CN108424653A - 一种可用于替代金属弹片的smd导电橡胶组合物 - Google Patents
一种可用于替代金属弹片的smd导电橡胶组合物 Download PDFInfo
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Abstract
一种可用于替代金属弹片的SMD导电橡胶组合物，涉及导电器件领域。本发明一种可用于替代金属弹片的SMD导电橡胶组合物，由导电橡胶、可焊接金属层、导电粘结层组成，导电橡胶为空心结构。SMD导电橡胶组合物可以通过将导电橡胶的原料混炼，和金属层、粘结层共挤硫化后裁切的方式得到。本发明用于替代金属弹片，具有柔软性和高弹性，低应力压缩灵敏度高，加工精度较高的特点。
Description
技术领域
本发明涉及导电器件，特别涉及一种可用于替代金属弹片的SMD导电橡胶组合物。
背景技术
金属铍铜弹片广泛应用于EMI和ESD存在问题的电子设备中，例如屏蔽暗室、机箱盖板、机箱机柜门、PCB板接地等场合。然而，电子设备体积越来越小，电子元件集成度越来越高，铍铜弹片作为金属冲压类电磁屏蔽材料，难以加工成尺寸较小、精度较高的电子元件。
另外，小尺寸金属弹片硬度太大，受外力压缩时灵敏度不够，压缩率小，不能及时导通。
单纯导电橡胶能够提供很好的电接触性能，但无法采用SMT工艺与PCB板有效连接。
发明内容
本发明目的在于提供一种可用于替代金属弹片的SMD导电橡胶组合物，具有硅橡胶的柔软性和高弹性，低应力压缩灵敏度高，可加工成较小的尺寸，而且加工精度较高，具有不高于金属弹片的电阻率。解决了现有技术中金属弹片加工难度大，弹性低从而在使用中影响接触的问题。
为实现上述目的，本发明采用的技术方案是：
一种可用于替代金属弹片的SMD导电橡胶组合物，包括导电橡胶、可焊接金属层、导电粘结层三部分组成，导电橡胶为空心结构,导电橡胶的一侧面上设有可焊接金属层，所述导电橡胶和所述可焊接金属层之间设有导电粘合层。
所述SMD导电橡胶组合物通常可贴装在PCB表面，具有电磁屏蔽功能，体积电阻率为0.001-0.5ohm.cm。
进一步的，导电橡胶层高度1-10mm、宽度2-15mm，可焊接金属层厚度0.01-0.5mm、宽度2-15mm，导电粘结层厚度0.005-0.05mm，宽度2-15mm。
进一步的，所述导电橡胶是由一个曲面和一个平面，以及两个由曲面和平面围成D形截面构成，所述导电粘合层和可焊接金属层仅设置在所述D形导电橡胶的平面上。
所述导电橡胶由导电金属粉填充硅橡胶混炼挤出硫化而成，体积电阻率为0.001-0.5ohm.cm。
进一步的，所述导电橡胶由乙烯基硅橡胶100份、交联剂1-20份、催化剂1-5份，导电金属粉400-1900份组成；其中交联剂为有机过氧化物2,5-二甲基-2,5-二(叔丁基过氧基)己烷，或含氢量在0.1-1.8%的含氢硅油；硅橡胶硫化催化剂为铂金络合物；导电金属粉为银粉、银包铝粉、银包铜粉、银包镍粉中的一种或多种混合物；导电金属粉平均粒径在0.1-100微米。
所述的可焊接金属层为金属铜镀镍薄片、金属铝镀镍薄片、金属铜镀镍再镀锡薄片中的一种，体积电阻率小于0.1ohm.cm。
上述可焊接金属层采用复合金属层，相比金属单层，这种复合金属层不易变形，且具有更低的电阻和更好的焊接性能。
所述的导电粘合层为导电压敏胶层或导电硅橡胶层中的一种，体积电阻率为0.001-0.5ohm.cm。
所述空心结构的中空部分可为圆形、哑铃形、矩形以及其他任意形状。
SMD导电橡胶组合物可以通过以下方法制备：将固体硅橡胶、交联剂、硅橡胶硫化催化剂、导电金属粉在捏合机中捏合4小时，然后在开炼机中混炼20分钟得到导电橡胶混炼胶，导电橡胶混炼胶与导电金属层在精密共挤设备中共挤硫化得到SMD导电橡胶条，裁切后为SMD导电橡胶组合物；或者，
