WO2010134734A2 - 기판 표면 실장용 도전성 접촉 단자 - Google Patents
기판 표면 실장용 도전성 접촉 단자 Download PDFInfo
- Publication number
- WO2010134734A2 WO2010134734A2 PCT/KR2010/003114 KR2010003114W WO2010134734A2 WO 2010134734 A2 WO2010134734 A2 WO 2010134734A2 KR 2010003114 W KR2010003114 W KR 2010003114W WO 2010134734 A2 WO2010134734 A2 WO 2010134734A2
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- WIPO (PCT)
- Prior art keywords
- conductive
- elastic core
- contact terminal
- metal
- conductive contact
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to a conductive contact terminal mounted on a surface of a substrate, and more particularly, to be used between a contact region of a circuit board and an electronic component or between two or more electronic components in a process of placing an electronic component on a circuit board. It relates to a conductive contact terminal that can be.
- SMT Surface Mount Technology
- a conductive contact terminal may be interposed therebetween for bonding between the electronic component and the circuit board or between the electronic component and the electronic component.
- the conductive contact terminals may be deformed and applied to the height of the junction, or a metallic contact element having elasticity may be used.
- the surface mount process including reflow soldering is performed at a high temperature of 180 to 270 ° C.
- the surface is deformed because the product is deformed due to the simple use of a conventional conductive material, so the surface cannot be actually used as a conductive contact terminal. It is necessary to use contact terminals suitable for the mounting process. Therefore, in order to prevent thermal deformation of the contact terminal, a conductive contact terminal made of a resilient metal such as a beryllium copper alloy may be used.
- a conductive contact terminal made of a resilient metal such as a beryllium copper alloy
- Republic of Korea Utility Model No. 390490 discloses a non-conductive elastic rubber, a conductive elastic rubber coating layer surrounding the elastic rubber, an electrical contact terminal for mounting the surface with a metal foil, in this case the power due to the relatively high resistance of the conductive elastic rubber There were problems of leakage and loss of conductivity due to damage to the conductive coating layer.
- the elasticity is provided by the foam of the elastic rubber or the hole of the elastic rubber is considered to be useful for the electrical contact terminal of a certain size or more.
- the foamed elastic rubber or the tube-shaped elastic rubber formed of the patent technology it is difficult to manufacture a small elastic electrical contact terminal having a height of 2.2 mm or less and a small width and a high cost. .
- the yield was bad because of large movement during automatic reflow soldering by vacuum pickup.
- Korean Patent No. 892720 discloses an elastic core 100 made of an insulating non-foamed elastic rubber and a non-foamed rubber coating layer, and a metal layer 200 that is bonded through the elastic core and the non-conductive adhesive layer 300.
- An elastic electrical contact terminal is disclosed.
- the metal layer is formed by sputtering a metal on the heat resistant polymer film and then plating the metal thereon.
- the metal layer 200 located at the outermost of the electrical contact terminal may be broken by the compressive stress beyond the original compressive strength.
- the polymer film inside the metal layer is non-conductive, so that the conductivity of the entire electrical contact element is destroyed, thereby preventing the purpose of the electrical contact element.
- an object of the present invention is low electrical resistance, no deformation of the material even in a high-temperature reflow soldering process, even if the breakage occurs in the metal layer imparting conductivity to the conductive contact terminal
- An object of the present invention is to provide a conductive contact terminal for surface mounting that does not lose its weight.
- Surface-mount conductive contact terminal of the present invention for achieving the above object is an elastic core for providing elasticity to the contact terminal; A metal layer formed to surround the outer side of the elastic core; And a conductive adhesive layer bonding the elastic core and the metal layer to each other between the elastic core and the metal layer.
- the conductive contact terminal for surface mounting of the present invention is suitable for the reflow soldering process because it does not lose its conductivity even at high temperatures and does not lose conductivity. Moreover, since the electrical resistance is very low, there is a fear of power loss due to the electrical resistance of the contact terminal. Is less.
