WO2023019642A1 - 导电组件、导电组件的制备方法及测试装置 - Google Patents

导电组件、导电组件的制备方法及测试装置 Download PDF

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Publication number
WO2023019642A1
WO2023019642A1 PCT/CN2021/115803 CN2021115803W WO2023019642A1 WO 2023019642 A1 WO2023019642 A1 WO 2023019642A1 CN 2021115803 W CN2021115803 W CN 2021115803W WO 2023019642 A1 WO2023019642 A1 WO 2023019642A1
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WIPO (PCT)
Prior art keywords
conductive
carrier
limiting hole
elastic body
conductive elastic
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PCT/CN2021/115803
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English (en)
French (fr)
Inventor
黄东炎
程振
李志雄
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中山市江波龙电子有限公司
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Publication of WO2023019642A1 publication Critical patent/WO2023019642A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted

Definitions

  • the invention relates to the technical field of conductive components, in particular to a conductive component, a method for preparing the conductive component and a testing device.
  • test chip In an integrated circuit (Integrated Circuit, IC) testing process, a test chip needs to be used to test the chip to be tested, and a circuit board needs to be used for connection between the test chip and the chip to be tested.
  • IC Integrated Circuit
  • the test chip and the circuit board do not need to be replaced, only the chip to be tested needs to be replaced continuously.
  • the chip to be tested is placed on the circuit board to form an electrical connection, and then the good electrical contact between the chip to be tested-the circuit board-the test chip is ensured by pressing. Due to the pressing effect, it is generally necessary to arrange an elastic conductor between the circuit board and the test chip to ensure good contact between the test chip and the circuit board and prevent damage caused by hard contact.
  • the existing conductive elastomers are generally fixedly fabricated on an entire panel, and if one of the conductive elastomers is damaged, the entire panel needs to be replaced, resulting in waste of components and increased cost.
  • the present application provides a conductive component, a preparation method and a testing device for the conductive component.
  • the conductive component can solve the problem that if the conductive elastic body of the existing conductive component is damaged, the entire conductive component needs to be replaced, resulting in waste of components and increased cost.
  • the first technical solution adopted by the present application is to provide a conductive component.
  • the conductive component includes a carrier and a conductive elastic body; wherein, the carrier is provided with a number of limiting holes; the conductive elastic body is embedded in the limiting holes and is detachably connected to the carrier; the conductive elastic body can be configured to be electrically connected to the Electronics on either side of a conductive component.
  • the carrier includes a first carrier and a second carrier; the first carrier is provided with a number of first limiting holes; the second carrier is stacked and detachably connected to the first carrier, and the position corresponding to the second carrier and the first limiting hole A second limiting hole is opened; the conductive elastic body is at least partially embedded in the first limiting hole and the second limiting hole.
  • the minimum aperture of the first limiting hole is smaller than the maximum size of the part where the conductive elastomer is embedded in the first limiting hole and the second limiting hole; and/or the minimum aperture of the second limiting hole is smaller than the conductive elastomer.
  • the diameter of the first limiting hole decreases gradually along the direction away from the second limiting hole; and/or, the diameter of the second limiting hole decreases gradually along the direction away from the first limiting hole.
  • the shape of the first limiting hole matches the shape of the part where the conductive elastic body is embedded in the first limiting hole, and is consistent in size; and/or, the second limiting hole and the conductive elastic body are embedded in the second limiting hole.
  • the parts inside the holes are matched in shape and consistent in size.
  • the conductive elastic body is formed by winding a wire-like conductor.
  • the conductive elastic body includes an elastic matrix and a conductive layer, and the conductive layer is arranged on the outer surface of the elastic matrix.
  • the resilience of the conductive elastomer is 5%-75%.
  • the contact resistance of the conductive elastomer is 20 milliohms-800 milliohms.
  • the first carrier and/or the second carrier is an insulating substrate.
  • the second technical solution adopted by the present application is to provide a method for preparing a conductive component.
  • the method includes: providing a carrier; wherein, a plurality of limiting holes are opened on the carrier; a plurality of conductive elastomers are respectively arranged in the plurality of limiting holes to form a conductive component; wherein, a plurality of conductive elastomers are detachably connected to the carrier, And correspond to a plurality of limit holes one by one.
  • the carrier includes a first carrier and a second carrier; the first carrier is provided with a plurality of first limiting holes, and the second carrier is provided with a plurality of second limiting holes; a plurality of conductive elastic bodies are respectively arranged in the plurality of limiting holes
  • the step of forming the conductive assembly specifically includes: arranging a plurality of conductive elastic bodies in a plurality of first limiting holes respectively; wherein, a plurality of conductive elastic bodies are in one-to-one correspondence with a plurality of first limiting holes; stacking the second carrier On one side surface of the first carrier, and make the second limiting hole correspond to the conductive elastic body, so as to cooperate with the first limiting hole to clamp the conductive elastic body between the first carrier and the second carrier.
  • step of arranging a plurality of conductive elastic bodies in the plurality of limiting holes respectively further includes: providing a wire-shaped conductor; winding the wire-shaped conductive body to obtain a conductive elastic body.
  • the method further includes: providing an elastic matrix; forming a conductive layer on the outer surface of the elastic matrix to obtain the conductive elastic body.
  • the third technical solution adopted by the present application is to provide a testing device.
  • the test device includes: a circuit board, a test chip and a conductive component; wherein, one side of the circuit board is used to electrically connect the electronic device to be tested; the test chip is arranged on the other side of the circuit board; the conductive component is arranged between the circuit board and the test chip The space is used to electrically connect the test chip and the circuit board, so as to use the test chip to test the electronic device to be tested.
  • the conductive component, the preparation method and the testing device of the conductive component provided by the application the conductive component is provided with a carrier, and a number of limit holes are opened on the carrier; at the same time, by setting the conductive elastomer, at least part of the conductive elastomer is embedded In the limit hole, and detachably connected with the carrier, so that after the conductive elastomer is damaged, only the conductive elastomer can be replaced by disassembling the conductive elastomer. Compared with the solution of replacing the entire conductive component, it can be greatly improved. cut costs.
  • the conductive elastic body configurable to electrically connect the electronic devices disposed on both sides of the conductive component, it is not only possible to prevent the electronic devices on both sides of the conductive component from being damaged by direct contact, but also to ensure that the electronic devices on both sides of the conductive component are electronic devices are turned on.
