WO2008126719A1 - コネクタおよびコネクタ用金属材料 - Google Patents

コネクタおよびコネクタ用金属材料 Download PDF

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Publication number
WO2008126719A1
WO2008126719A1 PCT/JP2008/056414 JP2008056414W WO2008126719A1 WO 2008126719 A1 WO2008126719 A1 WO 2008126719A1 JP 2008056414 W JP2008056414 W JP 2008056414W WO 2008126719 A1 WO2008126719 A1 WO 2008126719A1
Authority
WO
WIPO (PCT)
Prior art keywords
connector
metallic material
gradually decreases
decreases toward
copper concentration
Prior art date
Application number
PCT/JP2008/056414
Other languages
English (en)
French (fr)
Inventor
Kazuo Yoshida
Kyota Susai
Takeo Uno
Shuichi Kitagawa
Original Assignee
The Furukawa Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by The Furukawa Electric Co., Ltd. filed Critical The Furukawa Electric Co., Ltd.
Priority to US12/595,057 priority Critical patent/US8342895B2/en
Priority to EP08739527.3A priority patent/EP2157668B9/en
Priority to CN2008800194851A priority patent/CN101682135B/zh
Publication of WO2008126719A1 publication Critical patent/WO2008126719A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H01R13/113—Resilient sockets co-operating with pins or blades having a rectangular transverse section
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12458—All metal or with adjacent metals having composition, density, or hardness gradient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

　オス端子およびメス端子の少なくとも一方の、少なくとも接点部分の最表面が表面に向けて徐々にＣｕ濃度を減少させたＣｕ－Ｓｎ合金層である金属材料により形成されているコネクタ；およびこのコネクタに使用される金属材料であって、最表面が表面に向けて徐々にＣｕ濃度を減少させたＣｕ－Ｓｎ合金層からなるコネクタ用金属材料。
PCT/JP2008/056414 2007-04-09 2008-03-31 コネクタおよびコネクタ用金属材料 WO2008126719A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/595,057 US8342895B2 (en) 2007-04-09 2008-03-31 Connector and metallic material for connector
EP08739527.3A EP2157668B9 (en) 2007-04-09 2008-03-31 Connector and metallic material for connector
CN2008800194851A CN101682135B (zh) 2007-04-09 2008-03-31 连接器和连接器用金属材料

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-102099 2007-04-09
JP2007102099 2007-04-09

Publications (1)

Publication Number Publication Date
WO2008126719A1 true WO2008126719A1 (ja) 2008-10-23

Family

ID=39863824

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056414 WO2008126719A1 (ja) 2007-04-09 2008-03-31 コネクタおよびコネクタ用金属材料

Country Status (5)

Country Link
US (1) US8342895B2 (ja)
EP (1) EP2157668B9 (ja)
JP (1) JP5192878B2 (ja)
CN (1) CN101682135B (ja)
WO (1) WO2008126719A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010267418A (ja) * 2009-05-12 2010-11-25 Furukawa Electric Co Ltd:The コネクタ
JP5883201B1 (ja) * 2014-09-26 2016-03-09 京セラ株式会社 音響発生器、音響発生装置および電子機器
US9826315B2 (en) 2014-09-26 2017-11-21 Kyocera Corporation Acoustic generator, acoustic generation device, and electronic apparatus