- the conductive contact terminals for substrate surface mounting of the present invention have sufficient elasticity, unlike the contact terminals made of conventional metallic materials, so that they can be inserted and used at various heights required at the site where the contact elements are inserted.
- the conductive contact terminal of the present invention allows both cross sections to be exposed in the longitudinal direction of the conductive elastic core so that the elastic core can easily come out to both cross sections when pressure is applied, thereby providing reliable elasticity and resilience.
- the surface-mount conductive contact terminal of the present invention employs an electrically conductive adhesive and an electrically conductive elastic core, or an electrically conductive adhesive and an electrically nonconductive elastic core, wherein the electrically conductive adhesive and the electrically conductive elastic core are applied from outside. Repeated compression and expansion causes the conductive contact terminal to maintain conductivity even if breakage occurs in the metal layer. That is, even when the metal layer is broken, the conductive adhesive and the conductive elastic core inside the metal layer have electrical conductivity, thereby maintaining electrical conductivity.
- the retaining function can increase the stability of the conductive contact terminal and extend its life.
- FIG. 1 is a cross-sectional view of a conventional contact terminal manufactured using a nonconductive elastic core and a nonconductive adhesive layer.
- FIG. 2 is a perspective view of a conductive contact terminal for substrate surface mounting according to an embodiment of the present invention.
- FIG 3 is a perspective view of a conductive contact terminal for substrate surface mounting according to an embodiment of the present invention.
- FIG. 4 is a perspective view of a conductive contact terminal for substrate surface mounting according to an embodiment of the present invention.
- FIG. 5 is a perspective view of a conductive contact terminal for substrate surface mounting according to an embodiment of the present invention.
- the conductive contact terminal for substrate surface mounting of the present invention comprises a structure wrapped with a metal layer solderable to an elastic core.
- the first component constituting the conductive contact terminal 1 of the present invention is an elastic core 10 which is a core material which imparts elastic force.
- the elastic core imparts elasticity to the contact terminal of the present invention.
- the elastic core is preferably made of silicone rubber, crosslinked natural rubber or crosslinked synthetic rubber. Considering that the surface mounting process is a process proceeding at a high temperature of 180 ⁇ 270 °C, it is preferable that the elastic core uses a heat resistant material so that the core is not modified by heat.
- the elastic core 10 may use a conductive elastic core or a non-conductive elastic core.
- the metal layer which is a component of the present invention, and the conductive adhesive layer have electrical conductivity
- the metal layer, the conductive adhesive layer, and the above are the components of the present invention. Since the conductive elastic cores are all electrically conductive, the stability of the conductive contact terminals can be further increased even if repeated compression and expansion due to externally applied pressure are applied.
- Such an elastic core is not particularly limited as long as it combines a certain level of elasticity and conductivity at the same time, the silicone elastic core 10 is preferably used.
- the silicone elastic core 10 is molded by a method by extrusion, rubber mold, or hot pressing. Specifically, when the thickness is 4 mm or more, a manufacturing method by extrusion is more suitable, and when the thickness is 3 mm or less, a molding method by heat press is more suitable.
- the conductive silicone elastic core is prepared by imparting electrical conductivity to the silicone elastic core, and the electrical conductivity impartation is made by blending a metal powder having electrical conductivity with silicon. This compounding is carried out in a pressure kneader which can obtain efficient dispersion characteristics in a short time.
- the silicone rubber and the electroconductive metal powder compound blended in this pressure kneader allow the conductive silicone elastic core 10 to be obtained by extrusion and heat pressing processes.
- the compounding ratio of such a compound is preferably 20 parts by weight to 600 parts by weight with respect to 100 parts by weight of the silicone rubber.
- the conductive metal powders which can be used at this time are silver, gold, copper, nickel, nickel-iron alloy, tin. , Silver coated copper, and the like.
- the content of the conductive metal powder is less than 20 parts by weight based on 100 parts by weight of the silicone rubber, it is difficult to obtain the desired electrical conductivity, and when the content is higher than 600 parts by weight, the content of the conductive metal powder is too high, resulting in high viscosity of the blend. There is a problem that molding becomes difficult.