  • Fig. 1 is a schematic structural diagram of a testing device provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a conductive component provided by an embodiment of the present application.
  • Fig. 3a is a schematic structural diagram of a conductive component provided by another embodiment of the present application.
  • Fig. 3b is a schematic structural diagram of a conductive component provided in another embodiment of the present application.
  • Fig. 4 is a schematic structural diagram of a first carrier or a second carrier provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural view of the conductive elastomer provided in the first embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a conductive elastomer provided in the second embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a conductive elastomer provided in the third embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a conductive elastomer provided in the fourth embodiment of the present application.
  • FIG. 9 is a schematic structural view of the conductive component provided in the first embodiment of the present application except for the conductive elastomer;
  • Fig. 10 is a schematic structural diagram of the conductive component provided by the second embodiment of the present application except for the conductive elastomer;
  • Fig. 11 is a schematic structural diagram of the conductive component provided by the third embodiment of the present application except for the conductive elastomer;
  • Fig. 12 is a flowchart of a method for preparing a conductive component provided by an embodiment of the present application.
  • FIG. 13 is a subflow chart of step S2 in FIG. 12 provided by an embodiment of the present application.
  • Fig. 14 is a schematic diagram of the product structure after processing in step S21 provided by an embodiment of the present application.
  • FIG. 15 is a schematic diagram of the process of step S22 provided by an embodiment of the present application.
  • first”, “second”, and “third” in this application are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as “first”, “second”, and “third” may explicitly or implicitly include at least one of these features.
  • “plurality” means at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back%) in the embodiments of the present application are only used to explain the relative positional relationship between the various components in a certain posture (as shown in the drawings) , sports conditions, etc., if the specific posture changes, the directional indication also changes accordingly.
  • Fig. 1 is a schematic structural diagram of a testing device provided by an embodiment of the present application; Guarantee product quality.
  • the electronic device to be tested may be an electronic device such as a chip, a semiconductor, or a module.
  • the test device 100 may include a circuit board 20 , a test chip 30 and a conductive component 40 .
  • the circuit board 20 can be a printed circuit board.
  • One side of the circuit board 20 is used to electrically connect electronic devices to be tested.
  • the surface of the circuit board 20 connected to the electronic device to be tested may be provided with a plurality of solder joints, and the electronic device to be tested is electrically connected to the circuit board 20 by connecting to the solder joints.
  • the test chip 30 is disposed on the other side of the circuit board 20 for testing the electronic device to be tested.
  • the conductive component 40 is disposed between the circuit board 20 and the test chip 30 for electrically connecting the test chip 30 and the circuit board 20 so as to use the test chip 30 to test the electronic device to be tested.
  • the conductive component 40 has elasticity, so as to act as a buffer while conducting the circuit board 20 and the test chip 30 , so as to prevent the problem of damage to the test chip 30 caused by the direct contact between the two.
  • Figure 2 is a schematic structural view of a conductive component provided by an embodiment of the present application; in one embodiment, the conductive component 40 includes an insulating plate 11 and a conductive elastic body 12, and the conductive elastic body 12 is embedded in the insulating plate 11 to form a conductive component 40 corresponding to the IC.
  • the conductive elastic body 12 is not only easy to peel off from the insulating plate 11, thereby polluting the IC; and if the conductive elastic body 12 is damaged, the entire conductive assembly 10 needs to be replaced, resulting in waste of components and Increased costs.
  • FIG. 3a is a schematic structural diagram of a conductive component provided in another embodiment of the present application; another conductive component 40 is provided, and the conductive component 40 can be arranged on a test chip 30 and the circuit board 20 are used to conduct the test chip 30 and the circuit board 20, and avoid the problem of damage to the test chip 30 caused by the direct contact between the test chip 30 and the circuit board 20, and play a certain buffering role.
  • the conductive component 40 includes a carrier 4 and a conductive elastic body 43 .
  • the carrier 4 is provided with a plurality of limiting holes 4a, the conductive elastic body 43 is embedded in the limiting hole 4a, and is detachably connected with the carrier 4; after the conductive elastic body 43 is damaged, the conductive elastic body 43 can be removed The body 43 is only replaced by the conductive elastic body 43 , compared with the solution of replacing the entire conductive component 40 , the cost can be greatly reduced.
  • the conductive elastic body 43 can be configured to electrically connect the electronic devices disposed on both sides of the conductive component 40 ; for example, the conductive elastic body 43 can be configured to electrically connect the test chip 30 and the circuit board 20 .
  • the carrier 4 is an insulating board, such as a PCB insulating board, a silicon rubber insulating board, and the like.
  • the carrier 4 has an opposite first surface and a second surface, and the carrier 4 is provided with a number of limiting holes 4a passing through the first surface and the second surface; at least part of the conductive elastic body 43 protrudes from the first surface of the carrier 4 and/or the second surface, so as to be in contact with the electronic devices on both sides of the conductive component 40 to realize electrical connection.
  • limiting holes 4a can be arranged at intervals along the length direction of the carrier 4; .
  • the diameter of the limiting hole 4a may gradually decrease along the direction from the first surface to the second surface.
  • the maximum size of the limiting hole 4 a may not be smaller than the maximum size of the conductive elastic body 43 , so as to facilitate the removal of the conductive elastic body 43 from the carrier 4 , so that only the conductive elastic body 43 can be replaced.
  • the carrier 4 may include a first carrier 41 and a second carrier 42 .
  • Figure 4 is a schematic structural view of the first carrier or the second carrier provided by an embodiment of the present application; the first carrier 41 has opposite first and second surfaces, and the first carrier 41 is provided with a Several first limiting holes 411 on the first surface and the second surface. Several first limiting holes 411 are arranged at intervals along the length direction of the first carrier 41 .
  • the second carrier 42 is stacked with the first carrier 41 and the two are detachably connected to facilitate disassembly of the first carrier 41 and the second carrier 42 .
  • the second carrier 42 has an opposite first surface and a second surface, and the second carrier 42 is provided with a second limiting hole 421 passing through the first surface and the second surface, the shape and size of the second limiting hole 421 It may be the same shape and size as the first limiting hole 411 .
  • the second carrier 42 is covered on the first surface of the first carrier 41, and the two can be detachably connected by snapping or buckling, and the first limit on the first carrier 41
  • the positioning holes 411 are provided in one-to-one correspondence with the second limiting holes 421 on the second carrier 42 .
