JP5492412B2 - はんだ組成物 - Google Patents
はんだ組成物 Download PDFInfo
- Publication number
- JP5492412B2 JP5492412B2 JP2008525984A JP2008525984A JP5492412B2 JP 5492412 B2 JP5492412 B2 JP 5492412B2 JP 2008525984 A JP2008525984 A JP 2008525984A JP 2008525984 A JP2008525984 A JP 2008525984A JP 5492412 B2 JP5492412 B2 JP 5492412B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tin
- composition
- indium
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 613
- 239000000203 mixture Substances 0.000 title claims description 203
- 229910052718 tin Inorganic materials 0.000 claims description 192
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 189
- 229910052738 indium Inorganic materials 0.000 claims description 153
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 150
- 229910052709 silver Inorganic materials 0.000 claims description 149
- 239000004332 silver Substances 0.000 claims description 146
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 142
- 239000010949 copper Substances 0.000 claims description 130
- 229910052802 copper Inorganic materials 0.000 claims description 126
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 123
- 238000000034 method Methods 0.000 claims description 115
- 229910052797 bismuth Inorganic materials 0.000 claims description 76
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 76
- 238000002156 mixing Methods 0.000 claims description 30
- 239000011135 tin Substances 0.000 description 197
- 238000002844 melting Methods 0.000 description 141
- 230000008018 melting Effects 0.000 description 139
- 239000011521 glass Substances 0.000 description 78
- 239000000758 substrate Substances 0.000 description 66
- 238000005476 soldering Methods 0.000 description 44
- 238000005097 cold rolling Methods 0.000 description 22
- 238000005096 rolling process Methods 0.000 description 18
- 239000004020 conductor Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000005304 joining Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000005336 cracking Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 238000009966 trimming Methods 0.000 description 6
- 238000005253 cladding Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 241000220010 Rhode Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3668—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties
- C03C17/3673—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating having electrical properties specially adapted for use in heating devices for rear window of vehicles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/04—Joining glass to metal by means of an interlayer
- C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
- C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Ceramic Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/202,640 US20070037004A1 (en) | 2005-08-12 | 2005-08-12 | Multilayer solder article |
| US11/202,640 | 2005-08-12 | ||
| US11/359,864 US20070036670A1 (en) | 2005-08-12 | 2006-02-22 | Solder composition |
| US11/359,864 | 2006-02-22 | ||
| US11/359,876 US20070231594A1 (en) | 2005-08-12 | 2006-02-22 | Multilayer solder article |
| US11/359,876 | 2006-02-22 | ||
| PCT/US2006/014305 WO2007021326A2 (en) | 2005-08-12 | 2006-04-13 | Solder composition |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013077363A Division JP5696173B2 (ja) | 2005-08-12 | 2013-04-03 | はんだ組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009504411A JP2009504411A (ja) | 2009-02-05 |
| JP2009504411A5 JP2009504411A5 (enExample) | 2009-07-02 |
| JP5492412B2 true JP5492412B2 (ja) | 2014-05-14 |
Family