- the size of the conductive metal powder is preferably 10 ⁇ m ⁇ 70 ⁇ m.
- the size of the metal powder is smaller than 10 ⁇ m, the contact between the metal particles in the silicone rubber is difficult, there is a problem that the electrical conductivity is lowered, if larger than 70 ⁇ m, the coating surface scratches due to the size of the particles during coating This occurs, it is difficult to precise coating thickness control, there is a problem that the appearance is rough.
- the hardness of silicone rubber for elastic core is appropriate for shore A 10 ° ⁇ 70 °. When the hardness is lowered to 10 or less, the viscosity is low, making it difficult to maintain the shape of the molded body, and when the hardness is increased to 70 or more, the viscosity becomes too high and the molding becomes difficult.
- the electrical resistance of the electrically conductive silicone elastic cores mixed and prepared in the above manner is prepared from 0.1 ⁇ to 10 k ⁇ .
- the hardness and electrical resistance of the elastic rubber can be determined by appropriately selecting the hardness and the mixing ratio of the silicone rubber according to the purpose. Can be.
- the silicone elastic core formed by the extrusion method may be cured by staying for about 0.5 to 5 minutes on the vertical vulcanizer maintained at a temperature of about 170 to 350 °C, the residence time can be adjusted according to the temperature of the vertical vulcanizer .
- the conductive adhesive 30 is coated on the silicon elastic core 10 manufactured as described above, and the metal layer 20 including the metal coating layer 22 and the heat resistant film 21, which is another component of the present invention, is bonded to each other.
- a conductive contact terminal for substrate surface mounting according to the present invention can be obtained.
- the conductive adhesive 30 is preferably used containing a silicon component having an adhesive and a metal powder to maintain the electrical conductivity.
- the conductive adhesive 30 is very suitable for the adhesion of the silicon material, it is possible to energize by the contained metal powder.
- the metal powder includes silver, gold, copper, nickel, nickel-iron alloys, tin, copper coated with silver, and the like.
- the conductive adhesive is discharged at a constant rate on the surface of the conductive silicon core by the ejector, and the conductive silicone elastic core is coated with a constant thickness while passing through a mold having a large clearance of about 0.01 to 1 mm.
- the elastic core 10 of the present invention is not particularly limited in cross-sectional shape, such as rectangular, trapezoidal, pipe-like, and can be used in various shapes as necessary.
- the bottom surface of the contact terminal is preferably flat.
- the conductive metal layer 20 formed on the elastic core 10 which is another component of the present invention will be described in detail.
- the conductive metal layer is not particularly limited as long as it can be soldered, but is preferably made of a metal material such as copper, nickel, gold, silver, and tin.
- the metal layer in the present invention refers to a material containing a metal component capable of conducting electricity, and is used as a concept including a metal foil, a metal mesh, and a metal coated film.
- the metal layer 20 is formed by including a film 21 and a metal coating layer 22 formed by coating a metal component on both sides thereof.
- the metal layer 20 of the present invention has a structure in which metal components are coated on both sides, and the metal components on both sides include first and second metal coating layers respectively coated on both sides of the film layer, and the film layer A plurality of holes may be formed in the first and second metal coating layers, and the first and second metal coating layers may be electrically connected to each other through the plurality of hole wall surfaces. Accordingly, the metal layer 20 of the present invention may be energized with the conductive silicone elastic core 10 through the conductive adhesive 30 having electrical conductivity.
- the film 21 is preferably a film having heat resistance
- suitable heat resistant films include polyimide (PI) and polyethylene.
- PEN naphtanate
- PPS polyphenyl solide
- polyimide film has excellent heat resistance, can be bent freely, and can be applied thinly, making it suitable for use in mobile phones, digital cameras, LCDs, and PDP TVs.
- the flame-retardant epoxy adhesive is applied on the flame-retardant film is more preferable in terms of heat resistance.
- the flame retardant epoxy adhesive may be uniformly applied on the flame retardant film in a solid phase.
- the flame-retardant epoxy-based adhesive is adhered to other materials in a thin and uniform coating on the film, and cures when heat is applied to provide adhesion to other materials.