  • first carrier 41 and/or the second carrier 42 may be insulating boards, such as PCB insulating boards, silicon rubber insulating boards, and the like. It can be understood that, in a specific embodiment, the carrier 4 corresponding to FIG. 3a may be the first carrier 41 or the second carrier 42; Carrier 42.
  • At least part of the conductive elastic body 43 is embedded in the first limiting hole 411 and the second limiting hole 421 .
  • the part of the conductive elastic body 43 protrudes from the surface of the first carrier 41 facing away from the second carrier 42, and/or the part of the conductive elastic body 43 protrudes from the second carrier 42.
  • the carrier 42 faces away from the surface of the first carrier 41 so that the conductive elastomer 43 contacts the test chip 30 and the circuit board 20 to electrically connect the test chip 30 and the circuit board 20 .
  • the conductive elastic body 43 may be a conductive elastic metal body, that is, the material of the conductive elastic body 43 may be metal, such as copper or aluminum.
  • the conductive elastic body 43 has elasticity to play a certain buffering role when the conductive component 40 is disposed between the test chip 30 and the circuit board 20 .
  • the conductive elastic body 43 can be a conductive elastic metal ball, and the first limiting hole 411 and the second limiting hole 421 are both inverted bowl-shaped holes.
  • the conductive elastic body 43 can also be a conductive silicone ball, a conductive elastic metal wire ball, a metal-plated conductive ball, and the like.
  • Fig. 5 is a schematic structural view of the conductive elastomer provided in the first embodiment of the present application
  • Fig. 6 is a schematic structural view of the conductive elastic body provided in the second embodiment of the present application
  • the elastic body 43 is formed by winding a wire conductor 431 .
  • the linear conductor 431 can be a metal wire, such as copper wire or aluminum wire.
  • the conductive elastic body 43 is formed by winding a single metal wire.
  • the conductive elastic body 43 is formed by winding multiple metal wires.
  • Fig. 7 is a schematic structural view of the conductive elastomer provided in the third embodiment of the present application
  • Fig. 8 is a structure of the conductive elastomer provided in the fourth embodiment of the present application Schematic diagram
  • the conductive elastomer 43 includes an elastic base 432 and a conductive layer 433 , and the conductive layer 433 is disposed on the outer surface of the elastic base 432 .
  • the elastic matrix 432 can be an elastic ball core, such as a rubber ball core or a plastic ball core.
  • the conductive layer 433 can be a metal wire wound on the outer surface of the elastic base 432 .
  • the conductive layer 433 can be a metal layer formed on the outer surface of the elastic base 432 by means of electroplating or coating, such as a copper layer or an aluminum layer.
  • the resilience of the conductive elastomer 43 may be 5%-75%. Preferably, the resilience of the conductive elastomer 43 is 5%-35%.
  • the contact resistance of the conductive elastomer can range from 20 milliohms to 800 milliohms. Preferably, the contact resistance of the conductive elastic body 43 is 50 milliohms-200 milliohms.
  • the conductive assembly 40 provided in this embodiment is provided with a first carrier 41, and several first positioning holes 411 are opened on the first carrier 41; at the same time, by setting a second carrier 42, the second carrier 42 is connected to the first carrier. 41 are stacked and detachably connected, and a second limit hole 421 is opened at the position corresponding to the second carrier 42 and the first limit hole 411; in addition, by setting the conductive elastic body 43, at least part of the conductive elastic body 43 is embedded It is arranged in the first limiting hole 411 and the second limiting hole 421, and the conductive elastic body 43 can be configured to electrically connect the electronic devices arranged on both sides of the conductive component 40, so as to not only prevent the The problem that the electronic device is damaged due to the direct contact of the electronic device, and the conduction of the electronic device on both sides of the conductive component 40 can be ensured.
  • the minimum diameter of the first limiting hole 411 is smaller than the maximum size of the part where the conductive elastic body 43 is embedded in the first limiting hole 411 and the second limiting hole 421 ; And/or the minimum aperture of the second limiting hole 421 is less than the maximum size of the part where the conductive elastic body 43 is embedded in the first limiting hole 411 and the second limiting hole 421; to prevent the conductive elastic body 43 from the first The limiting hole 411 and/or the second limiting hole 421 falls, so that the test chip 30 is polluted when the conductive component 40 is disposed between the test chip 30 and the circuit board 20 .
  • the minimum diameters of the first limiting hole 411 and the second limiting hole 421 are smaller than the maximum diameter of the part where the conductive elastic body 43 is embedded in the first limiting hole 411 and the second limiting hole 421. Size, to avoid the problem of conductive elastic body 43 falling.
  • the diameter of the first limiting hole 411 decreases gradually along the direction away from the second limiting hole 421 , and/or the diameter of the second limiting hole 421 moves away from the first limiting hole 411 direction gradually decreases.
  • the diameter of the opening of the first limiting hole 411 away from the second limiting hole 421 is the minimum aperture
  • the diameter of the second limiting hole 421 away from the first limiting hole 411 is Minimum aperture.
  • any position on the inner wall of the first limiting hole 411 and/or the second limiting hole 421 can also be provided with a protrusion, and the aperture at the corresponding position of the protrusion is limited to form the corresponding position.
  • the application does not limit the minimum diameter of the limiting hole, as long as the conductive elastic body 43 can be prevented from falling from the first limiting hole 411 or the second limiting hole 421 .
  • the diameter of the first limiting hole 411 gradually decreases along the direction away from the second limiting hole 421
  • the diameter of the second limiting hole 421 gradually decreases along the direction away from the first limiting hole 411
  • the maximum size of the first limiting hole 411 is consistent with the maximum size of the second limiting hole 421 .
  • the stacking manner of the first carrier 41 and the second carrier 42 is the vertical direction.
  • FIG. 9 is a schematic structural view of the conductive component provided in the first embodiment of the present application except for the conductive elastomer; the vertical direction of the first limiting hole 411 and the second limiting hole 421
  • the cross sections are all in the shape of an inverted bowl.
  • FIG. 10 is a schematic structural view of the conductive component provided in the second embodiment of the present application except for the conductive elastomer;
  • the cross section is funnel-shaped.
  • FIG. 11 is a schematic structural view of the conductive component provided in the third embodiment of the present application except for the conductive elastomer; and/or the diameter of the second limiting hole 421 first remains constant and then gradually decreases along the direction away from the first limiting hole 411 .