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JP5355935B2 (ja) * 2007-05-29 2013-11-27 古河電気工業株式会社 電気電子部品用金属材料
WO2009116602A1 (ja) * 2008-03-19 2009-09-24 古河電気工業株式会社 コネクタ用端子およびその製造方法
JP5325734B2 (ja) * 2009-08-18 2013-10-23 三菱伸銅株式会社 導電部材及びその製造方法
JP5442385B2 (ja) * 2009-10-07 2014-03-12 三菱伸銅株式会社 導電部材及びその製造方法
DE102010012820B4 (de) * 2010-03-25 2012-08-23 Wago Verwaltungsgesellschaft Mbh Leitereinführungsstecker
JP5036892B2 (ja) * 2010-05-10 2012-09-26 株式会社神戸製鋼所 コンタクトプローブ
JP5714863B2 (ja) * 2010-10-14 2015-05-07 矢崎総業株式会社 雌端子および雌端子の製造方法
JP2013098088A (ja) * 2011-11-02 2013-05-20 Sumitomo Wiring Syst Ltd 雌型端子金具
JP6029435B2 (ja) * 2012-06-27 2016-11-24 Ｊｘ金属株式会社 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
JP6050664B2 (ja) * 2012-06-27 2016-12-21 Ｊｘ金属株式会社 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
JP5427945B2 (ja) * 2012-06-27 2014-02-26 Ｊｘ日鉱日石金属株式会社 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
US10373730B2 (en) * 2012-07-25 2019-08-06 Jx Nippon Mining & Metals Corporation Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
JP6189966B2 (ja) * 2012-11-08 2017-09-06 モネ ロワイヤル カナディエンヌ／ロイヤル カナディアン ミントＭｏｎｎａｉｅ Ｒｏｙａｌｅ Ｃａｎａｄｉｅｎｎｅ／Ｒｏｙａｌ Ｃａｎａｄｉａｎ Ｍｉｎｔ 制御された条件下における錫と銅との相互拡散による金色の青銅のための改良された技法
JP5537751B1 (ja) * 2013-02-24 2014-07-02 古河電気工業株式会社 金属部材、端子、電線接続構造体、および端子の製造方法
US9054435B2 (en) * 2013-07-18 2015-06-09 GM Global Technology Operations LLC Conversion terminal device and method for coupling dissimilar metal electrical components
WO2015083547A1 (ja) * 2013-12-04 2015-06-11 株式会社オートネットワーク技術研究所 電気接点およびコネクタ端子対
DE112015001904T5 (de) 2014-04-24 2016-12-29 Yazaki Corporation Kontaktverbindungsstruktur
JP6361477B2 (ja) * 2014-11-19 2018-07-25 株式会社オートネットワーク技術研究所 コネクタ用端子
JP5984981B2 (ja) * 2015-02-24 2016-09-06 Ｊｘ金属株式会社 電子部品用Ｓｎめっき材
JP5984980B2 (ja) * 2015-02-24 2016-09-06 Ｊｘ金属株式会社 電子部品用Ｓｎめっき材
JP6204953B2 (ja) * 2015-09-18 2017-09-27 矢崎総業株式会社 端子付き電線及びそれを用いたワイヤーハーネス
JP6423383B2 (ja) * 2016-03-31 2018-11-14 日新製鋼株式会社 接続部品用材料
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US20190103693A1 (en) * 2017-09-29 2019-04-04 Apple Inc. Electrical contacts having sacrificial layer for corrosion protection
JP7067766B2 (ja) * 2017-12-04 2022-05-16 石原ケミカル株式会社 Ｓｎ層又はＳｎ合金層を含む構造体
JP2020047500A (ja) * 2018-09-20 2020-03-26 矢崎総業株式会社 端子嵌合構造
JP7111000B2 (ja) * 2019-01-18 2022-08-02 株式会社オートネットワーク技術研究所 金属材および接続端子
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JP7352851B2 (ja) * 2019-08-05 2023-09-29 株式会社オートネットワーク技術研究所 電気接点材料、端子金具、コネクタ、及びワイヤーハーネス
JP6958643B2 (ja) * 2020-01-10 2021-11-02 トヨタ自動車株式会社 評価方法
US11069995B1 (en) * 2020-02-07 2021-07-20 Northrop Grumman Systems Corporation Single self-insulating contact for wet electrical connector
CN114094373A (zh) * 2020-06-22 2022-02-25 华为技术有限公司 导电端子、电连接器和电子设备

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010267418A (ja) * 2009-05-12 2010-11-25 Furukawa Electric Co Ltd:The コネクタ
JP5883201B1 (ja) * 2014-09-26 2016-03-09 京セラ株式会社 音響発生器、音響発生装置および電子機器
US9826315B2 (en) 2014-09-26 2017-11-21 Kyocera Corporation Acoustic generator, acoustic generation device, and electronic apparatus

Also Published As

Publication number Publication date
EP2157668A1 (en) 2010-02-24
JP2008282802A (ja) 2008-11-20
JP5192878B2 (ja) 2013-05-08
CN101682135B (zh) 2013-10-02
US20100190390A1 (en) 2010-07-29
EP2157668B1 (en) 2015-11-11
CN101682135A (zh) 2010-03-24
EP2157668B9 (en) 2016-02-17
EP2157668A4 (en) 2012-07-18
US8342895B2 (en) 2013-01-01

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