- the conductive silicone elastic core is wrapped in a heat resistant film coated with an epoxy adhesive, and then inserted into a mold similar to the core shape, and then heat is applied at 160 to 180 ° C., thereby curing the epoxy, thereby forming adhesion between the silicone elastic core and the heat resistant film.
- the heat-resistant film may have a space with a diameter ( ⁇ ) of 0.1 to 0.5 mm and form a plurality of holes. These holes may be formed at regular intervals using an ultrasonic method, a laser method, or a perforation method.
- the metal component When the metal component is coated on the heat-resistant film having the holes thus processed, the metal component may be coated on both surfaces of the film as well as the metal component may be coated or filled on the wall surface of the formed hole.
- the heat-resistant film may be energized by the metal coating layer 22 formed in the hole.
- the metal coating layer 22 may be formed of a thin metal coating layer using wet electroplating on the heat resistant film.
- the thickness of the metal coating layer 22 is preferably 1 ⁇ 20 ⁇ m, if the metal foil is too thin, less than 1 ⁇ m not reflow soldering, and if the metal foil is thicker than 20 ⁇ m and the conductivity of the product without particularly improving the formability There is a disadvantage that the elasticity is lowered.
- the base deposition layer of a metal such as copper, nickel, gold, silver, tin, or a base metal layer (or 'under plating layer') is further formed between the heat resistant film 21 and the metal coating layer 22. It is preferable.
- the base metal layer not only lowers the electrical resistance of the metal coating layer 22 that plays a major role in electrical conduction, but also increases the bonding force between the metal coating layer 22 and the heat resistant film 21.
- Such a base metal layer can be formed by a vapor deposition method or a wet electroless plating method. There is no particular limitation on the specific formation method of such a base metal layer.
- the base metal layer formed on the heat resistant film 21 serves to firmly fix the metal coating layer 22 to the film by wet plating, thereby preventing the metal coating layer 22 from being detached and thereby losing the conductivity. Can be.
- the metal coating layer is formed along the wall surface of the hole formed in the film to maintain the current, so that even if a crack occurs in the metal layer due to repeated compression, the wire is broken, the current can be supplied by the self-conducting property of the conductive silicone elastic core.
- the metal layer 20 including the metal coating layer 22 and the heat resistant film 21 is covered by the conductive adhesive 30 and coated on the surface of the conductive silicone elastic core 10.
- the metal layer 20 is bonded to pass through the mold in a state of cutting to the outer surface area of the silicone elastic core, the silicon elastic core bonded to the metal layer 20 passes through an oven having a temperature of 200 ⁇ 300 °C. And harden.
- the elastic core 10 to which the conductive metal layer 20 is coupled may be cut to a predetermined size to manufacture the conductive contact terminal 1 for surface mounting.
- the conductive silicone elastic core 10 to which the conductive heat-resistant film 20 is adhered has one surface (for example, a bottom surface) of the conductive silicone elastic core 10 adhered to the metal foil 40 through the conductive adhesive 30, as shown in FIG. 3.
- the conductive contact terminal 1 for substrate surface mounting can be manufactured. In this way, the conductive contact terminal to which the metal foil is attached increases affinity with the metal (tin-plated copper foil) by the metal foil, thereby improving the adhesion at the time of soldering.
- the metal foil preferably has a thickness of 50 ⁇ m to 200 ⁇ m, but when the thickness of the metal foil is reduced to 50 ⁇ m or less, it is too thin and wrinkles occur during adhesion, so that it is difficult to achieve uniform soldering, resulting in a problem of low adhesive strength. . In addition, when the thickness of the metal foil is thicker than 200 ⁇ m, not only is it difficult to cut at regular intervals, but also a problem arises in that the manufacturing cost increases.
- the conductive elastic core 10 may have a central hole 50 penetrated in the longitudinal direction.
- the formed central hole can be more easily compressed when the elastic core 10 is not formed in the central hole 50 can improve the elastic force of the conductive elastic core 10.
- the volume of the elastic core 10 can be reduced by the volume of the central hole 50, thereby lowering the overall manufacturing cost.