  • the vertical sections of the first limiting hole 411 and the second limiting hole 421 may be trapezoidal.
  • the vertical section of the first limiting hole 411 and/or the second limiting hole 421 may also be gourd-shaped, bottle-neck-shaped or the like.
  • the shape of the first limiting hole 411 matches the shape of the part where the conductive elastic body 43 is embedded in the first limiting hole 411, and the size is consistent; and/or, the second limiting hole 421 and the conductive elastic
  • the shape of the part of the body 43 embedded in the second limiting hole 421 is matched, and the size is consistent; this is not only convenient for installation, but also facilitates the clamping of the conductive elastic body 43 by the first limiting hole 411 and the second limiting hole 421 , and prevent the conductive elastic body 43 from rotating in the first limiting hole 411 and the second limiting hole 421 , resulting in poor contact or disconnection between the test chip 30 and the circuit board 20 .
  • the conductive component 40 mentioned above can be manufactured through the following preparation method of the conductive component 40 .
  • FIG. 12 is a flowchart of a method for preparing a conductive component provided by an embodiment of the present application.
  • a method for preparing a conductive component is provided, the method comprising:
  • Step S1 providing a carrier.
  • the carrier 4 can be an insulating board, such as a PCB insulating board, a silicon rubber insulating board, and the like.
  • the carrier 4 has a first surface and a second surface opposite to each other, and a plurality of limiting holes 4a penetrating through the first surface and the second surface are opened on the carrier 4; the specific structure can be referred to the above-mentioned related text description, and will not be repeated here.
  • the carrier 4 may include a first carrier 41 and a second carrier 42 .
  • the specific structures of the first carrier 41 and the second carrier 42 can be referred to FIG. 4 .
  • a plurality of first limiting holes 411 are opened on the first carrier 41
  • a plurality of second limiting holes 421 are opened on the second carrier 42 .
  • the specific structures and functions of the first limiting hole 411 and the second limiting hole 421 refer to the relevant description in the conductive component 40 of the above embodiment, and can achieve the same or similar technical effects, so they will not be repeated here.
  • Step S2 disposing a plurality of conductive elastic bodies in the plurality of limiting holes to form a conductive component.
  • a plurality of conductive elastic bodies 43 are detachably connected to the carrier 4 to facilitate disassembly of the conductive elastic bodies 43, and the plurality of conductive elastic bodies 43 correspond to the plurality of limiting holes 4a one by one.
  • FIG. 13 is a subflow chart of step S2 in FIG. 12 provided by an embodiment of the present application; step S2 specifically includes:
  • Step S21 disposing a plurality of conductive elastic bodies in a plurality of first limiting holes respectively.
  • FIG. 14 is a schematic diagram of a product structure after processing in step S21 provided by an embodiment of the present application.
  • the plurality of conductive elastic bodies 43 are provided in one-to-one correspondence with the plurality of first limiting holes 411 .
  • Step S22 Lay the second carrier on one side surface of the first carrier, and make the second limiting hole correspond to the conductive elastic body, so as to cooperate with the first limiting hole to clamp the conductive elastic body between the first carrier and the first carrier. between the second carrier.
  • FIG. 15 is a schematic diagram of a process of step S22 provided by an embodiment of the present application.
  • the second limiting hole 421 of the second carrier 42 is corresponding to the conductive elastic body 43 and covered on one side surface of the first carrier 41, and fixed, so that the conductive elastic body 43 is fixed on the first carrier 41 and the second Between the carriers 42, specifically, the product structure after step S22 can be specifically referred to in FIG. 3b.
  • the step of preparing the conductive elastic body 43 specifically includes: providing a wire-shaped electrical conductor 431 ; and winding the wire-shaped electrical conductor 431 to obtain the conductive elastic body 43 .
  • the linear conductor 431 can be a single metal wire; or, as shown in FIG. 6 , the linear conductor 431 can be multiple metal wires.
  • the step of preparing the conductive elastic body 43 specifically includes: providing an elastic matrix 432 ; and forming a conductive layer 433 on the outer surface of the elastic matrix 432 to produce the conductive elastic body 43 .
  • a metal wire can be wound on the outer surface of the elastic base 432 to form the conductive layer 433 , or a metal layer can be formed on the outer surface of the elastic base 432 by electroplating or coating.
  • the elastic matrix 432 can be an elastic ball core, such as a rubber ball core or a plastic ball core.
  • This embodiment provides a method for preparing a conductive assembly 40.
  • a method for preparing a conductive assembly 40 by providing a first carrier 41 and a second carrier 42, a plurality of conductive elastic bodies 43 are respectively arranged in a plurality of first limiting holes 411, and a plurality of conductive elastic bodies
  • the body 43 corresponds to a number of first limiting holes 411 one by one; then the second carrier 42 is stacked on one side surface of the first carrier 41, and the second limiting hole 421 is corresponding to the conductive elastic body 43, so as to correspond to the second carrier 42.
  • a limiting hole 411 fits to clamp the conductive elastic body 43 between the first carrier 41 and the second carrier 42 .
  • the conductive assembly 40 made by this method can not only be used to communicate with the electronic devices on both sides, but also can be used to only connect the conductive elastic body 43 by disassembling the first carrier 41 and the second carrier 42 after the conductive elastic body 43 is damaged.
  • the replacement can greatly reduce the cost compared to the solution of replacing the entire conductive component 40 .