在另一个实施例中，SMD导电橡胶组合物的制备方法为：将固体硅橡胶、硅橡胶交联剂、硅橡胶硫化催化剂、导电金属粉在捏合机中捏合4小时，然后在开炼机中混炼20分钟得到导电橡胶混炼胶，导电橡胶混炼胶在精密挤出机中挤出硫化得到导电橡胶空心条，导电橡胶空心条表面施加一层导电粘合层，然后贴合可焊接金属层，并在170℃硫化1h得到SMD导电橡胶条，裁切后为SMD导电橡胶组合物。
本发明的有益效果在于：
1、SMD导电橡胶组合物中的金属可通过SMT工艺焊接与PCB板牢固结合；
2、SMD导电橡胶组合物具有硅橡胶的柔软性和高弹性，低应力压缩灵敏度高；
3、SMD导电橡胶组合物复合材料可加工成较小的尺寸，而且加工精度较高；
4、SMD导电橡胶组合物导电性能可做到与金属同一水平，二者复合后形成的复合材料具有电性能均一性和可靠性；可经受高低温、湿热老化、盐雾等极端条件的考验，性能不下降。
附图说明
图1为本发明实施例的SMD导电橡胶组合物的结构示意图。
具体实施方式
下面将结合实施例和附图对本发明作更详细的说明。
如图1所示，SMD导电橡胶组合物，由导电橡胶1、导电粘结层2、可焊接金属层3三部分组成，导电橡胶1内部为空心结构，且导电橡胶1具有D形横截面，使导电粘结层2和可焊接金属层3贴在D形橡胶的平面上。这样的设计便于导电橡胶组合物的安装，并且可以使导电橡胶在很小的外界应力下产生大幅度的变形，有效防止了SMD因弹性不足而导致的使用中接触不良的问题。
SMD导电橡胶组合物的具体按照如下实施例制备。
实施例一
东爵乙烯基硅橡胶110-5S 100份、平均粒径D50=40um的银包镍粉600份在捏合机中捏合4小时，加入2,5-二甲基-2,5-二(叔丁基过氧基)己烷5份，然后在开炼机中混炼20分钟得到导电橡胶混炼胶，导电橡胶混炼胶与宽度2mm, 厚度0.01mm的导电金属镍层在精密共挤设备中经过模具共挤复合，设置挤出硫化温度235℃，得到SMD导电复合橡胶条高度为1.5mm,宽度为2.5mm，裁切造粒成长度为1mm的颗粒，该SMD导电橡胶组合物颗粒的最终尺寸为2.5*1.5*1mm。SMD导电橡胶组合物的表面电阻0.35Ω,从1.5mm压缩到0.7mm的电阻为0.065Ω。在回流焊工艺中，SMD导电橡胶组合物颗粒中的金属镍层可与PCB板上的镍或铜焊点焊接固定。与金属铍铜簧片相比，压缩0.5mm时，SMD导电橡胶颗粒只需4N，而铍铜弹片需要13N的力，可见SMD导电橡胶组合物颗粒所需的压缩应力更小，压缩灵敏度更高。
实施例二
东爵乙烯基硅橡胶110-5S 100份、恒业成含氢量硅油含氢量0.7%的硅油7份，平均粒径D50=40um的银包铝粉800份在捏合机中捏合4小时，加入深圳科骏驰铂金催化剂PT100000.5份，然后在开炼机中混炼20分钟得到导电橡胶混炼胶。导电橡胶混炼胶与宽度8.2mm,厚度0.3mm铜镀镍再镀锡箔金属薄片在精密共挤设备中经过模具进行共挤复合，设置硫化温度200℃，硫化得到SMD导电复合橡胶条高度为1.8mm,宽度为2.2mm，裁切造粒成长度为1mm的颗粒，该SMD导电橡胶组合物颗粒的最终尺寸为2.2*1.8*1mm。SMD导电橡胶组合物的表面电阻0.30Ω,从1.8mm压缩到0.7mm的电阻为0.050Ω。在回流焊工艺中，SMD导电橡胶组合物颗粒中的表面有机金属锡层可与PCB板上的镍或铜焊点焊接固定。与金属铍铜簧片相比，同时压缩0.5mm时 SMD导电橡胶颗粒只需6N，而铍铜弹片需要15N的力，可见SMD导电橡胶组合物颗粒所需的压缩应力更小，压缩灵敏度更高。
实施例三
东爵乙烯基硅橡胶110-5S 100份、平均粒径D50=40um的银包镍粉840份在捏合机中捏合4小时，加入2,5-二甲基-2,5-二(叔丁基过氧基)己烷5份，然后在开炼机中混炼20分钟得到导电橡胶混炼胶，导电橡胶混炼胶通过模具在精密挤出机中挤出宽度未2.0mm,高度为1.4mm的空心导电橡胶条，在空心导电橡胶条底面施加0.05mm厚的导电双面粘合胶层，再贴合宽度为15.0mm 厚度为0.5mm的铜镀镍箔，放入高温烘箱中170℃/1h，裁切造粒成长度为1mm的颗粒。该SMD导电橡胶组合物颗粒的最终尺寸为2.0*1.5*1mm。SMD导电橡胶组合物的表面电阻0.32Ω,从1.5mm压缩到0.7mm的电阻为0.045Ω 。在回流焊工艺中，SMD导电橡胶组合物颗粒中的表面镍层可与PCB板上的镍或铜焊点焊接固定。与金属铍铜簧片相比，同时压缩0.5mm时 SMD导电橡胶颗粒只需9N，而铍铜弹片需要13N的力，可见SMD导电橡胶组合物颗粒所需的压缩应力更小，压缩灵敏度更高。