- the central hole 50 may be made in a variety of forms according to the purpose, the formation of the various forms of the central hole 50 is dependent on the various die shapes used in the extrusion of the silicon core, dies of such various shapes By using, you can freely change the shape and size of the central hole.
- the conductive contact terminal 1 for mounting the substrate surface of the present invention may have various cross-sectional shapes according to various cross-sectional shapes of the conductive elastic core 10, and may be shaped as shown in FIG. 5 as necessary. have.
- Silver coated copper powder (Changsung Co., Ltd.) having a particle size of 50 ⁇ m on a silicone rubber having a shore hardness of 30 ° was kneaded (Dispersion Kneader (Fine Machinery)) with 200 parts by weight of copper powder to 100 parts by weight of silicon rubber. Extrusion was carried out at a speed of 1 min, and cured at 250 ° C. in a vertical current collector to obtain a conductive silicone elastic core. The electrical resistance of this cured conductive silicone elastic core was about 10 ⁇ .
- a conductive silicone adhesive (prepared by mixing Dow Corning's silicone adhesive with a metal powder in a mixing ratio of 1: 2) was uniformly applied to the conductive silicone elastic core to a thickness of about 0.1 mm, then punched into ⁇ 0.2 mm, and conductive A copper and tin plated polyimide film (Voice Actor) was wrapped and attached to each other, and cut to a predetermined length to prepare a conductive contact terminal for mounting a substrate surface.
- Example 2 After applying the conductive silicone adhesive used in Example 1 to a thickness of about 50 ⁇ m uniformly to the bottom of the silicon elastic core wrapped with the plated conductive polyimide film of Example 1, a copper foil having a thickness of 200 ⁇ m By cutting to a certain length to prepare a conductive contact terminal for mounting the substrate surface.
- Example 1 Substrate in the same manner as in Example 1 using a silicone rubber having a shore hardness of 40 °, shore hardness 50 °, shore hardness 60 ° , shore hardness 70 °, respectively, in place of the silicone rubber of the shore hardness of 30 ° of Example 1
- a conductive contact terminal for surface mounting was prepared.
- the conductive silicone adhesive used in Example 1 was uniformly applied to the bottom surface of the silicone elastic core wrapped with the conductive polyimide film thus prepared, and then coated with a copper foil having a thickness of 200 ⁇ m and cut to a constant length.
- a conductive contact terminal for substrate surface mounting was prepared.
- a non-conductive elastic core made of only a silicone rubber having a shore hardness of 60 ° which does not exhibit silver because copper powder coated with silver was not introduced.
- the restoring force of the conductive contact terminals for substrate surface mounting prepared in Examples 1 to 6 of the present invention was 32 to 39% at 20% compression. It can be seen that the recovery force was 28 to 32% at 50% compression.
- the non-conductive elastic core is made of silicone rubber having a shore hardness of 65 °, which does not exhibit conductivity, and a non-conductive silicone adhesive composed of only silicone adhesive without metal powder is used.
- a conductive contact terminal for mounting a substrate surface was manufactured.
- the electrical resistance was measured by dividing the case where the breakage of the metal layer did not occur and the case where the breakage of the metal layer occurred, and the results are shown in Table 2 below.
- the conductive contact terminal for mounting the substrate surface according to Examples 1 to 6 of the present invention was found that even if the outer metal layer is broken, its electrical resistance value is low and substantially the electrical conductivity is maintained.
- Example 7 using the non-conductive elastic core uses an electrically conductive adhesive to bond the elastic core and the conductive metal layer, and even if a break occurs in the metal layer, the adhesive layer formed using the electrically conductive adhesive is It was found that the conductive function was still applied to the terminal, thereby maintaining the electrical conductive function of the contact terminal.
- the conductive contact terminals for mounting the surface of the substrate according to the comparative example did not maintain electrical conductivity because the electrical resistance value increased to exceed the measurement range when the outer metal layer was broken.
- the surface resistance which is low in electrical resistance does not deform material even in a high-temperature reflow soldering process, and which does not lose conductivity even when a break occurs in the metal layer which imparts conductivity to the conductive contact terminal.
