JP5492412B2 - はんだ組成物 - Google Patents

はんだ組成物 Download PDF

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Publication number
JP5492412B2
JP5492412B2 JP2008525984A JP2008525984A JP5492412B2 JP 5492412 B2 JP5492412 B2 JP 5492412B2 JP 2008525984 A JP2008525984 A JP 2008525984A JP 2008525984 A JP2008525984 A JP 2008525984A JP 5492412 B2 JP5492412 B2 JP 5492412B2
Authority
JP
Japan
Prior art keywords
solder
tin
composition
indium
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008525984A
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English (en)
Japanese (ja)
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JP2009504411A (ja
JP2009504411A5 (enExample
Inventor
ペレイラ・ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Antaya Technologies Corp
Original Assignee
Antaya Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/202,640 external-priority patent/US20070037004A1/en
Priority claimed from US11/359,864 external-priority patent/US20070036670A1/en
Priority claimed from US11/359,876 external-priority patent/US20070231594A1/en
Application filed by Antaya Technologies Corp filed Critical Antaya Technologies Corp
Publication of JP2009504411A publication Critical patent/JP2009504411A/ja
Publication of JP2009504411A5 publication Critical patent/JP2009504411A5/ja
Application granted granted Critical
Publication of JP5492412B2 publication Critical patent/JP5492412B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233Sheets, foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233Sheets, foils
    • B23K35/0238Sheets, foils layered
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/30Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302Cu as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3668Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
    • C03C17/3673Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in heating devices for rear window of vehicles
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04Joining glass to metal by means of an interlayer
    • C03C27/042Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C28/00Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C30/00Alloys containing less than 50% by weight of each constituent
    • C22C30/04Alloys containing less than 50% by weight of each constituent containing tin or lead

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Ceramic Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2008525984A 2005-08-12 2006-04-13 はんだ組成物 Active JP5492412B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US11/202,640 US20070037004A1 (en) 2005-08-12 2005-08-12 Multilayer solder article
US11/202,640 2005-08-12
US11/359,864 US20070036670A1 (en) 2005-08-12 2006-02-22 Solder composition
US11/359,864 2006-02-22
US11/359,876 US20070231594A1 (en) 2005-08-12 2006-02-22 Multilayer solder article
US11/359,876 2006-02-22
PCT/US2006/014305 WO2007021326A2 (en) 2005-08-12 2006-04-13 Solder composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013077363A Division JP5696173B2 (ja) 2005-08-12 2013-04-03 はんだ組成物

Publications (3)

Publication Number Publication Date
JP2009504411A JP2009504411A (ja) 2009-02-05
JP2009504411A5 JP2009504411A5 (enExample) 2009-07-02
JP5492412B2 true JP5492412B2 (ja) 2014-05-14

Family

ID=36951374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008525984A Active JP5492412B2 (ja) 2005-08-12 2006-04-13 はんだ組成物

Country Status (5)

Country Link
EP (2) EP3590653B1 (enExample)
JP (1) JP5492412B2 (enExample)
CA (1) CA2625021A1 (enExample)
PL (1) PL1922175T3 (enExample)
WO (1) WO2007021326A2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5696173B2 (ja) * 2005-08-12 2015-04-08 アンタヤ・テクノロジーズ・コープ はんだ組成物
JP2009269075A (ja) * 2008-05-09 2009-11-19 Sumitomo Metal Mining Co Ltd 応力緩和層を有する積層はんだ材の製造方法および製造装置
DE102009034483A1 (de) * 2009-07-22 2011-01-27 W.C. Heraeus Gmbh Bleifreie Hochtemperaturverbindung für die AVT in der Elektronik
JP2011240352A (ja) * 2010-05-17 2011-12-01 Central Glass Co Ltd 車両用無鉛はんだ組成物
EP2664503B1 (en) * 2011-01-14 2018-03-07 Asahi Glass Company, Limited A method for producing a windowpane for vehicles
EP2670560B1 (en) * 2011-02-04 2016-01-13 Antaya Technologies Corp. Lead-free solder composition
EP2671666B1 (en) * 2011-03-02 2016-07-20 Central Glass Company, Limited Lead-free solder alloy for vehicle glass
JP2014096198A (ja) * 2011-03-02 2014-05-22 Central Glass Co Ltd 自動車用窓ガラスと給電端子の接合方法
JP6008945B2 (ja) * 2011-05-03 2016-10-19 ピルキントン グループ リミテッド はんだ付けされたコネクタを備えるグレイジング
GB201114076D0 (en) 2011-08-16 2011-09-28 Pilkington Group Ltd Glazing
TR201910819T4 (tr) * 2012-08-24 2019-08-21 Saint Gobain Elektrik bağlantı elemanlı cam levha.
CN203936494U (zh) * 2014-02-28 2014-11-12 日本斯倍利亚社股份有限公司 汽车用玻璃
KR101555779B1 (ko) * 2014-04-11 2015-09-24 (주)한신단자공업 면상화납이 리벳 결속된 윈드실드용 전원클립 글라스 납땜방법
KR101555778B1 (ko) * 2014-04-11 2015-09-24 (주)한신단자공업 면상화납이 융착결속된 윈드실드용 전원클립 제조방법 및 윈드실드용 전원클립
KR20170108766A (ko) * 2016-03-18 2017-09-27 헤베이 리신 테크놀로지 컴퍼니 리미티드 높은 연성을 가지는 무연 솔더 조성물
US20210387290A1 (en) * 2018-12-17 2021-12-16 Heraeus Precious Metals North America Conshohocken Llc Process for forming an electric heater
JP6708942B1 (ja) 2019-05-27 2020-06-10 千住金属工業株式会社 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板
US11383330B2 (en) 2020-09-21 2022-07-12 Aptiv Technologies Limited Lead-free solder composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0680881B2 (ja) * 1984-06-29 1994-10-12 富士通株式会社 半田溶融式高密度コネクタ
JPH03230552A (ja) * 1990-02-05 1991-10-14 Matsushita Electric Ind Co Ltd 半導体素子実装用接合材
JP2000141078A (ja) * 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
US6253988B1 (en) 1999-03-29 2001-07-03 Antaya Technologies Corporation Low temperature solder
JP2002096191A (ja) * 2000-09-18 2002-04-02 Matsushita Electric Ind Co Ltd はんだ材料およびこれを利用する電気・電子機器

Also Published As

Publication number Publication date
WO2007021326A3 (en) 2007-06-21
EP1922175B1 (en) 2019-09-04
EP1922175A2 (en) 2008-05-21
CA2625021A1 (en) 2007-02-22
JP2009504411A (ja) 2009-02-05
EP3590653B1 (en) 2023-10-18
WO2007021326A2 (en) 2007-02-22
PL1922175T3 (pl) 2020-03-31
EP3590653A1 (en) 2020-01-08

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