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Abstract

一种导电组件（40）、导电组件（40）的制备方法及测试装置（100）。导电组件（40）包括载体（4）以及导电弹性体（43）；其中，载体（4）开设有若干限位孔（4a）；导电弹性体（43）嵌设于限位孔（4a）内，且与载体（4）可拆卸式连接；导电弹性体（43）可被配置为电连接设置于导电组件（40）两侧的电子器件（30、20）。导电组件（40）能够在导电弹性体（43）发生损坏后仅对导电弹性体（43）进行更换，大大降低了成本。

Description

导电组件、导电组件的制备方法及测试装置 【技术领域】
本发明涉及导电组件技术领域，尤其涉及一种导电组件、导电组件的制备方法及测试装置。
【背景技术】
在集成电路(IntegratedCircuit，IC)测试过程中，需要通过测试芯片来对待测试芯片进行测试，在测试芯片和待测试芯片之间需要通过一个电路板进行连接。
在测试过程中，测试芯片和电路板不需要更换，只需要不断地更换待测试芯片即可。在对每一个待测试芯片进行测试时，将待测试芯片放置在电路板上形成电连接，然后通过按压保证待测试芯片-电路板-测试芯片三者之间的良好电接触。由于按压作用，一般需要在电路板和测试芯片之间设置具有弹性的导电体，以保证测试芯片和电路板之间的良好接触并防止硬接触带来的损伤。
但是，现有的导电弹性体一般是固定制作在一整个面板上的，其中某一个导电弹性体损坏，需要对整个面板进行更换，造成器件浪费和成本增加。
【发明内容】
本申请提供一种导电组件、导电组件的制备方法及测试装置，该导电组件能够解决现有导电组件若导电弹性体发生损坏，则需要更换整个导电组件，造成器件浪费和成本增加的问题。
为解决上述技术问题，本申请采用的第一个技术方案是：提供一种导电组件。该导电组件包括载体以及导电弹性体；其中，载体开设有若干限位孔；导电弹性体嵌设于限位孔内，且与载体可拆卸式连接；导电弹性体可被配置为电连接设置于导电组件两侧的电子器件。
其中，载体包括第一载体和第二载体；第一载体开设有若干第一限位孔；第二载体与第一载体层叠且可拆卸连接，且第二载体与第一限位孔对应的位置开设有第二限位孔；导电弹性体至少部分嵌设于第一限位孔和第二限位孔内。
其中，第一限位孔的最小孔径，小于导电弹性体嵌设于第一限位孔和第二限位孔内的部分的最大尺寸；和/或第二限位孔的最小孔径，小于导电弹性体嵌设于第一限位孔和第二限位孔内的部分的最大尺寸。
其中，第一限位孔的孔径沿背离第二限位孔的方向逐渐减小；和/或，第二限位孔的孔径沿背离第一限位孔的方向逐渐减小。
其中，第一限位孔与导电弹性体嵌设于第一限位孔内的部分的形状匹配，且大小一致；和/或，第二限位孔与导电弹性体嵌设于第二限位孔内的部分的形状匹配，且大小一致。
其中，导电弹性体由线状导电体缠绕而成。
其中，导电弹性体包括弹性基体和导电层，导电层设置于弹性基体的外表面。
其中，导电弹性体的回弹性为5％-75％。
其中，导电弹性体的接触电阻为20毫欧-800毫欧。
其中，第一载体和/或第二载体为绝缘基板。
为解决上述技术问题，本申请采用的第二个技术方案是：提供一种导电组件的制备方法。该方法包括：提供载体；其中，载体上开设有若干限位孔；将若干导电弹性体分别设置于若干限位孔内，以形成导电组件；其中，若干导电弹性体与载体可拆卸式连接，且与若干限位孔一一对应。
其中，载体包括第一载体和第二载体；第一载体上开设有若干第一限位孔，第二载体上开设有若干第二限位孔；将若干导电弹性体分别设置于若干限位孔内，以形成导电组件的步骤具体包括；将若干导电弹性体分别设置于若干第一限位孔中；其中，若干导电弹性体与若干第一限位孔一一对应；将第二载体层叠设置于第一载体的一侧表面，并使第二限位孔与导电弹性体对应，以与第一限位孔配合将导电弹性体夹持于第 一载体和第二载体之间。
其中，将若干导电弹性体分别设置于若干限位孔内的步骤之前还包括：提供线状导电体；缠绕线状导电体以制得导电弹性体。
其中，将若干导电弹性体分别设置于若干限位孔内的步骤之前还包括：提供弹性基体；在弹性基体的外表面形成导电层，以制得导电弹性体。
为解决上述技术问题，本申请采用的第三个技术方案是：提供一种测试装置。测试装置包括：电路板、测试芯片以及导电组件；其中，电路板的一侧用于电连接待测试电子器件；测试芯片设置于电路板的另一侧；导电组件设置于电路板和测试芯片之间，用于电连接测试芯片和电路板，以利用测试芯片对待测试电子器件进行测试。
本申请提供的导电组件、导电组件的制备方法及测试装置，该导电组件通过设置载体，并在载体上开设若干限位孔；同时，通过设置导电弹性体，使导电弹性体的至少部分嵌设于限位孔内，并与载体可拆卸式连接，从而在导电弹性体发生损坏后，可通过拆卸导电弹性体以仅对导电弹性体进行更换，相比于更换整个导电组件的方案，能够大大降低成本。另外，通过使导电弹性体可被配置为电连接设置于导电组件两侧的电子器件，不仅能够防止导电组件两侧的电子器件直接接触导致电子器件发生损坏的问题，且能够保证导电组件两侧的电子器件导通。
【附图说明】
图1为本申请一实施例提供的测试装置的结构简图；
图2为本申请一实施例提供的导电组件的结构示意图；
图3a为本申请另一实施例提供的导电组件的结构示意图；
图3b为本申请又一实施例提供的导电组件的结构示意图；
图4为本申请一实施例提供的第一载体或第二载体的结构示意图；
图5为本申请第一实施例提供的导电弹性体的结构示意图；
图6为本申请第二实施例提供的导电弹性体的结构示意图；
图7为本申请第三实施例提供的导电弹性体的结构示意图；
图8为本申请第四实施例提供的导电弹性体的结构示意图；
图9为本申请第一实施例提供的导电组件除导电弹性体外的结构示意图；
图10为本申请第二实施例提供的导电组件除导电弹性体外的结构示意图；
图11为本申请第三实施例提供的导电组件除导电弹性体外的结构示意图；
图12为本申请一实施例提供的导电组件的制备方法的流程图；
图13为本申请一实施例提供的图12中步骤S2的子流程图；
图14为本申请一实施例提供的经步骤S21处理之后的产品结构示意图；
图15为本申请一实施例提供的步骤S22的过程示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出 的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
下面结合附图和实施例对本申请进行详细的说明。