ID=36951374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008525984A Active JP5492412B2 (ja) | 2005-08-12 | 2006-04-13 | はんだ組成物 |
Country Status (5)
| Country | Link |
|---|---|
| EP (2) | EP3590653B1 (enExample) |
| JP (1) | JP5492412B2 (enExample) |
| CA (1) | CA2625021A1 (enExample) |
| PL (1) | PL1922175T3 (enExample) |
| WO (1) | WO2007021326A2 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5696173B2 (ja) * | 2005-08-12 | 2015-04-08 | アンタヤ・テクノロジーズ・コープ | はんだ組成物 |
| JP2009269075A (ja) * | 2008-05-09 | 2009-11-19 | Sumitomo Metal Mining Co Ltd | 応力緩和層を有する積層はんだ材の製造方法および製造装置 |
| DE102009034483A1 (de) * | 2009-07-22 | 2011-01-27 | W.C. Heraeus Gmbh | Bleifreie Hochtemperaturverbindung für die AVT in der Elektronik |
| JP2011240352A (ja) * | 2010-05-17 | 2011-12-01 | Central Glass Co Ltd | 車両用無鉛はんだ組成物 |
| EP2664503B1 (en) * | 2011-01-14 | 2018-03-07 | Asahi Glass Company, Limited | A method for producing a windowpane for vehicles |
| EP2670560B1 (en) * | 2011-02-04 | 2016-01-13 | Antaya Technologies Corp. | Lead-free solder composition |
| EP2671666B1 (en) * | 2011-03-02 | 2016-07-20 | Central Glass Company, Limited | Lead-free solder alloy for vehicle glass |
| JP2014096198A (ja) * | 2011-03-02 | 2014-05-22 | Central Glass Co Ltd | 自動車用窓ガラスと給電端子の接合方法 |
| JP6008945B2 (ja) * | 2011-05-03 | 2016-10-19 | ピルキントン グループ リミテッド | はんだ付けされたコネクタを備えるグレイジング |
| GB201114076D0 (en) | 2011-08-16 | 2011-09-28 | Pilkington Group Ltd | Glazing |
| TR201910819T4 (tr) * | 2012-08-24 | 2019-08-21 | Saint Gobain | Elektrik bağlantı elemanlı cam levha. |
| CN203936494U (zh) * | 2014-02-28 | 2014-11-12 | 日本斯倍利亚社股份有限公司 | 汽车用玻璃 |
| KR101555779B1 (ko) * | 2014-04-11 | 2015-09-24 | (주)한신단자공업 | 면상화납이 리벳 결속된 윈드실드용 전원클립 글라스 납땜방법 |
| KR101555778B1 (ko) * | 2014-04-11 | 2015-09-24 | (주)한신단자공업 | 면상화납이 융착결속된 윈드실드용 전원클립 제조방법 및 윈드실드용 전원클립 |
| KR20170108766A (ko) * | 2016-03-18 | 2017-09-27 | 헤베이 리신 테크놀로지 컴퍼니 리미티드 | 높은 연성을 가지는 무연 솔더 조성물 |
| US20210387290A1 (en) * | 2018-12-17 | 2021-12-16 | Heraeus Precious Metals North America Conshohocken Llc | Process for forming an electric heater |
| JP6708942B1 (ja) | 2019-05-27 | 2020-06-10 | 千住金属工業株式会社 | はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板 |
| US11383330B2 (en) | 2020-09-21 | 2022-07-12 | Aptiv Technologies Limited | Lead-free solder composition |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0680881B2 (ja) * | 1984-06-29 | 1994-10-12 | 富士通株式会社 | 半田溶融式高密度コネクタ |
| JPH03230552A (ja) * | 1990-02-05 | 1991-10-14 | Matsushita Electric Ind Co Ltd | 半導体素子実装用接合材 |
| JP2000141078A (ja) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | 無鉛ハンダ |
| US6253988B1 (en) | 1999-03-29 | 2001-07-03 | Antaya Technologies Corporation | Low temperature solder |
| JP2002096191A (ja) * | 2000-09-18 | 2002-04-02 | Matsushita Electric Ind Co Ltd | はんだ材料およびこれを利用する電気・電子機器 |
-
2006
- 2006-04-12 EP EP19193508.9A patent/EP3590653B1/en active Active
- 2006-04-12 EP EP06750366.4A patent/EP1922175B1/en active Active
- 2006-04-12 PL PL06750366T patent/PL1922175T3/pl unknown
- 2006-04-13 WO PCT/US2006/014305 patent/WO2007021326A2/en not_active Ceased
- 2006-04-13 CA CA002625021A patent/CA2625021A1/en not_active Abandoned
- 2006-04-13 JP JP2008525984A patent/JP5492412B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007021326A3 (en) | 2007-06-21 |
| EP1922175B1 (en) | 2019-09-04 |
| EP1922175A2 (en) | 2008-05-21 |
| CA2625021A1 (en) | 2007-02-22 |
| JP2009504411A (ja) | 2009-02-05 |
| EP3590653B1 (en) | 2023-10-18 |
| WO2007021326A2 (en) | 2007-02-22 |
| PL1922175T3 (pl) | 2020-03-31 |
| EP3590653A1 (en) | 2020-01-08 |
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