JP2009504411A5 - - Google Patents
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- Publication number
- JP2009504411A5 JP2009504411A5 JP2008525984A JP2008525984A JP2009504411A5 JP 2009504411 A5 JP2009504411 A5 JP 2009504411A5 JP 2008525984 A JP2008525984 A JP 2008525984A JP 2008525984 A JP2008525984 A JP 2008525984A JP 2009504411 A5 JP2009504411 A5 JP 2009504411A5
- Authority
- JP
- Japan
- Prior art keywords
- indium
- bismuth
- silver
- tin
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 52
- 229910052738 indium Inorganic materials 0.000 claims 42
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 42
- 229910000679 solder Inorganic materials 0.000 claims 41
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 33
- 229910052797 bismuth Inorganic materials 0.000 claims 33
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 33
- 238000000034 method Methods 0.000 claims 33
- 229910052709 silver Inorganic materials 0.000 claims 33
- 239000004332 silver Substances 0.000 claims 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 32
- 229910052802 copper Inorganic materials 0.000 claims 32
- 239000010949 copper Substances 0.000 claims 32
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 31
- 229910052718 tin Inorganic materials 0.000 claims 31
- 230000003796 beauty Effects 0.000 claims 18
- 238000005476 soldering Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/202,640 | 2005-08-12 | ||
| US11/202,640 US20070037004A1 (en) | 2005-08-12 | 2005-08-12 | Multilayer solder article |
| US11/359,876 | 2006-02-22 | ||
| US11/359,864 | 2006-02-22 | ||
| US11/359,876 US20070231594A1 (en) | 2005-08-12 | 2006-02-22 | Multilayer solder article |
| US11/359,864 US20070036670A1 (en) | 2005-08-12 | 2006-02-22 | Solder composition |
| PCT/US2006/014305 WO2007021326A2 (en) | 2005-08-12 | 2006-04-13 | Solder composition |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013077363A Division JP5696173B2 (ja) | 2005-08-12 | 2013-04-03 | はんだ組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009504411A JP2009504411A (ja) | 2009-02-05 |
| JP2009504411A5 true JP2009504411A5 (enExample) | 2009-07-02 |
| JP5492412B2 JP5492412B2 (ja) | 2014-05-14 |
Family
ID=36951374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008525984A Active JP5492412B2 (ja) | 2005-08-12 | 2006-04-13 | はんだ組成物 |
Country Status (5)
| Country | Link |
|---|---|
| EP (2) | EP3590653B1 (enExample) |
| JP (1) | JP5492412B2 (enExample) |
| CA (1) | CA2625021A1 (enExample) |
| PL (1) | PL1922175T3 (enExample) |
| WO (1) | WO2007021326A2 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5696173B2 (ja) * | 2005-08-12 | 2015-04-08 | アンタヤ・テクノロジーズ・コープ | はんだ組成物 |
| JP2009269075A (ja) * | 2008-05-09 | 2009-11-19 | Sumitomo Metal Mining Co Ltd | 応力緩和層を有する積層はんだ材の製造方法および製造装置 |
| DE102009034483A1 (de) * | 2009-07-22 | 2011-01-27 | W.C. Heraeus Gmbh | Bleifreie Hochtemperaturverbindung für die AVT in der Elektronik |
| JP2011240352A (ja) * | 2010-05-17 | 2011-12-01 | Central Glass Co Ltd | 車両用無鉛はんだ組成物 |
| KR20140032973A (ko) | 2011-01-14 | 2014-03-17 | 아사히 가라스 가부시키가이샤 | 차량용 창유리 및 그의 제조 방법 |
| MX356849B (es) * | 2011-02-04 | 2018-06-15 | Antaya Tech Corp | Composicion de soldadura sin plomo. |
| EP2671666B1 (en) | 2011-03-02 | 2016-07-20 | Central Glass Company, Limited | Lead-free solder alloy for vehicle glass |
| JP2014096198A (ja) * | 2011-03-02 | 2014-05-22 | Central Glass Co Ltd | 自動車用窓ガラスと給電端子の接合方法 |
| EP2704873B1 (en) | 2011-05-03 | 2022-02-09 | Pilkington Group Limited | Glazing with a soldered connector |
| GB201114076D0 (en) | 2011-08-16 | 2011-09-28 | Pilkington Group Ltd | Glazing |
| CN104540636B (zh) * | 2012-08-24 | 2017-09-08 | 法国圣戈班玻璃厂 | 具有电连接元件的玻璃板 |
| CN203936494U (zh) * | 2014-02-28 | 2014-11-12 | 日本斯倍利亚社股份有限公司 | 汽车用玻璃 |
| KR101555779B1 (ko) * | 2014-04-11 | 2015-09-24 | (주)한신단자공업 | 면상화납이 리벳 결속된 윈드실드용 전원클립 글라스 납땜방법 |
| KR101555778B1 (ko) * | 2014-04-11 | 2015-09-24 | (주)한신단자공업 | 면상화납이 융착결속된 윈드실드용 전원클립 제조방법 및 윈드실드용 전원클립 |
| KR20170108766A (ko) * | 2016-03-18 | 2017-09-27 | 헤베이 리신 테크놀로지 컴퍼니 리미티드 | 높은 연성을 가지는 무연 솔더 조성물 |
| US20210387290A1 (en) * | 2018-12-17 | 2021-12-16 | Heraeus Precious Metals North America Conshohocken Llc | Process for forming an electric heater |
| JP6708942B1 (ja) | 2019-05-27 | 2020-06-10 | 千住金属工業株式会社 | はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板 |
| US11383330B2 (en) | 2020-09-21 | 2022-07-12 | Aptiv Technologies Limited | Lead-free solder composition |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0680881B2 (ja) * | 1984-06-29 | 1994-10-12 | 富士通株式会社 | 半田溶融式高密度コネクタ |
| JPH03230552A (ja) * | 1990-02-05 | 1991-10-14 | Matsushita Electric Ind Co Ltd | 半導体素子実装用接合材 |
| JP2000141078A (ja) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
| US6253988B1 (en) | 1999-03-29 | 2001-07-03 | Antaya Technologies Corporation | Low temperature solder |
| JP2002096191A (ja) * | 2000-09-18 | 2002-04-02 | Matsushita Electric Ind Co Ltd | はんだ材料およびこれを利用する電気・電子機器 |
-
2006
- 2006-04-12 EP EP19193508.9A patent/EP3590653B1/en active Active
- 2006-04-12 PL PL06750366T patent/PL1922175T3/pl unknown
- 2006-04-12 EP EP06750366.4A patent/EP1922175B1/en active Active
- 2006-04-13 JP JP2008525984A patent/JP5492412B2/ja active Active
- 2006-04-13 WO PCT/US2006/014305 patent/WO2007021326A2/en not_active Ceased
- 2006-04-13 CA CA002625021A patent/CA2625021A1/en not_active Abandoned
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