请参阅图1，图1为本申请一实施例提供的测试装置的结构简图；在本实施例中，提供一种测试装置100，该测试装置100可用于对待测试电子器件进行电学测试，以保证产品品质。其中，待测试电子器件可为芯片、半导体、模组等电子器件。其中，如图1所示，该测试装置100可包括电路板20、测试芯片30以及导电组件40。
其中，电路板20可为印制线路板。电路板20的一侧用于电连接待测试电子器件。具体的，电路板20连接待测试电子器件的表面可设置有多个焊点，待测试电子器件通过与焊点连接以实现与电路板20的电连接。
测试芯片30设置于电路板20的另一侧，用于对待测试电子器件进行测试。
导电组件40设置于电路板20和测试芯片30之间，用于电连接测试芯片30和电路板20，以利用测试芯片30对待测试电子器件进行测试。具体的，导电组件40具有弹性，以在导通电路板20和测试芯片30的同时起一定的缓冲作用，防止二者直接接触导致测试芯片30损坏的问题发生。
其中，导电组件40的具体结构与功能可参见以下实施例中关于导电组件40的相关描述。
如图2所示，图2为本申请一实施例提供的导电组件的结构示意图；在一实施例中，导电组件40包括绝缘板11和导电弹性体12，导电弹性体12嵌设于绝缘板11内，以形成与IC对应的导电组件40。然而，该 实施例提供的导电组件40，其导电弹性体12不仅容易从绝缘板11上剥落，从而污染IC；且若导电弹性体12发生损坏，则需要更换整个导电组件10，造成器件浪费和成本增加。
为此，在另一实施例中，如图3a所示，图3a为本申请另一实施例提供的导电组件的结构示意图；提供另一种导电组件40，该导电组件40可设置于测试芯片30和电路板20之间，用于将测试芯片30与电路板20导通，并避免测试芯片30与电路板20直接接触导致测试芯片30损坏的问题发生，起到一定的缓冲作用。
具体的，如图3a所示，导电组件40包括载体4和导电弹性体43。其中，载体4上开设有若干限位孔4a，导电弹性体43嵌设于限位孔4a内，且与载体4可拆卸式连接；以在导电弹性体43发生损坏后，可通过拆卸导电弹性体43以仅对导电弹性体43进行更换，相比于更换整个导电组件40的方案，能够大大降低成本。导电弹性体43可被配置为电连接设置于导电组件40两侧的电子器件；比如导电弹性体43可被配置为电连接设置于测试芯片30和电路板20。
在一实施例中，如图3a所示，载体4为一绝缘板，比如PCB绝缘板、硅橡胶绝缘板等。载体4具有相对的第一表面和第二表面，载体4上开设有贯穿其第一表面和第二表面的若干限位孔4a；导电弹性体43的至少部分凸出于载体4的第一表面和/或第二表面，以便于与导电组件40两侧的电子器件接触从而实现电连接。
具体的，若干限位孔4a可沿载体4的长度方向间隔设置；且限位孔4a的最小尺寸小于导电弹性体43的最大尺寸，以防止导电弹性体43从载体4的一侧表面掉落。具体的，限位孔4a的孔径可沿第一表面朝向第二表面的方向逐渐减小。在该实施例中，限位孔4a的最大尺寸可不小于导电弹性体43的最大尺寸，以便于从载体4上拆卸导电弹性体43，从而实现仅对导电弹性体43进行更换。
在另一实施例中，如图3b所示，图3b为本申请又一实施例提供的导电组件的结构示意图；载体4可包括第一载体41和第二载体42。
如图4所示，图4为本申请一实施例提供的第一载体或第二载体的 结构示意图；第一载体41具有相对的第一表面和第二表面，第一载体41上开设有贯穿第一表面和第二表面的若干第一限位孔411。若干第一限位孔411沿第一载体41的长度方向间隔设置。
第二载体42与第一载体41层叠设置且二者可拆卸式连接，以方便第一载体41和第二载体42拆卸。第二载体42具有相对的第一表面和第二表面，且第二载体42上开设有贯穿其第一表面和第二表面的第二限位孔421，第二限位孔421的形状和大小可与第一限位孔411的形状和大小相同。在一实施例中，第二载体42盖设在第一载体41的第一表面，且二者可通过卡合或卡扣等方式进行可拆卸式连接，且第一载体41上的第一限位孔411与第二载体42上的第二限位孔421一一对应设置。其中，第一载体41和/或第二载体42可为绝缘板，比如PCB绝缘板、硅橡胶绝缘板等。可以理解的是，在具体实施例中，图3a所对应的载体4可为该第一载体41或第二载体42；即本申请所涉及的载体4可包括第一载体41和/或第二载体42。
导电弹性体43的至少部分嵌设于第一限位孔411和第二限位孔421内。在一具体实施例中，如图3b所示，导电弹性体43的部分凸出于第一载体41背离第二载体42的一侧表面，和/或导电弹性体43的部分凸出于第二载体42背离第一载体41的一侧表面，以便于导电弹性体43与测试芯片30和电路板20接触从而将测试芯片30与电路板20电连接。
其中，导电弹性体43可为导电弹性金属体，即，导电弹性体43的材质可为金属，比如，铜或铝。导电弹性体43具有弹性，以在导电组件40设置于测试芯片30与电路板20之间时，起到一定的缓冲作用。在一优选实施例中，导电弹性体43可为导电弹性金属球，第一限位孔411和第二限位孔421均为倒碗形孔。当然，导电弹性体43还可以是导电硅胶球、导电弹性金属丝球、金属镀层导电球等。
在一实施例中，参见图5和图6，图5为本申请第一实施例提供的导电弹性体的结构示意图；图6为本申请第二实施例提供的导电弹性体的结构示意图；导电弹性体43由线状导电体431缠绕而成。其中，线状导电体431可为金属丝，比如铜丝或铝丝。在一具体实施例中，如图 5所示，导电弹性体43由单根金属丝缠绕而成。在另一具体实施例中，如图6所示，导电弹性体43由多根金属丝缠绕而成。
在另一实施例中，参见图7和图8，其中，图7为本申请第三实施例提供的导电弹性体的结构示意图；图8为本申请第四实施例提供的导电弹性体的结构示意图；导电弹性体43包括弹性基体432和导电层433，导电层433设置于弹性基体432的外表面。其中，弹性基体432可为弹性球核，比如橡胶球核或塑胶球核。在一具体实施例中，如图7所示，导电层433可为缠绕于弹性基体432的外表面的金属丝。在另一具体实施例中，如图8所示，导电层433可为采用电镀或涂敷等方式形成于弹性基体432的外表面的金属层；比如铜层或铝层。
其中，导电弹性体43的回弹性可为5％-75％。优选地，导电弹性体43的回弹性为5％-35％。导电弹性体的接触电阻可为20毫欧-800毫欧。优选地，导电弹性体43的接触电阻为50毫欧-200毫欧。
