200810869 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種錫膏的結構及使用該錫膏進行熱壓焊接 的方^且特別是«於-種具有切體及使職錫膏進 行熱壓焊接的方法。 【先前技術】 纽喊雜、，資辦代正帶領著我們走向科技時尚新 产口同％’隨者通讯産品的日新月異，帶動了消費性電子 =的狀’使得個人電腦’個人通_統，數位電子通訊等産 二在王球的鎖售量年年增加。因此，在電路板上整合不 件對所製造的電子産品而言更加重要。 " 子産4義軌産品減輕薄短小1魏，高可靠度 化的趨勢發展，在電子産品的電路 ^、-貝 拥两』， 4也必_積體整合化邁進。 (Ρ1^ ^200810869 IX. Description of the Invention: [Technical Field] The present invention relates to a structure of a solder paste and a method of hot-press welding using the solder paste, and in particular, the invention has a body and a tin A method in which a paste is subjected to hot press welding. [Previous technology] Newcomers, and the agent is leading us to the new production of technology and fashion. With the rapid development of the %' wireless communication products, the consumer electronics = the shape of the personal computer. The number of sales of digital electronic communication and other products in Wangqi has increased year by year. Therefore, integration on the board is even more important for the electronics being manufactured. " Sub-production 4 rail products to reduce thin and small 1 Wei, the trend of high reliability, in the circuit of electronic products ^, -Bei two", 4 must also integrate integration. (Ρ1^ ^
^叫 FPC)、電路板（胸edCircuitB 的焊接以實現彼此間的機械及電性連接，埶壓機= 脈衝式兩種。然，盔論是恆、、θ 4 成匣/皿式和 的主要㈣Γ 衝式熱壓機，影響製程品質 通過疋溫度、壓力、加熱時間這三項。熱壓機均係 的接合，然二显:壓_膏!實現上下預焊接之兩個介面 定。對熱顯’上了騎面#錫膏完成固 達到與介面完全=2=Γ3制抽目的：1.要讓锡膏 的強度；3錫^子又S縣—臨界值’使錫層有足夠 锡丹不可組出過多，以免與臨近線路形成短路。 200810869 熱壓機進行熱壓時，將於壓頭上設定特定溫度、壓力與工作 %間。μ度通常要高於錫膏的嫁點，太低的溫度無法使錫膏與介 面7G全接觸。然而，過高的溫度會使錫膏流動性過大、引起錫膏 溢流而形成短路。 另，熱壓機將根據多次實驗的最佳狀況設定一最適壓力值， 然壓力過低時，錫膏與介面無法有效接觸。壓力過高時，錫膏容 易溢流、錫層厚度降低。 再’熱Μ機祕根據多次實驗的最佳狀況設定—最適時間 值，右日守間過短錫貧尚未錄化，未與介面形成良好接觸，將可 形成斷路。 由於熱壓機功時，時間，勤，溫度的設定偏差將可能導 致錫扣流引起短路，或者未形成良好連接介面，接觸不良。 的焊墊也雜近触上與各電子料端子對應 接造成短路縣的_紐轉錫彼此連 【發明内容】 ====:—種可減低繼流的錫膏。 法。 的故供一種可減低錫膏溢流的熱壓焊接方 構，此結構係其_粉， 牙體’錢擇體’該錫粉及該助焊劑以—定比 200810869 例均勻混合。 一在本發膏的-雛實施财，上述之支撐體㈣之溫度 间於賴鱗化之溫度，較佳者，該支撐體至少能夠耐⑽攝氏 度以上高溫。 =發=錫膏的又-較佳實施射，上述之支撐體具有一定 的見度或冋度，魏度或高度根據壓合後欲實現之騎厚度設定。 本發明又提出-種熱壓焊接方法，該方法包括：步驟丨：提供 一熱壓裝置，該熱壓機具有承載體，及—步驟2:提供預進 饤熱壓焊接之二功，設置於·壓裝置之承載體上並定位；步 =塗佈料及-支龍於轉之焊接介面，該料_粉與 知別’錢撐_可轉先與賴#混合後使用，亦可以先後 ，佈於工件之焊接介面’其中該支撐體，該錫粉及該助焊劑以一 疋比例均勻混合；步驟4: 熱壓機之壓頭熱壓該二轉之 介面’辄騎接合焊齡面，射·f之支撐駐撐於 接介面間。 汗 、在本發明熱壓焊接方#的一較隹實施例中，該熱壓焊接 :::=7冷卻步驟，即冷卻二工件之二焊接介面，凝固錫膏， * 鴨讀熱壓焊接方法通過_具有支撐體的錫膏提供 一芽、’㈢之工間，以實現錫膏在鎔化後，受到壓頭的壓力 按=能在兩焊齡蚊間轉—侧定的駿，以容財稽體^ 此=間存留。藉此該域體可以大幅減低溫度、壓力和時間的交 互〜響’即可以減低溫度過高_膏鶴性、聽錫膏溢流而形 200810869 成短路；也可以減低時間過長或壓力過高時錫膏容易溢流，防止 、只、1厚度降低。故’本發明錫膏於熱壓焊接過程中，可降低錫膏 _還象，防止焊侧彼此雜，較祕 訊時代對積體整合化的要求。 付口貝 為讓本發明之上述和其他目的、特徵和優點能更明顯易懂， 下文特舉較佳實施例，作詳細說明如下。 【實施方式】 由於溫度、時間、壓力這三者_都對熱壓後的品質有重要 =影響’三個參數彼此又有交互侧，要得良好的製程品質，通 :要借助Design Of Experiment (D〇E)之類的實驗計晝法以 夕次的實驗，取得三個參數間最佳的搭配。 不贫明第 7月巴孩鯓粉，助焊劑及一支撐體。其 ^該錫粉之成分係為錫金屬或係選自下列群組中之至少兩触 =以上所組成之合金：錫、銀、銅 :二錯=該糊包括… 二ί ’雜θ用於成形成保護膜增純度。該化學溶劑用於 刀化學物，於預熱過程中蒸發控制點度及流動性。該催化巧用 =除氧化物’用於分解金屬表面氧化物促進溫馳用。棘加 =於控制錫作定性，度。該支稽m—條狀物或係一 固恶粒子，如：玻猶、金屬球、工程轉轉等。該 耐之溫度高於該錫健化之溫度，較佳者 二 ；；〇攝氏度以上的高溫，其具有-特糾大小 小根縣合後欲貫現之錫實厚度設定，即該固態粒子略大於該 200810869 欲實現之錫膏厚度，且其大小Λ 門六切# , 疋洋丨生Μ各納鎔化錫膏在此空 二==Γ可以大幅減低溫度、屋力和時間的交互影 曰PM減低4過高時财流雜 路，·也可以減低時間過長缝力^士^賴“績而形成短 厚度降低。 力過_錫找易溢流，防止錫層 "亥支雜可以通過各翻方式形成於料巾，如：合 時，可以通過摻雜的方式將固態粒子摻雜^勾二 ===焊劑之中；當該支撐體為—條狀物，其可以通過塗 與助焊齊II的錫卷與助焊劑後，將條狀物散佈於均勻混合的錫粉 下步ί發明第二實施方式熱壓焊接方法，該熱壓焊接方法包括以 二驟〜提t、賴衫，鋪壓裝置可以是—妓式熱壓機 n _式熱壓機’該熱壓機具有二承載體，—壓頭及一冷卻 教壓二預進行熱壓焊接之工件，分別設置該二工件於 …衣置之一承载體並進行相對定位； ’纟跑少-支碰 劑，較佳者，42==内，其中該錫骨包括錫粉與助焊 文按體叮以預先以_定比例混合於錫膏及助焊劑 200810869 之中。