RU2356975C2 - Бессвинцовый припой, способ его производства и способ пайки с использованием этого припоя - Google Patents

Бессвинцовый припой, способ его производства и способ пайки с использованием этого припоя Download PDF

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Publication number
RU2356975C2
RU2356975C2 RU2007116722/02A RU2007116722A RU2356975C2 RU 2356975 C2 RU2356975 C2 RU 2356975C2 RU 2007116722/02 A RU2007116722/02 A RU 2007116722/02A RU 2007116722 A RU2007116722 A RU 2007116722A RU 2356975 C2 RU2356975 C2 RU 2356975C2
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RU
Russia
Prior art keywords
solder
copper
approximately
tin
lead
Prior art date
Application number
RU2007116722/02A
Other languages
English (en)
Russian (ru)
Other versions
RU2007116722A (ru
Inventor
КайХва ЧУ (SG)
КайХва ЧУ
Винсент Ю Серн ХО (SG)
Винсент Ю Серн ХО
Original Assignee
СИНГАПУР АСАХИ КЕМИКАЛ ЭНД СОЛДЕР ИНДАСТРИЗ Пи-Ти-И ЛТД
КУОНТУМ КЕМИКАЛ ТЕКНОЛОДЖИЗ (СИНГАПУР)Пи-Ти-И ЛТД
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by СИНГАПУР АСАХИ КЕМИКАЛ ЭНД СОЛДЕР ИНДАСТРИЗ Пи-Ти-И ЛТД, КУОНТУМ КЕМИКАЛ ТЕКНОЛОДЖИЗ (СИНГАПУР)Пи-Ти-И ЛТД filed Critical СИНГАПУР АСАХИ КЕМИКАЛ ЭНД СОЛДЕР ИНДАСТРИЗ Пи-Ти-И ЛТД
Publication of RU2007116722A publication Critical patent/RU2007116722A/ru
Application granted granted Critical
Publication of RU2356975C2 publication Critical patent/RU2356975C2/ru

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Powder Metallurgy (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Silicon Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Glass Compositions (AREA)
  • Fats And Perfumes (AREA)
  • Detergent Compositions (AREA)
RU2007116722/02A 2004-10-27 2005-08-26 Бессвинцовый припой, способ его производства и способ пайки с использованием этого припоя RU2356975C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0423860A GB2406101C (en) 2004-10-27 2004-10-27 Improvements in ro relating to solders
GB0423860.6 2004-10-27

Publications (2)

Publication Number Publication Date
RU2007116722A RU2007116722A (ru) 2008-12-10
RU2356975C2 true RU2356975C2 (ru) 2009-05-27

Family

ID=33515637

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2007116722/02A RU2356975C2 (ru) 2004-10-27 2005-08-26 Бессвинцовый припой, способ его производства и способ пайки с использованием этого припоя

Country Status (17)

Country Link
US (2) US20060088439A1 (enExample)
EP (1) EP1815034B1 (enExample)
JP (1) JP4048288B2 (enExample)
KR (1) KR100886768B1 (enExample)
CN (1) CN100497693C (enExample)
AT (1) ATE417941T1 (enExample)
AU (1) AU2005298466B2 (enExample)
BR (1) BRPI0517384B1 (enExample)
DE (1) DE602005011848D1 (enExample)
DK (1) DK1815034T3 (enExample)
GB (1) GB2406101C (enExample)
IL (1) IL180932A (enExample)
MX (1) MX2007003369A (enExample)
MY (1) MY136213A (enExample)
NO (1) NO333370B1 (enExample)
RU (1) RU2356975C2 (enExample)
WO (1) WO2006045995A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10286497B2 (en) 2014-04-30 2019-05-14 Nihon Superior Co., Ltd. Lead-free solder alloy
RU2763128C1 (ru) * 2017-12-14 2021-12-27 Металло Белджиум Способ для производства сырого припойного продукта и медного продукта

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308053B2 (en) 2005-08-31 2012-11-13 Micron Technology, Inc. Microfeature workpieces having alloyed conductive structures, and associated methods
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
CN103008903A (zh) * 2007-08-14 2013-04-03 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN101848787B (zh) * 2007-08-14 2013-10-23 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
EP2179815A4 (en) * 2007-08-24 2010-09-08 Toshiba Kk BINDING COMPOSITION
CN101554684A (zh) * 2009-05-19 2009-10-14 广州瀚源电子科技有限公司 一种无铅焊料的减渣方法
RU2441736C1 (ru) * 2010-11-24 2012-02-10 Открытое акционерное общество "Всероссийский институт легких сплавов" (ОАО "ВИЛС") Припой для пайки алюминия и его сплавов
JP6008101B2 (ja) * 2012-08-11 2016-10-19 千住金属工業株式会社 電力用はんだ
RU2584357C1 (ru) * 2014-11-26 2016-05-20 Открытое акционерное общество "Композит" (ОАО "Композит") Припой для пайки алюминия и его сплавов

