JP2006073600A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

Info

Publication number
JP2006073600A
JP2006073600A JP2004252108A JP2004252108A JP2006073600A JP 2006073600 A JP2006073600 A JP 2006073600A JP 2004252108 A JP2004252108 A JP 2004252108A JP 2004252108 A JP2004252108 A JP 2004252108A JP 2006073600 A JP2006073600 A JP 2006073600A
Authority
JP
Japan
Prior art keywords
resin
sealing body
sealing
semiconductor device
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004252108A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006073600A5 (https=
Inventor
Bunji Kuratomi
文司 倉冨
Takafumi Nishida
隆文 西田
Yoichi Kawada
洋一 河田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2004252108A priority Critical patent/JP2006073600A/ja
Priority to US11/187,864 priority patent/US8119050B2/en
Publication of JP2006073600A publication Critical patent/JP2006073600A/ja
Publication of JP2006073600A5 publication Critical patent/JP2006073600A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/84—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks by moulding material on preformed parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2004252108A 2004-08-31 2004-08-31 半導体装置およびその製造方法 Pending JP2006073600A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004252108A JP2006073600A (ja) 2004-08-31 2004-08-31 半導体装置およびその製造方法
US11/187,864 US8119050B2 (en) 2004-08-31 2005-07-25 Method of manufacturing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252108A JP2006073600A (ja) 2004-08-31 2004-08-31 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2006073600A true JP2006073600A (ja) 2006-03-16
JP2006073600A5 JP2006073600A5 (https=) 2007-10-11

Family

ID=35941966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004252108A Pending JP2006073600A (ja) 2004-08-31 2004-08-31 半導体装置およびその製造方法

Country Status (2)

Country Link
US (1) US8119050B2 (https=)
JP (1) JP2006073600A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218916A (ja) * 2007-03-07 2008-09-18 Nec Electronics Corp 樹脂成型装置
KR101065553B1 (ko) 2009-05-29 2011-09-19 심완보 반도체 장치 제조용 금형의 하부구조
JP2012000805A (ja) * 2010-06-15 2012-01-05 Renesas Electronics Corp 半導体装置、半導体装置の保管方法、半導体装置の製造方法、及び半導体製造装置
JP2015207705A (ja) * 2014-04-22 2015-11-19 株式会社デンソー 電子装置およびその製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102563557B (zh) * 2010-12-30 2016-08-17 欧司朗股份有限公司 用于灯条的封装方法
JP2014150213A (ja) * 2013-02-04 2014-08-21 Fujitsu Semiconductor Ltd 半導体装置及び半導体装置の製造方法
CN110797269B (zh) * 2019-11-07 2021-02-05 温州胜泰智能科技有限公司 一种集成芯片封装方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243302A (ja) * 1992-02-28 1993-09-21 Nec Kansai Ltd 電子部品及び樹脂モールド装置
JPH05299454A (ja) * 1992-04-24 1993-11-12 Matsushita Electron Corp 半導体製造装置
JPH0661284A (ja) * 1992-08-07 1994-03-04 Mitsui Petrochem Ind Ltd 半導体装置用箱形樹脂成形体
JPH1174422A (ja) * 1997-08-28 1999-03-16 Hitachi Ltd 半導体装置およびその樹脂封止体の成形方法並びに成形装置
JP2002114890A (ja) * 2000-07-31 2002-04-16 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2003277582A (ja) * 2002-03-25 2003-10-02 Toray Ind Inc エポキシ樹脂組成物及び半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05228970A (ja) * 1992-02-21 1993-09-07 Sony Corp 射出圧縮成形法、これに用いる射出成形金型及び射出圧縮成形機
GB9204730D0 (en) * 1992-03-05 1992-04-15 Rover Group A method of forming a moulding by dual injection and a moulding formed in accordance with such a method
JPH06302633A (ja) * 1993-04-13 1994-10-28 Fujitsu Ltd 半導体装置の製造方法
JP2000306933A (ja) * 1999-04-26 2000-11-02 Towa Corp 電子部品の樹脂封止成形方法及び金型
JP3062192B1 (ja) * 1999-09-01 2000-07-10 松下電子工業株式会社 リ―ドフレ―ムとそれを用いた樹脂封止型半導体装置の製造方法
US6309916B1 (en) * 1999-11-17 2001-10-30 Amkor Technology, Inc Method of molding plastic semiconductor packages
JP2002026168A (ja) * 2000-06-30 2002-01-25 Hitachi Ltd 半導体装置およびその製造方法
JP4738675B2 (ja) * 2001-09-14 2011-08-03 ルネサスエレクトロニクス株式会社 半導体装置
DE60314218T2 (de) * 2002-11-12 2007-09-27 Nitto Denko Corp., Ibaraki Gefüllte Epoxidharz-Zusammensetzung zur Einkapselung von Halbleitern sowie ein damit eingekapselter Halbleiterbauteil