- Conductive contact terminals can be provided.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Claims (12)
- 기판의 표면에 실장되는 도전성 접촉 단자에 있어서,탄성 코어; 및상기 탄성 코어의 외측을 감싸도록 형성된 금속층; 및상기 탄성 코어와 상기 금속층 사이에 상기 탄성 코어와 상기 금속층을 서로 접착시키는 전도성 접착제층;을 포함하는 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.제1항에 있어서,상기 탄성 코어는 전도성 탄성 코어인 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제1항에 있어서,상기 탄성 코어는 전도성 탄성 코어인 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제1항 또는 제2항에 있어서,상기 탄성 코어의 중앙부에 중앙 홀이 형성되어 있는 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제2항에 있어서,상기 전도성 탄성 코어는 탄성 고무 100중량부를 기준으로 전기전도성 금속분말 20 내지 600 중량부가 배합된 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제4항에 있어서,상기 탄성 고무는 가교된 합성고무, 가교된 천연고무, 또는 실리콘 고무 중의 어느 하나인 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제4항에 있어서,상기 전기전도성 금속분말은 은, 금, 동, 니켈, 니켈-철 합금, 주석, 및 은 코팅된 구리로 이루어진 군에서 선택된 하나 이상인 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제2항에 있어서,상기 전도성 탄성 코어는 전기저항이 0.1Ω 내지 10kΩ인 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제1항 또는 제2항에 있어서,상기 금속층은필름층; 및상기 필름층의 양면에 각각 코팅 형성된 제1 및 제2 금속 코팅층;을 포함하며,상기 필름층에는 복수개의 구멍이 형성되며,상기 제1 및 제2 금속 코팅층은 상기 복수개의 구멍 벽면을 통해 서로 전기적으로 연결되도록 구비된 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제8항에 있어서,상기 구멍의 직경(Φ)이 0.1~0.5mm인 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제8항에 있어서,상기 금속성분은 구리, 니켈, 금, 은 및 주석으로 이루어진 군에서 선택된 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제8항에 있어서,상기 제1 및 제2 금속 코팅층은 1 내지 20㎛의 두께를 갖는 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
- 제1항 또는 제2항에 있어서,상기 접촉단자가 기판 표면과 결합하는 하면에 전도성 접착제로 접착된 금속박을 더 포함하는 것을 특징으로 하는 기판 표면 실장용 도전성 접촉 단자.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10777921.7A EP2434859B1 (en) | 2009-05-18 | 2010-05-17 | Conductive contact terminal to be mounted on a substrate surface |
JP2012511757A JP5286447B2 (ja) | 2009-05-18 | 2010-05-17 | 基板表面実装用導電性接触端子 |
CN2010800220406A CN102428767A (zh) | 2009-05-18 | 2010-05-17 | 用于安装在基板表面的导电性接触端子 |
US13/321,303 US20120118608A1 (en) | 2009-05-18 | 2010-05-17 | Conductive contact terminal for surface mounting on substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090043248A KR101054251B1 (ko) | 2009-05-18 | 2009-05-18 | 기판 표면 실장용 도전성 접촉 단자 |
KR10-2009-0043248 | 2009-05-18 |
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WO2010134734A2 true WO2010134734A2 (ko) | 2010-11-25 |
WO2010134734A3 WO2010134734A3 (ko) | 2011-03-03 |
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PCT/KR2010/003114 WO2010134734A2 (ko) | 2009-05-18 | 2010-05-17 | 기판 표면 실장용 도전성 접촉 단자 |
Country Status (6)
Country | Link |
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US (1) | US20120118608A1 (ko) |
EP (1) | EP2434859B1 (ko) |