錢樓體係-條狀物或係—固態粒子，如：玻璃球、金 t、Γ程邮球料。該支撐體能耐之溫度高於該錫粉錄化之溫 樹轉’該支舰至少能細⑽贱度以上的高溫，其具 k的；M、（⑥度或寬度）’該大小根據壓合後 厚度設定，即顧錄子略大於該財狀料厚度，且&= m 可根據固態粒子的不同材料之彈性形變能力進行調整。 二料田:支撐體為固‘錄子時’可以通過摻雜的方式將固態粒 入均勻混合的錫粉與助桿劑；#該支碰為—條狀物，其 :佈均勻此合的錫粉與助焊劑後，將條狀物散佈於均 习 合的錫粉與助焊劑上； 步驟4 :熱麗；移動熱壓機之_於二工件上，通過一定時間 的加:加細晰以實現二工件上下之兩個焊接介面的接合，· 乂驟5 m去贿機之_，财冷卻裝置冷卻二工件 介面’凝_膏’二工件之上下二焊接介 成機械及電性連接。 只〜 本發日滕_接方法通過獅支撐翻以支撐錫膏之空 曰’以實現錫貧在雜後，受到_ ΓΓ，轉—㈣㈣，咖親== =耻’狀體可㈣歧諸財巾，村w直接設置於執 ==頭賴合範_，料以實施。該續料以大幅 、4力和時_交互鱗，柯以減低溫度過 流而形成短路；也可以減低時間過長或壓力 阿寸錫胃谷易礙流，防止錫層厚度降低。 200810869 籍由本月提i、之錫賞或熱壓方法，該熱壓機的壓力設定， 、要大於g l秘力’足以將兩介面與此支撐體完全接觸即 可’過高的壓力也不會影響支撐體替騎維持的空間。 且4熱錢於工作時之時間的設定，只要大於某一臨界時 間，足以讓錫膏充分流_欲接合個介面即可，過長的時間， 也不會因為壓頭的壓力導致錫膏溢流而短路。溫度設定要高麟 t並使財足域介岭全_即可，過高的溫度亦不會造成 姐、卢本么膝纟、之錫胃或麵焊接方法可以應用於FPC與FPC的 口《者於FPC與Ρ<：Β的錫焊接合等電性元件之電性及機 t連接’闕用本發明之摻較撐體的錫f，可㈣料 進行元件與PCB之間的接合。 ' =所述，在本發明料及鍾焊接方法通 =:提供支崎之空間，以實現錫膏在魏後，受到= 支按體^在兩焊接介面之間維持一個固定的高度，以 谷納録化騎在此空間存留'。藉此該支撐體可以大幅減=声 交互影響，即可以減低溫度過高時錫膏流動^避 娜成短路；也可以減辦__力過高時錫Ϊ 接降低。故’本發明錫膏及熱壓焊接^ 避錫膏溢流現象，防止焊錫間彼此連接， 丑現象的發生，符合資訊時代對積體整合化的要求。 軸本㈣已啸佳實關鑛如上，财並_以限定 X壬何4習此技蟄者，在不脫離本發明之精神和範圍 g § -11 - 200810869 可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請 專利範圍所界定者為準。 【圖式簡單說明】 無 【主要元件符號說明】 無 -12-^called FPC), circuit board (braid edCircuitB welding to achieve mechanical and electrical connection between each other, rolling machine = pulse type two. However, the helmet theory is constant, θ 4 into 匣 / dish and the main (4) 冲 Pressing hot press, affecting the process quality through the three conditions of temperature, pressure and heating time. The hot press is the joint of the press, but the second display: pressure _ cream! to achieve the two interfaces of the upper and lower pre-welding. Show 'on the riding surface # solder paste finished solid and interface completely = 2 = Γ 3 system purpose: 1. To make the strength of the solder paste; 3 tin ^ and S county - critical value 'to make the tin layer enough Sidan Do not set too much to avoid short circuit with adjacent lines. 200810869 When the hot press is hot pressed, the specific temperature, pressure and working % will be set on the indenter. The μ degree is usually higher than the solder paste, too low. The temperature does not allow the solder paste to be in full contact with the interface 7G. However, too high a temperature causes the solder paste to be too fluid, causing the solder paste to overflow and form a short circuit. In addition, the hot press will set one according to the optimal condition of multiple experiments. The optimum pressure value, when the pressure is too low, the solder paste and the interface cannot be in effective contact. When the force is too high, the solder paste is easy to overflow and the thickness of the tin layer is reduced. Then the 'hot Μ machine secret is set according to the best condition of many experiments—the optimum time value, the right day is too short, the tin is poor, not recorded, not with If the interface forms a good contact, an open circuit will be formed. Due to the work of the hot press, the setting deviation of time, frequency and temperature may cause a short