以上所述的实施例仅仅是对本发明的优选实施方式进行描述，并非对本发明的范围进行限定，在不脱离本发明设计精神的前提下，本领域普通技术人员对本发明的技术方案作出的各种变形和改进，均应落入本发明权利要求书确定的保护范围内。
Claims (12)
1.一种可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，由导电橡胶层、可焊接金属层、导电粘结层三部分组成，所述导电橡胶为空心结构,导电橡胶的一侧面上设有可焊接金属层，所述导电橡胶和所述可焊接金属层之间设有导电粘合层。
2.根据权利要求1所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述导电橡胶层高度为1-10mm、宽度为2-15mm。
3.根据权利要求1所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述可焊接金属层厚度为0.01-0.5mm、宽度为2-15mm。
4.根据权利要求1所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述导电粘结层厚度为0.005-0.05mm，宽度为2-15mm。
5.根据权利要求2所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述导电橡胶是由一个曲面和一个平面，以及两个由曲面和平面围成D形截面构成，所述导电粘合层和可焊接金属层仅设置在所述D形导电橡胶的平面上。
6.根据权利要求1所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述导电橡胶由导电金属粉填充的硅橡胶混炼挤出硫化而成。
7.根据权利要求1-6任一所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述导电橡胶由乙烯基硅橡胶100份、交联剂1-20份、硅橡胶硫化催化剂1-5份，导电金属粉400-1900份组成；所述交联剂为有机过氧化物2,5-二甲基-2,5-二(叔丁基过氧基)己烷，或含氢量在0.1-1.8%的含氢硅油；所述硅橡胶硫化催化剂为铂金络合物；所述导电金属粉为银粉、银包铝粉、银包铜粉、银包镍粉中的一种或多种混合物，导电金属粉平均粒径在0.1-100微米。
8.根据权利要求1-6任一所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述可焊接金属层为金属铜镀镍薄片、金属铝镀镍薄片、金属铜镀镍再镀锡薄片中的一种。
9.根据权利要求1所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述导电粘合层为导电压敏胶层或导电硅橡胶层中的一种，体积电阻率为0.001-0.5ohm.cm。
10.根据权利要求1所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述的导电橡胶体积电阻率为0.001-0.5ohm.cm。
11.根据权利要求1或6所述的可用于替代金属弹片的SMD导电橡胶组合物，其特征在于，所述空心结构的中空部分可为圆形、哑铃形、矩形。
12.一种权利要求1-11任一所述的可用于替代金属弹片的SMD导电橡胶组合物的制备方法，其特征在于，将固体硅橡胶、交联剂、硅橡胶硫化催化剂、导电金属粉在捏合机中捏合4小时，然后在开炼机中混炼20分钟得到导电橡胶混炼胶，导电橡胶混炼胶与导电金属层在精密共挤设备中共挤硫化得到SMD导电橡胶条，硫化温度为200-235oC，裁切后得到SMD导电橡胶组合物；或者，