JP (1) | JP5286447B2 (ko) |
KR (1) | KR101054251B1 (ko) |
CN (1) | CN102428767A (ko) |
WO (1) | WO2010134734A2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115566451A (zh) * | 2022-12-06 | 2023-01-03 | 深圳市卓汉材料技术有限公司 | 一种接地端子及电子设备 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101131749B1 (ko) * | 2009-08-21 | 2012-04-05 | 두성산업 주식회사 | 기판 표면 실장용 도전성 탄성 접촉 단자 |
KR101084282B1 (ko) | 2011-06-15 | 2011-11-17 | 김선기 | 솔더링이 가능한 탄성 전기접촉단자 |
KR101420368B1 (ko) * | 2012-04-24 | 2014-07-16 | 두성산업 주식회사 | 기판 표면 실장용 도전성 전자파 흡수 접촉단자 |
CN102709768B (zh) * | 2012-05-30 | 2014-08-13 | 深圳市华星光电技术有限公司 | 插座 |
KR101661971B1 (ko) * | 2015-05-15 | 2016-10-04 | 두성산업 주식회사 | 전기접촉단자 및 그 제조 방법 |
US20160336093A1 (en) * | 2015-05-15 | 2016-11-17 | Joinset Co., Ltd. | Elastic electric contact terminal adapted to small size |
CN206619706U (zh) * | 2017-04-14 | 2017-11-07 | 深圳市卓汉材料技术有限公司 | 一种接地弹性件 |
CN109935984B (zh) * | 2017-12-18 | 2021-01-22 | 泰科电子(上海)有限公司 | 弹性导电端子及其制造方法 |
CN108424653A (zh) * | 2018-02-08 | 2018-08-21 | 东莞市雷兹盾电子材料有限公司 | 一种可用于替代金属弹片的smd导电橡胶组合物 |
CN110351943A (zh) * | 2018-04-08 | 2019-10-18 | 莱尔德电子材料(深圳)有限公司 | 表面安装接触件 |
KR101951732B1 (ko) | 2018-08-06 | 2019-03-04 | 두성산업 주식회사 | 측면 접촉이 가능한 기판 표면 실장용 도전성 접촉단자 및 그 제조방법 |
CN112533395B (zh) * | 2020-12-21 | 2021-12-24 | 北京同方信息安全技术股份有限公司 | 印制电路板中埋入电阻的方法及其印制电路板 |
KR102339845B1 (ko) * | 2021-04-28 | 2021-12-16 | 주식회사 메가테크 | 전기 접촉 단자 |
KR102638217B1 (ko) * | 2021-12-09 | 2024-02-20 | 조인셋 주식회사 | 솔더링이 가능한 탄성 전기접촉단자 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200390490Y1 (ko) | 2005-05-02 | 2005-07-21 | 조인셋 주식회사 | 표면 실장용 전기 접촉단자 |
KR100783588B1 (ko) | 2006-11-08 | 2007-12-07 | 조인셋 주식회사 | 솔더링 가능한 탄성 전기접촉단자 |
KR100839893B1 (ko) | 2008-03-07 | 2008-06-19 | 조인셋 주식회사 | 솔더링 가능한 탄성 전기접촉단자 |
KR100892720B1 (ko) | 2008-09-30 | 2009-04-15 | 조인셋 주식회사 | 솔더링이 가능한 탄성 전기접촉단자 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4231901A (en) * | 1978-06-23 | 1980-11-04 | Charleswater Products, Inc. | Electrically conductive foam and method of preparation and use |
US4968854A (en) * | 1988-11-10 | 1990-11-06 | Vanguard Products Corporation | Dual elastomer gasket shield for electronic equipment |
JPH0676876A (ja) * | 1992-08-28 | 1994-03-18 | Bridgestone Corp | 異方導電性コネクター及びその製造方法 |
EP1124890A1 (en) * | 1998-10-22 | 2001-08-22 | Parker-Hannifin Corporation | Intumescent, flame retardant pressure sensitive adhesive composition for emi shielding applications |
JP2002151183A (ja) * | 2000-11-15 | 2002-05-24 | Jsr Corp | 異方導電性シート |
US7105234B2 (en) * | 2001-03-30 | 2006-09-12 | Schlegel Systems, Inc. | Flame retardant corrosive resistant conductive fabric article and method |