circuit caused by the tin buckle flow, or a good connection interface is not formed, and the contact is poor. Touching the corresponding terminals of the electronic materials, causing the short-circuit county to be connected to each other. [Inventive content] ====: A kind of solder paste that can reduce the flow of the relay. Therefore, it can reduce the overflow of solder paste. The hot-pressed welded square structure, the structure is the powder, the tooth body 'money body', the tin powder and the flux are uniformly mixed with the ratio of 200810869. One of the hair creams of the hair cream, the above-mentioned The temperature of the support (4) is between the temperature of the scale, and preferably, the support is at least capable of withstanding a high temperature of (10) degrees Celsius or higher. = Hair = solder paste - preferably, the support has a certain degree of visibility Or twist, Wei Du or height according to the pressure after pressing The invention also proposes a hot-press welding method, the method comprising: step 丨: providing a hot pressing device, the hot pressing machine has a carrier, and - step 2: providing pre-injection hot-press welding The second work is set on the carrier of the pressure device and positioned; step = coating material and - the dragon is transferred to the welding interface, the material _ powder and the knowing 'money support _ can be transferred to the first with Lai #, Alternatively, it may be disposed on the welding interface of the workpiece, wherein the support body, the tin powder and the flux are uniformly mixed at a ratio; step 4: the pressure head of the hot press heat-presses the two-turn interface '辄骑 welding The age surface, the support of the radiation f is supported between the interface surfaces. Khan, in a comparative embodiment of the hot press welding method of the present invention, the hot press welding:::=7 cooling step, that is, cooling the two workpieces 2. Welding interface, solidified solder paste, * Duck reading hot-press welding method provides a bud, '(3) work room through the solder paste with support body, to achieve the pressure of the pressure head after the solder paste is deuterated. In the two welding ages of mosquitoes - the side of the set of Jun, to Rongcai Ji body ^ this = between the retention. Thereby, the domain body can greatly reduce the interaction of temperature, pressure and time~ can reduce the temperature too high _ cream crane, listen to solder paste overflow and shape 200810869 into a short circuit; can also reduce the time is too long or the pressure is too high When the solder paste is easy to overflow, it prevents, and only 1 thickness is reduced. Therefore, the solder paste of the present invention can reduce the solder paste during the hot press welding process, and also prevents the solder side from being mixed with each other, which is a requirement for integration of the integrated body in the secret era. The above and other objects, features, and advantages of the present invention will become more apparent and understood by the appended claims. [Embodiment] Since temperature, time, and pressure are all important to the quality after