本实施例提供的导电组件40，通过设置第一载体41，并在第一载体41上开设若干第一限位孔411；同时，通过设置第二载体42，将第二载体42与第一载体41层叠且可拆卸式连接，并在第二载体42与第一限位孔411对应的位置开设第二限位孔421；另外，通过设置导电弹性体43，使导电弹性体43的至少部分嵌设于第一限位孔411和第二限位孔421内，且使导电弹性体43可被配置为电连接设置于导电组件40两侧的电子器件，从而不仅能够防止导电组件40两侧的电子器件直接接触导致电子器件发生损坏的问题，且能够保证导电组件40两侧的电子器件导通。另外，通过使第一载体41和第二载体42可拆卸式连接，能够在导电弹性体43发生损坏后，可通过拆卸第一载体41和第二载体42以仅对导电弹性体43进行更换，从而不仅能够实现同一产品的重复测试功能，且相比于更换整个导电组件40的方案，能够大大降低成本。
在一实施例中，如图3b所示，第一限位孔411的最小孔径，小于导电弹性体43嵌设于第一限位孔411和第二限位孔421内的部分的最大尺寸；和/或第二限位孔421的最小孔径，小于导电弹性体43嵌设于第一限位孔411和第二限位孔421内的部分的最大尺寸；以防止导电弹 性体43从第一限位孔411和/或第二限位孔421内掉落，从而在该导电组件40设置于测试芯片30和电路板20之间时导致测试芯片30被污染的问题发生。在一具体实施例中，第一限位孔411和第二限位孔421的最小孔径均小于导电弹性体43嵌设于第一限位孔411和第二限位孔421内的部分的最大尺寸，以避免导电弹性体43掉落的问题发生。
具体的，如图4所示，第一限位孔411的孔径沿背离第二限位孔421的方向逐渐减小，和/或第二限位孔421的孔径沿背离第一限位孔411的方向逐渐减小。可以理解的是，在该具体实施例中，第一限位孔411背离第二限位孔421的孔口的口径为最小孔径，第二限位孔421背离第一限位孔411的孔径为最小孔径。当然，在其它实施例中，第一限位孔411和/或第二限位孔421的内孔壁上的任一位置也可设置有凸起，凸起对应位置处的孔径限定形成该对应限位孔的最小孔径，本申请对此并不加以限制，只要能够防止导电弹性体43从第一限位孔411或第二限位孔421内掉落即可。
在一实施例中，第一限位孔411的孔径沿背离第二限位孔421的方向逐渐减小，且第二限位孔421的孔径沿背离第一限位孔411的方向逐渐减小；且第一限位孔411的最大尺寸与第二限位孔421的最大尺寸一致。以下定义，第一载体41和第二载体42的层叠方式为竖向方向。
在一具体实施例中，如图9所示，图9为本申请第一实施例提供的导电组件除导电弹性体外的结构示意图；第一限位孔411和第二限位孔421的竖向截面均呈倒碗形。在另一具体实施例中，如图10所示，图10为本申请第二实施例提供的导电组件除导电弹性体外的结构示意图；第一限位孔411和第二限位孔421的竖向截面均呈漏斗形。
在另一实施例中，如图11所示，图11为本申请第三实施例提供的导电组件除导电弹性体外的结构示意图；第一限位孔411的孔径沿背离第二限位孔421的方向先保持不变而后逐渐减小；和/或第二限位孔421的孔径沿背离第一限位孔411的方向先保持不变而后逐渐减小。具体的，第一限位孔411和第二限位孔421的竖向截面可呈梯形。当然，在其它实施例中，第一限位孔411和/或第二限位孔421的竖向截面还可以呈葫 芦形、瓶颈形等。
在一实施例中，第一限位孔411与导电弹性体43嵌设于第一限位孔411内的部分的形状匹配，且大小一致；和/或，第二限位孔421与导电弹性体43嵌设于第二限位孔421内的部分的形状匹配，且大小一致；这样不仅便于安装，且便于第一限位孔411和第二限位孔421对导电弹性体43进行夹持，并防止导电弹性体43在第一限位孔411和第二限位孔421内转动，导致测试芯片30与电路板20接触不良或断开连接的问题发生。
具体的，上述所涉及的导电组件40可通过以下关于导电组件40的制备方法所制得。
请参阅图12，图12为本申请一实施例提供的导电组件的制备方法的流程图。在本实施例中，提供一种导电组件的制备方法，该方法包括：
步骤S1：提供载体。
在一实施例中，如图3a所示，载体4可为一绝缘板，比如PCB绝缘板、硅橡胶绝缘板等。载体4具有相对的第一表面和第二表面，载体4上开设有贯穿其第一表面和第二表面的若干限位孔4a；具体结构可参见上述相关文字描述，在此不再赘述。
在另一实施例中，如图3b所示，载体4可包括第一载体41和第二载体42。其中，第一载体41和第二载体42的具体结构可参见图4。第一载体41上开设有若干第一限位孔411，第二载体42上开设有若干第二限位孔421。第一限位孔411和第二限位孔421的具体结构与功能可参见上述实施例导电组件40中的相关描述，且可实现相同或相似的技术效果，在此不再赘述。
步骤S2：将若干导电弹性体分别设置于若干限位孔内，以形成导电组件。
其中，若干导电弹性体43与载体4可拆卸式连接，以便于拆卸导电弹性体43，且若干导电弹性体43与若干限位孔4a一一对应。
在一实施例中，参见图13，图13为本申请一实施例提供的图12中步骤S2的子流程图；步骤S2具体包括：
步骤S21：将若干导电弹性体分别设置于若干第一限位孔中。
参见图14，图14为本申请一实施例提供的经步骤S21处理之后的产品结构示意图。其中，若干导电弹性体43与若干第一限位孔411一一对应设置。
步骤S22：将第二载体层叠设置于第一载体的一侧表面，并使第二限位孔与导电弹性体对应，以与第一限位孔配合将导电弹性体夹持于第一载体和第二载体之间。
具体的，参见图15，图15为本申请一实施例提供的步骤S22的过程示意图。将第二载体42的第二限位孔421与导电弹性体43对应并盖设于第一载体41的一侧表面，并进行固定，以将导电弹性体43固定于第一载体41和第二载体42之间，具体的，经步骤S22处理之后的产品结构具体可参见图3b。
在一实施例中，在步骤S2之前，还包括制备导电弹性体43。在一实施例中，制备导电弹性体43的步骤具体包括：提供线状导电体431；缠绕线状导电体431以制得导电弹性体43。其中，如图5所示，线状导电体431可为单根金属丝；或，如图6所示，线状导电体431可为多根金属丝。在另一具体实施例中，制备导电弹性体43的步骤具体包括：提供弹性基体432；在弹性基体432的外表面形成导电层433，以制得导电弹性体43。具体的，可在弹性基体432的外表面缠绕金属丝以形成导电层433，或在弹性基体432的外表面通过电镀或涂敷的方式形成金属层。其中，弹性基体432可为弹性球核，比如橡胶球核或塑胶球核。