WO2003030610A1 (en) * | 2001-10-02 | 2003-04-10 | Parker Hannifin Corporation | Emi shielding gasket construction |
AU2003211368A1 (en) * | 2002-03-07 | 2003-09-16 | Jsr Corporation | Anisotropic conductive connector and its production method, and circuit device test instrument |
JP2004051755A (ja) * | 2002-07-18 | 2004-02-19 | Ricoh Co Ltd | 弾性導電樹脂及び弾性導電接合構造 |
KR100611327B1 (ko) * | 2004-01-20 | 2006-08-11 | 조인셋 주식회사 | 전기 전도성 개스킷 |
US7470866B2 (en) * | 2004-11-18 | 2008-12-30 | Jemic Shielding Technology | Electrically conductive gasket |
KR101318816B1 (ko) * | 2005-02-16 | 2013-10-16 | 파커-한니핀 코포레이션 | 난연성 전자파 간섭 차폐 가스켓 |
KR200394223Y1 (ko) | 2005-05-24 | 2005-09-01 | 조인셋 주식회사 | 압접형 전기 커넥터 |
KR100762854B1 (ko) * | 2006-12-19 | 2007-10-02 | 주식회사 이송이엠씨 | 전자회로기판 표면 실장용 그라운드 폼 가스켓 및 그제조방법 |
MY147054A (en) * | 2008-03-07 | 2012-10-15 | Joinset Co Ltd | Solderable elastic electric contact terminal |
KR20100057421A (ko) * | 2008-11-21 | 2010-05-31 | 주식회사 익스팬 | 솔더링 가능한 개스킷 |
KR101022037B1 (ko) * | 2009-05-21 | 2011-03-16 | 조인셋 주식회사 | 탄성 전기접촉단자 |
KR101131749B1 (ko) * | 2009-08-21 | 2012-04-05 | 두성산업 주식회사 | 기판 표면 실장용 도전성 탄성 접촉 단자 |
-
2009
- 2009-05-18 KR KR1020090043248A patent/KR101054251B1/ko active IP Right Grant
-
2010
- 2010-05-17 EP EP10777921.7A patent/EP2434859B1/en active Active
- 2010-05-17 US US13/321,303 patent/US20120118608A1/en not_active Abandoned
- 2010-05-17 WO PCT/KR2010/003114 patent/WO2010134734A2/ko active Application Filing
- 2010-05-17 CN CN2010800220406A patent/CN102428767A/zh active Pending
- 2010-05-17 JP JP2012511757A patent/JP5286447B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200390490Y1 (ko) | 2005-05-02 | 2005-07-21 | 조인셋 주식회사 | 표면 실장용 전기 접촉단자 |
KR100783588B1 (ko) | 2006-11-08 | 2007-12-07 | 조인셋 주식회사 | 솔더링 가능한 탄성 전기접촉단자 |
KR100839893B1 (ko) | 2008-03-07 | 2008-06-19 | 조인셋 주식회사 | 솔더링 가능한 탄성 전기접촉단자 |
KR100892720B1 (ko) | 2008-09-30 | 2009-04-15 | 조인셋 주식회사 | 솔더링이 가능한 탄성 전기접촉단자 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2434859A4 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115566451A (zh) * | 2022-12-06 | 2023-01-03 | 深圳市卓汉材料技术有限公司 | 一种接地端子及电子设备 |
US11881333B1 (en) | 2022-12-06 | 2024-01-23 | Shenzhen Johan Material Technology Co., Ltd. | Ground terminal and electronic device |
Also Published As
Publication number | Publication date |
---|---|
EP2434859A4 (en) | 2014-10-01 |
US20120118608A1 (en) | 2012-05-17 |
EP2434859B1 (en) | 2016-04-06 |
WO2010134734A3 (ko) | 2011-03-03 |
JP5286447B2 (ja) | 2013-09-11 |
CN102428767A (zh) | 2012-04-25 |
KR101054251B1 (ko) | 2011-08-08 |
JP2012527094A (ja) | 2012-11-01 |
KR20100124148A (ko) | 2010-11-26 |
EP2434859A2 (en) | 2012-03-28 |
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