hot pressing, the influence of the three parameters on each other has a good process quality, and it is necessary to use Design Of Experiment ( The experimental calculation method such as D〇E) obtains the best match between the three parameters in the experiment of the evening. Not poor in the 7th month of Ba baby powder, flux and a support. The composition of the tin powder is tin metal or an alloy consisting of at least two touches of the following groups: tin, silver, copper: two faults = the paste includes... Forming a protective film to increase purity. This chemical solvent is used in knife chemicals to evaporate control points and fluidity during preheating. This catalysis is used to decompose the oxides on the metal surface to promote the temperature relaxation. Thorny plus = control the tin for qualitative, degree. The branch is a m-bar or a solid particle, such as: glass, metal ball, engineering rotation, etc. The temperature of the resistance is higher than the temperature of the tin-sensitization, preferably the second; the high temperature above the 〇Celsic degree, which has the thickness of the tin-solid thickness of the small roots and the county, that is, the solid particles are slightly It is larger than the thickness of the solder paste to be realized in 200810869, and its size is Λ门六切# , 疋洋丨生Μ 镕 镕 镕 = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = When the PM is reduced by 4, the financial flow is too high, and the time can be reduced. The sewing force is reduced. The short thickness is reduced. The force is over _ tin to find the overflow, and the tin layer can be prevented. Formed in the towel by the turning method, for example, the solid particles can be doped by doping in the manner of doping 2 === flux; when the support is a strip, it can be coated After soldering the tin coil and the flux, the strip is dispersed in the uniformly mixed tin powder. In the second embodiment, the hot press welding method comprises the following steps: The shirt, the pressing device can be a 妓 type hot press n _ type hot press 'the hot press has two carriers , - the indenter and a cooling teaching pressure two pre-heat-welded workpieces, respectively, the two workpieces are placed on one of the carrier and relative positioning; '纟 - less - the impact agent, preferably, 42 In the ==, the tin bone includes the tin powder and the flux-welding body to be pre-mixed in a predetermined ratio between the solder paste and the flux 200810869. The money building system - strips or systems - solid particles, such as: Glass ball, gold t, Γ程邮球料. The support can withstand higher temperatures than the tin powder recorded in the temperature tree turn 'the ship can at least fine (10) above the high temperature, with k; M, (6 degrees or width) 'This size is set according to the thickness after pressing, that is, the record is slightly larger than the thickness of the grain, and &= m can be adjusted according to the elastic deformation ability of different materials of the solid particles. When the support is solid, the solid particles can be mixed into the uniformly mixed tin powder and the rod-forming agent by doping; #其支为为条状, the cloth: uniform