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
RU2219030C1 (ru) * 2002-05-27 2003-12-20 Открытое акционерное общество "ГАЗ" Припой для низкотемпературной пайки

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2612035B1 (fr) * 1987-03-03 1989-05-26 Loire Electronique Machine de soudage a l'etain avec pare-vague automatique, pour cartes a circuit imprime
TW251249B (enExample) * 1993-04-30 1995-07-11 At & T Corp
JP3107483B2 (ja) * 1993-07-13 2000-11-06 日本アルミット株式会社 無ないし低含鉛半田合金
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH0970687A (ja) * 1995-07-04 1997-03-18 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
WO1997009455A1 (en) 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JP3874031B2 (ja) 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
KR980006783A (ko) 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JPH1071488A (ja) * 1996-08-29 1998-03-17 Mitsui Mining & Smelting Co Ltd 錫−銀系半田合金
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JPH10314980A (ja) 1997-05-14 1998-12-02 Sony Corp はんだ材料
JP3719624B2 (ja) * 1997-06-07 2005-11-24 内橋エステック株式会社 電子部品実装用はんだ及び電子部品の実装方法
JPH11221694A (ja) 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
CN1168571C (zh) * 1998-03-26 2004-09-29 斯比瑞尔社股份有限公司 无铅软钎焊料合金
JP2000141078A (ja) 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
WO2000018536A1 (en) 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
JP2000326088A (ja) * 1999-03-16 2000-11-28 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP3753168B2 (ja) 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
JP2002373824A (ja) * 2001-04-11 2002-12-26 Miura Gokin Kogyosho:Kk 金属化プラスチックフィルムコンデンサの外部電極用無鉛合金
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
TW504427B (en) * 2001-09-25 2002-10-01 Honeywell Int Inc Composition, methods and devices for high temperature lead-free solder
KR100366131B1 (ko) * 2001-11-21 2002-12-31 이재옥 드로스 발생이 적은 저융점 무연땜납
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
RU2219030C1 (ru) * 2002-05-27 2003-12-20 Открытое акционерное общество "ГАЗ" Припой для низкотемпературной пайки

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10286497B2 (en) 2014-04-30 2019-05-14 Nihon Superior Co., Ltd. Lead-free solder alloy
RU2695791C2 (ru) * 2014-04-30 2019-07-26 Нихон Супериор Ко., Лтд. Бессвинцовый припой
RU2763128C1 (ru) * 2017-12-14 2021-12-27 Металло Белджиум Способ для производства сырого припойного продукта и медного продукта

Also Published As

Publication number Publication date
AU2005298466A1 (en) 2006-05-04
NO20072097L (no) 2007-06-06
HK1105668A1 (en) 2008-02-22
KR20070049229A (ko) 2007-05-10
IL180932A0 (en) 2007-07-04
US7472817B2 (en) 2009-01-06
ATE417941T1 (de) 2009-01-15
JP2006123001A (ja) 2006-05-18
KR100886768B1 (ko) 2009-03-04
GB0423860D0 (en) 2004-12-01
RU2007116722A (ru) 2008-12-10
GB2406101B (en) 2006-08-02
EP1815034A1 (en) 2007-08-08
GB2406101A8 (en) 2005-11-07
GB2406101A (en) 2005-03-23
EP1815034B1 (en) 2008-12-17
BRPI0517384B1 (pt) 2017-06-27
MY136213A (en) 2008-08-29
NO333370B1 (no) 2013-05-13
WO2006045995A8 (en) 2007-04-12
DE602005011848D1 (de) 2009-01-29
IL180932A (en) 2013-03-24
AU2005298466B2 (en) 2008-11-20
JP4048288B2 (ja) 2008-02-20
MX2007003369A (es) 2008-03-05
US20060088439A1 (en) 2006-04-27
CN101080505A (zh) 2007-11-28
US20070125834A1 (en) 2007-06-07
BRPI0517384A (pt) 2008-10-07
WO2006045995A1 (en) 2006-05-04
CN100497693C (zh) 2009-06-10
DK1815034T3 (da) 2009-04-06
GB2406101C (en) 2007-09-11

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MM4A The patent is invalid due to non-payment of fees

Effective date: 20200827