BR112013019849A2 - composição de solda livre de chumbo - Google Patents

composição de solda livre de chumbo

Info

Publication number
BR112013019849A2
BR112013019849A2 BR112013019849A BR112013019849A BR112013019849A2 BR 112013019849 A2 BR112013019849 A2 BR 112013019849A2 BR 112013019849 A BR112013019849 A BR 112013019849A BR 112013019849 A BR112013019849 A BR 112013019849A BR 112013019849 A2 BR112013019849 A2 BR 112013019849A2
Authority
BR
Brazil
Prior art keywords
weight
composition
solder composition
free solder
lead free
Prior art date
Application number
BR112013019849A
Other languages
English (en)
Other versions
BR112013019849B1 (pt
Inventor
Alexandra M Mackin
Jennie S Hwang
John Pereira
Joseph C Gonsalves
Original Assignee
Antaya Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Antaya Technologies Corp filed Critical Antaya Technologies Corp
Publication of BR112013019849A2 publication Critical patent/BR112013019849A2/pt
Publication of BR112013019849B1 publication Critical patent/BR112013019849B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Y—INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2410/00—Constructional features of vehicle sub-units
    • B60Y2410/115—Electric wiring; Electric connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Photovoltaic Devices (AREA)

Abstract

composição de solda livre de chumbo a presente invenção refere-se a uma composição de solda que inclui cerca de 4% a cerca de 25% em peso de estanho, cerca de 0,1% a cerca de 8% em peso de antimônio, cerca de 0,03% a cerca de 4% em peso de cobre, cerca de 0,03% a cerca de 4% em peso de níquel, cerca de 66% a cerca de 90% em peso de índio, e cerca de 0,5% a cerca de 9% em peso de prata. a composição pode incluir ainda cerca de 0,2% a cerca de 6% em peso de zinco, e, de forma independente, cerca de 0,01% a cerca de 0,3% em peso de germânio. a composição pode ser usada para soldar um conector elétrico em uma superfície de contato elétrico em um componente do vidro.
BR112013019849-4A 2011-02-04 2012-02-01 Composição de solda livre de chumbo, seu método de formação e conexão elétrica BR112013019849B1 (pt)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161439538P 2011-02-04 2011-02-04
US61/439,538 2011-02-04
US201161540213P 2011-09-28 2011-09-28
US61/540,213 2011-09-28
PCT/US2012/023492 WO2012106434A1 (en) 2011-02-04 2012-02-01 Lead-free solder composition

Publications (2)

Publication Number Publication Date
BR112013019849A2 true BR112013019849A2 (pt) 2016-10-11
BR112013019849B1 BR112013019849B1 (pt) 2023-08-22

Family

ID=

Also Published As

Publication number Publication date
US10105794B2 (en) 2018-10-23
TWI642510B (zh) 2018-12-01
US20140271343A1 (en) 2014-09-18
EP2670560A1 (en) 2013-12-11
EP2670560B1 (en) 2016-01-13
US20180207753A1 (en) 2018-07-26
CA2825629A1 (en) 2012-08-09
TWI583481B (zh) 2017-05-21
JP2014509944A (ja) 2014-04-24
CN103476539A (zh) 2013-12-25
JP6928062B2 (ja) 2021-09-01
TW201538263A (zh) 2015-10-16
MX344239B (es) 2016-12-07
MX356849B (es) 2018-06-15
TW201238696A (en) 2012-10-01
US8771592B2 (en) 2014-07-08
EP2990155A1 (en) 2016-03-02
TWI505897B (zh) 2015-11-01
JP2018039053A (ja) 2018-03-15
JP2016052684A (ja) 2016-04-14
US20170190004A1 (en) 2017-07-06
CN103476539B (zh) 2016-08-17
JP6243893B2 (ja) 2017-12-06
JP2020040127A (ja) 2020-03-19
US20120222893A1 (en) 2012-09-06
JP6846328B2 (ja) 2021-03-24
US9975207B2 (en) 2018-05-22
WO2012106434A1 (en) 2012-08-09
EP2990155B1 (en) 2017-09-27
MX2013009014A (es) 2013-12-06
PL2990155T3 (pl) 2018-01-31
TW201726291A (zh) 2017-08-01
PL2670560T3 (pl) 2016-04-29

Similar Documents

Publication Publication Date Title
MX2013009014A (es) Composicion de soldadura sin plomo.
MX370004B (es) Cristal con elemento de conexión eléctrica.
MX347252B (es) Cristal con un elemento de conexion electrica.
BR112014029731A2 (pt) vidro com um elemento de conexão elétrica
EA201590995A1 (ru) Оконное стекло с электрическим присоединительным элементом и компенсационными пластинками
MY154044A (en) Solder alloy, solder paste, and electronic circuit board
EA201391660A1 (ru) Стеклянный лист с элементом для электрического соединения
EA201590566A1 (ru) Стекло с электрическим соединительным элементом
MY154361A (en) Solder alloy, solder paste, and electronic circuit board
MY162879A (en) Solder alloy, solder paste, and electronic circuit board
JP2016052684A5 (pt)
EP3550629A3 (en) Opto-electrical devices incorporating metal nanowires
WO2011142848A3 (en) Nanoparticle electrodes and methods of preparation
BR112012011551A2 (pt) composição em pasta eletrocondutora
WO2013117588A3 (en) A thin film for a lead for brain applications
MX2019001008A (es) Acristalamiento equipado con un dispositivo electricamente conductor con zonas de soldadura mejoradas.
BR112016006975A2 (pt) revestimento protetor para padrão condutivo impresso em condutores transparentes de nanofio dotados de um padrão
CO2020002405A2 (es) Recocido instantáneo de recubrimientos de plata
WO2015191955A3 (en) Aluminum-tin paste and its use in manufacturing solderable electrical conductors
EA201490666A1 (ru) Стеклянная панель, включающая первый лист стекла, по меньшей мере, частично покрытый электропроводящим покрытием
AR088179A1 (es) Una aleacion a base de estaño
IN2014MN01997A (pt)
PH12016502241B1 (en) Connecting component material
GB201120981D0 (en) Electronic device
BR112017027295A2 (pt) galvanização de bronze sobre lâminas de polímero

Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B12B Appeal against refusal [chapter 12.2 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 01/02/2012, OBSERVADAS AS CONDICOES LEGAIS. PATENTE CONCEDIDA CONFORME ADI 5.529/DF, QUE DETERMINA A ALTERACAO DO PRAZO DE CONCESSAO.