将固体硅橡胶、硅橡胶交联剂、硅橡胶硫化催化剂、导电金属粉在捏合机中捏合4小时，然后在开炼机中混炼20分钟得到导电橡胶混炼胶，导电橡胶混炼胶在精密挤出机中挤出得到导电橡胶空心条，导电橡胶空心条表面施加一层导电粘合层，然后贴合可焊接金属层，并在170℃硫化1h得到SMD导电橡胶条，裁切后得到SMD导电橡胶组合物。
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110016230A (zh) * | 2019-03-27 | 2019-07-16 | 深圳市腾顺电子材料有限公司 | 一种可焊性导电橡胶及其制备方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090008431A1 (en) * | 2007-07-03 | 2009-01-08 | Kossi Zonvide | Solderable EMI Gasket and Grounding Pad |
| CN102428767A (zh) * | 2009-05-18 | 2012-04-25 | 斗星产业株式会社 | 用于安装在基板表面的导电性接触端子 |
| CN103069655A (zh) * | 2010-08-27 | 2013-04-24 | 富士高分子工业株式会社 | 导电性橡胶部件及其组装方法 |
| CN105131612A (zh) * | 2015-09-25 | 2015-12-09 | 深圳市博恩实业有限公司 | 自粘性导电硅橡胶电磁屏蔽材料 |
| CN105390850A (zh) * | 2014-08-22 | 2016-03-09 | 卓英社有限公司 | 能够实现借助于回流焊的表面贴装的囊型电接触端子 |
| CN106159492A (zh) * | 2015-05-15 | 2016-11-23 | 卓英社有限公司 | 适于小尺寸的弹性电接触端子 |
-
2018
- 2018-02-08 CN CN201810128773.6A patent/CN108424653A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090008431A1 (en) * | 2007-07-03 | 2009-01-08 | Kossi Zonvide | Solderable EMI Gasket and Grounding Pad |
| CN102428767A (zh) * | 2009-05-18 | 2012-04-25 | 斗星产业株式会社 | 用于安装在基板表面的导电性接触端子 |
| CN103069655A (zh) * | 2010-08-27 | 2013-04-24 | 富士高分子工业株式会社 | 导电性橡胶部件及其组装方法 |
| CN105390850A (zh) * | 2014-08-22 | 2016-03-09 | 卓英社有限公司 | 能够实现借助于回流焊的表面贴装的囊型电接触端子 |
| CN106159492A (zh) * | 2015-05-15 | 2016-11-23 | 卓英社有限公司 | 适于小尺寸的弹性电接触端子 |
| CN105131612A (zh) * | 2015-09-25 | 2015-12-09 | 深圳市博恩实业有限公司 | 自粘性导电硅橡胶电磁屏蔽材料 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110016230A (zh) * | 2019-03-27 | 2019-07-16 | 深圳市腾顺电子材料有限公司 | 一种可焊性导电橡胶及其制备方法 |
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