의 리플로우 솔더링 공정에서도 재료의 변형이 없으며, 도전성 접촉 단자에 전도성을 부여하는 금속층에 파단이 발생하여도 전도성을 상실하지 않는다.
PCT/KR2010/003114 2009-05-18 2010-05-17 기판 표면 실장용 도전성 접촉 단자 WO2010134734A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP10777921.7A EP2434859B1 (en) 2009-05-18 2010-05-17 Conductive contact terminal to be mounted on a substrate surface
JP2012511757A JP5286447B2 (ja) 2009-05-18 2010-05-17 基板表面実装用導電性接触端子
CN2010800220406A CN102428767A (zh) 2009-05-18 2010-05-17 用于安装在基板表面的导电性接触端子
US13/321,303 US20120118608A1 (en) 2009-05-18 2010-05-17 Conductive contact terminal for surface mounting on substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0043248 2009-05-18
KR1020090043248A KR101054251B1 (ko) 2009-05-18 2009-05-18 기판 표면 실장용 도전성 접촉 단자

Publications (2)

Publication Number Publication Date
WO2010134734A2 WO2010134734A2 (ko) 2010-11-25
WO2010134734A3 true WO2010134734A3 (ko) 2011-03-03

Family

ID=43126637

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/003114 WO2010134734A2 (ko) 2009-05-18 2010-05-17 기판 표면 실장용 도전성 접촉 단자

Country Status (6)

Country Link
US (1) US20120118608A1 (ko)
EP (1) EP2434859B1 (ko)
JP (1) JP5286447B2 (ko)
KR (1) KR101054251B1 (ko)
CN (1) CN102428767A (ko)
WO (1) WO2010134734A2 (ko)

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KR101131749B1 (ko) * 2009-08-21 2012-04-05 두성산업 주식회사 기판 표면 실장용 도전성 탄성 접촉 단자
KR101084282B1 (ko) 2011-06-15 2011-11-17 김선기 솔더링이 가능한 탄성 전기접촉단자
KR101420368B1 (ko) * 2012-04-24 2014-07-16 두성산업 주식회사 기판 표면 실장용 도전성 전자파 흡수 접촉단자
CN102709768B (zh) * 2012-05-30 2014-08-13 深圳市华星光电技术有限公司 插座
KR101661971B1 (ko) * 2015-05-15 2016-10-04 두성산업 주식회사 전기접촉단자 및 그 제조 방법
US20160336093A1 (en) * 2015-05-15 2016-11-17 Joinset Co., Ltd. Elastic electric contact terminal adapted to small size
CN206619706U (zh) * 2017-04-14 2017-11-07 深圳市卓汉材料技术有限公司 一种接地弹性件
CN109935984B (zh) * 2017-12-18 2021-01-22 泰科电子(上海)有限公司 弹性导电端子及其制造方法
CN108424653A (zh) * 2018-02-08 2018-08-21 东莞市雷兹盾电子材料有限公司 一种可用于替代金属弹片的smd导电橡胶组合物
CN110351943A (zh) * 2018-04-08 2019-10-18 莱尔德电子材料(深圳)有限公司 表面安装接触件
KR101951732B1 (ko) 2018-08-06 2019-03-04 두성산업 주식회사 측면 접촉이 가능한 기판 표면 실장용 도전성 접촉단자 및 그 제조방법
KR102416027B1 (ko) * 2019-11-15 2022-07-05 조인셋 주식회사 탄성 전기접촉단자
CN112533395B (zh) * 2020-12-21 2021-12-24 北京同方信息安全技术股份有限公司 印制电路板中埋入电阻的方法及其印制电路板
KR102339845B1 (ko) * 2021-04-28 2021-12-16 주식회사 메가테크 전기 접촉 단자
KR102638217B1 (ko) * 2021-12-09 2024-02-20 조인셋 주식회사 솔더링이 가능한 탄성 전기접촉단자
CN115566451B (zh) 2022-12-06 2023-04-07 深圳市卓汉材料技术有限公司 一种接地端子及电子设备

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Also Published As

Publication number Publication date
EP2434859A2 (en) 2012-03-28
EP2434859A4 (en) 2014-10-01
JP5286447B2 (ja) 2013-09-11
KR20100124148A (ko) 2010-11-26
EP2434859B1 (en) 2016-04-06
KR101054251B1 (ko) 2011-08-08
US20120118608A1 (en) 2012-05-17
CN102428767A (zh) 2012-04-25
WO2010134734A2 (ko) 2010-11-25
JP2012527094A (ja) 2012-11-01

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