the tin powder and After the flux, spread the strips on the tin powder and flux that are all used; Step 4: Warm; Move Pressing on the two workpieces, through a certain period of time: adding fineness to achieve the joining of the two welding interfaces above and below the two workpieces, · 5 m to the bribe machine, the cooling device cooling the two workpiece interfaces' Condensed_paste 'two workpieces above and below the second two welding to form a mechanical and electrical connection. Only ~ this hair day _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ , turn - (four) (four), coffee pro == = shame's body can be (four) disparity of money, the village w directly set in the implementation == head 合合范_, expected to implement. The renewal of the large, 4 force and time _ interactive scales Ke can reduce the temperature over-current to form a short circuit; it can also reduce the time is too long or the pressure of A-inch tin stomach valley is easy to block the flow and prevent the thickness of the tin layer from decreasing. 200810869 Based on this month, i, the tin reward or hot pressing method, The pressure setting of the hot press is greater than the gl secret force 'sufficient to completely contact the two interfaces with the support body. 'Excessive pressure will not affect the space maintained by the support. And the setting of 4 hot money at work time, as long as it is greater than a certain critical time, is enough for the solder paste to flow sufficiently _ to join an interface, too long, and the solder paste overflow will not be caused by the pressure of the indenter. And short circuit. The temperature setting should be high, and the financial field should be fully _. The too high temperature will not cause the sister, Lu Ben, knee, or tin welding method to be applied to the mouth of FPC and FPC. The electrical and mechanical t-connection of the isoelectric element of the FPC and the Ρ<:Β solder is used to bond the element to the PCB by using the tin-fed with the support of the present invention. ' =, in the present invention, the material and the welding method pass =: provide the space of the support, in order to achieve the solder paste after the Wei, by the support body ^ maintain a fixed height between the two solder joints, to the valley Recording rides remain in this space. Thereby, the support body can greatly reduce the influence of the sound interaction, that is, the solder paste flow can be reduced when the temperature is too high, and the short circuit can be reduced; or the force can be reduced when the __ force is too high. Therefore, the solder paste of the present invention and the hot-press welding ^ solder paste overflow phenomenon prevent the solder from being connected to each other, and the occurrence of ugly phenomena meets the requirements of integration of the integration of the information age. Axis (4) has been Xiaoguan Shiguan mine as above, Caihe _ to limit X 壬 4 4 习 习 习 习 习 4 4 4 4 4 , 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可The scope of the invention is defined by the scope of the appended claims. [Simple diagram description] None [Main component symbol description] None -12-