本实施例提供一种导电组件40的制备方法，该方法通过提供第一载体41和第二载体42，将若干导电弹性体43分别设置于若干第一限位孔411中，并使若干导电弹性体43与若干第一限位孔411一一对应；然后将第二载体42层叠设置于第一载体41的一侧表面，并使第二限位孔421与导电弹性体43对应，以与第一限位孔411配合将导电弹性体43夹持于第一载体41和第二载体42之间。该方法制得的导电组件40不仅能够用于连通其两侧的电子器件，且能够在导电弹性体43发生损坏后，可通过拆卸第一载体41和第二载体42以仅对导电弹性体43进 行更换，相比于更换整个导电组件40的方案，能够大大降低成本。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (15)

  1. 一种导电组件，其中，包括：
    载体，开设有若干限位孔；
    导电弹性体，所述导电弹性体嵌设于所述限位孔内，且与所述载体可拆卸式连接；所述导电弹性体可被配置为电连接设置于所述导电组件两侧的电子器件。
  2. 根据权利要求1所述的导电组件，其中，所述载体包括：
    第一载体，开设有若干第一限位孔；
    第二载体，与所述第一载体层叠且可拆卸连接，且所述第二载体与所述第一限位孔对应的位置开设有第二限位孔；
    所述导电弹性体至少部分嵌设于所述第一限位孔和所述第二限位孔内。
  3. 根据权利要求2所述的导电组件，其中，所述第一限位孔的最小孔径，小于所述导电弹性体嵌设于所述第一限位孔和所述第二限位孔内的部分的最大尺寸；和/或
    所述第二限位孔的最小孔径，小于所述导电弹性体嵌设于所述第一限位孔和所述第二限位孔内的部分的最大尺寸。
  4. 根据权利要求3所述的导电组件，其中，所述第一限位孔的孔径沿背离所述第二限位孔的方向逐渐减小；和/或，所述第二限位孔的孔径沿背离所述第一限位孔的方向逐渐减小。
  5. 根据权利要求3所述的导电组件，其中，所述第一限位孔与所述导电弹性体嵌设于所述第一限位孔内的部分的形状匹配，且大小一致；和/或，
    所述第二限位孔与所述导电弹性体嵌设于所述第二限位孔内的部分的形状匹配，且大小一致。
  6. 根据权利要求1所述的导电组件，其中，所述导电弹性体由线状导电体缠绕而成。
  7. 根据权利要求1所述的导电组件，其中，所述导电弹性体包括 弹性基体和导电层，所述导电层设置于所述弹性基体的外表面。
  8. 根据权利要求1所述的导电组件，其中，所述导电弹性体的回弹性为5％-75％。
  9. 根据权利要求1所述的导电组件，其中，所述导电弹性体的接触电阻为20毫欧-800毫欧。
  10. 根据权利要求1所述的导电组件，其中，所述第一载体和/或所述第二载体为绝缘基板。
  11. 一种导电组件的制备方法，其中，包括：
    提供载体；其中，所述载体上开设有若干限位孔；
    将若干导电弹性体分别设置于所述若干限位孔内，以形成导电组件；其中，所述若干导电弹性体与所述载体可拆卸式连接，且与所述若干限位孔一一对应。
  12. 根据权利要求11所述的导电组件的制备方法，其中，所述载体包括第一载体和第二载体；所述第一载体上开设有若干第一限位孔，所述第二载体上开设有若干第二限位孔；
    所述将若干导电弹性体分别设置于所述若干限位孔内，以形成导电组件的步骤具体包括：
    将若干导电弹性体分别设置于所述若干第一限位孔中；其中，所述若干导电弹性体与所述若干第一限位孔一一对应；
    将所述第二载体层叠设置于所述第一载体的一侧表面，并使所述第二限位孔与所述导电弹性体对应，以与所述第一限位孔配合将所述导电弹性体夹持于所述第一载体和所述第二载体之间。
  13. 根据权利要求11所述的导电组件的制备方法，其中，所述将若干导电弹性体分别设置于所述若干限位孔内的步骤之前还包括：
    提供线状导电体；
    缠绕所述线状导电体以制得导电弹性体。
  14. 根据权利要求11所述的导电组件的制备方法，其中，所述将若干导电弹性体分别设置于所述若干限位孔内的步骤之前还包括：
    提供弹性基体；
    在所述弹性基体的外表面形成导电层，以制得导电弹性体。
  15. 一种测试装置，其中，所述测试装置包括：
    电路板，所述电路板的一侧用于电连接待测试电子器件；
    测试芯片，设置于所述电路板的另一侧；
    导电组件，设置于所述电路板和所述测试芯片之间，用于电连接所述测试芯片和所述电路板，以利用所述测试芯片对所述待测试电子器件进行测试。
PCT/CN2021/115803 2021-08-18 2021-08-31 导电组件、导电组件的制备方法及测试装置 WO2023019642A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5427535A (en) * 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
JP2006153529A (ja) * 2004-11-26 2006-06-15 Selcon Technologies Inc 相互接続用器具及びそのための接触用要素
CN2904356Y (zh) * 2006-05-18 2007-05-23 番禺得意精密电子工业有限公司 电连接器
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CN201556742U (zh) * 2009-09-17 2010-08-18 富士康(昆山)电脑接插件有限公司 电连接器
CN112881895A (zh) * 2021-02-07 2021-06-01 荀露 导电组件及测试装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5427535A (en) * 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
JP2006153529A (ja) * 2004-11-26 2006-06-15 Selcon Technologies Inc 相互接続用器具及びそのための接触用要素
CN2904356Y (zh) * 2006-05-18 2007-05-23 番禺得意精密电子工业有限公司 电连接器
CN201160147Y (zh) * 2008-01-05 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器
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