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243302A (ja) * 1992-02-28 1993-09-21 Nec Kansai Ltd 電子部品及び樹脂モールド装置
JPH05299454A (ja) * 1992-04-24 1993-11-12 Matsushita Electron Corp 半導体製造装置
JPH0661284A (ja) * 1992-08-07 1994-03-04 Mitsui Petrochem Ind Ltd 半導体装置用箱形樹脂成形体
JPH1174422A (ja) * 1997-08-28 1999-03-16 Hitachi Ltd 半導体装置およびその樹脂封止体の成形方法並びに成形装置
JP2002114890A (ja) * 2000-07-31 2002-04-16 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2003277582A (ja) * 2002-03-25 2003-10-02 Toray Ind Inc エポキシ樹脂組成物及び半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218916A (ja) * 2007-03-07 2008-09-18 Nec Electronics Corp 樹脂成型装置
KR101065553B1 (ko) 2009-05-29 2011-09-19 심완보 반도체 장치 제조용 금형의 하부구조
JP2012000805A (ja) * 2010-06-15 2012-01-05 Renesas Electronics Corp 半導体装置、半導体装置の保管方法、半導体装置の製造方法、及び半導体製造装置
US8623701B2 (en) 2010-06-15 2014-01-07 Renesas Electronics Corporation Semiconductor device, semiconductor device storage method, semiconductor device manufacturing method, and semiconductor manufacturing apparatus
US9159636B2 (en) 2010-06-15 2015-10-13 Renesas Electronics Corporation Semiconductor device, semiconductor device storage method, semiconductor device manufacturing method, and semiconductor manufacturing apparatus
JP2015207705A (ja) * 2014-04-22 2015-11-19 株式会社デンソー 電子装置およびその製造方法

Also Published As

Publication number Publication date
US20060043641A1 (en) 2006-03-02
US8119050B2 (en) 2012-02-21

Similar Documents

Publication Publication Date Title
KR100703830B1 (ko) 수지밀봉형 반도체장치의 제조방법
KR100435051B1 (ko) 반도체장치, 반도체장치의 제조방법, 수지밀봉금형 및 반도체 제조시스템
TW200406898A (en) Techniques-for manufacturing flash-free contacts on a semiconductor package
CN102347245B (zh) 电路装置的制造方法
CN211125635U (zh) 半导体设备和电子设备
KR200309906Y1 (ko) 반도체 패키지 제조용 리드프레임
JP2012248780A (ja) 樹脂封止方法
JP6420671B2 (ja) 半導体装置の製造方法
JP2006073600A (ja) 半導体装置およびその製造方法
JP2009152507A (ja) 樹脂封止金型および半導体パッケージの樹脂封止成形方法
JP4503391B2 (ja) 半導体装置の製造方法
KR100652405B1 (ko) 수지누설을 억제할 수 있는 반도체 패키지 몰드 금형 및이를 이용한 반도체 패키지 제조방법
CN102077343B (zh) 一种引线架及其制造方法以及一种半导体装置
CN1143371C (zh) 模制塑料型半导体器件及其制造工艺
JP4002235B2 (ja) 樹脂封止型半導体装置
KR100456082B1 (ko) 반도체패키지의제조방법
JPH088363A (ja) リードフレームおよびそれを用いた半導体装置ならびに半導体製造方法およびその製造に用いるモールド金型
JP4294462B2 (ja) 樹脂封止型半導体装置の製造方法
JP4313407B2 (ja) 半導体装置の製造方法
JP6332053B2 (ja) 半導体装置及びその製造方法
JP4065889B2 (ja) Ｂｇａパッケージ構造を有する半導体装置の製造方法
JP2004207759A (ja) 半導体装置およびその製造方法
KR20090088266A (ko) 반도체 패키지 제조용 몰드 금형
KR20080114022A (ko) 반도체 패키지 제조 방법
JP2002254434A (ja) 半導体パッケージの封止樹脂体成形金型

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070822

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070822

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20071122

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20100528

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100810

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101012

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110111

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110419