JP2006066930A - 軟金属導体およびその形成方法 - Google Patents
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76805—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics the opening being a via or contact hole penetrating the underlying conductor
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
- H01L23/53223—Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【解決手段】 その後の化学的機械的研磨ステップで研磨後にほぼ擦り傷なしの表面が得られるように、十分大きい粒子サイズを有する粒子から構成される最上部層を有する、半導体素子に使用するための軟金属導体78である。導電性軟金属構造の最上部層に軟金属構造の厚さの約20%以上の粒子サイズを有する金属粒子を付着する。
【選択図】 図5
Description
例1は、本発明の方法による2レベルの軟金属埋め込みバイア構造の形成を示している。まず、乾式エッチング法の1つである反応性イオン・エッチング(RIE)を使用して、アルミニウム−銅を付着する前に境界面をきれいにする。図1に示すように、半導体基板(図示せず)上に形成され、すでに反応性イオン・エッチングされた、図1にM1として示されている金属層の上に、バイア構造10が形成される。金属層M1は、下側のTi層、その上のAl−Cu層、その上のTi層22および上側のTiN層20からなる。酸化物層12またはその他の低誘電率無機または有機層を付着し、コロイド・シリカを使用する化学的機械的研磨によって平坦化する。追加の酸化物14を付着し、次に線およびバイア用のパターンを形成する。次に、RIE技法を使用して、金属層M1に対するバイア領域に開孔を形成する。RIE技法は、すでに形成したM1層の上のすべての非Al−Cu層を除去するための重要なステップである。次に、PVDプロセスを使用して、30nm未満のTiの層16と、Al−Cuの層18と、Ti/TiNの最終層(図示せず)を順に付着する。Al−Cu層の付着は、軟金属層の厚さの少なくとも約20%の粒子サイズを有する金属粒子を生成することによって実施する。次に、シリカ粒子を含むスラリーと低圧を使用してこの構造を化学的に研磨し、1つのステップで素子間結線とバイアを形成する。
乾式エッチングRIE技法を使用して、Al−Cuの付着前に境界面をきれいにすることにより形成した単一レベルの軟金属埋め込み構造を図3に示す。バイア構造50は、すでに反応性イオン・エッチングを施したTi/Al−Cu/Ti/TiNのM1層の上に形成されている。酸化物またはその他の低誘電率無機または有機層54を付着し、コロイド・シリカを使用する化学的機械的研磨によって平坦化する。酸化物層54には、バイア50用にパターンを形成する。RIE技法を使用して、第1のバイアを開く。RIE技法を使用して、すでに形成したM1層の上のすべての非Al−Cu層を除去することは、重要なステップである。次に、PVDプロセスを使用して、全体が30nm未満の厚さの第1のTi層58と、次にAl−Cuの層60とを形成する。これについては図4に示す。Ti層58および68は、その後、400℃でのアニール後にTiAl3を形成する。Al−Cu層の付着プロセスを行うと、その結果、軟金属層の厚さの少なくとも約20%の粒子サイズを有する層が付着される。次に、シリカ粒子を加えたスラリーと低圧を使用して、バイア構造50を化学的に研磨する。次に、非常に薄い、すなわち、30nm未満のTi層64を下にして層M2を付着し、パターン形成し、反応性イオン・エッチングを施して、素子間結線構造を形成する。上部のTi層64は下部のTi層58より厚くすることができる。TiNの層62および66は、フォトマスク・プロセス用の反射防止膜として形成される。
Al、CuおよびAgから成るグループから選択された単金属材料、または、Al、CuおよびAgから成るグループから選択された2元合金材料もしくは3元合金材料から成る第1の軟金属層と、
前記第1の軟金属層の上に形成され、厚さが30nm未満の第1のTi層と、
Al、CuおよびAgから成るグループから選択された単金属材料、または、Al、CuおよびAgから成るグループから選択された2元合金材料もしくは3元合金材料から成り、前記第1のTi層の上に形成された第2の軟金属層であって、当該第2の軟金属層の厚さの20%以上の粒子サイズの金属粒子をその最上層に有する第2の軟金属層と、
前記第2の軟金属層の上にある第2のTi層とを含み、
室温より高い温度でアニールしたときに、2つの軟金属層の間に挟まれた少なくとも前記第1のTi層がTiAl3に転換させ、電流が前記第1のTi層を通過するときに前記TiAl3を通しての前記軟金属の原子の拡散を生じさせることにより、前記軟金属導体のエレクトロマイグレーション抵抗を改善した軟金属導体。
(2)前記第2のTi層が30nm未満の厚さを有することを特徴とする上記(1)に記載の軟金属導体。
(3)前記第1のTi層が、バイアの最下部に位置することを特徴とする上記(2)に記載の軟金属導体。
12 酸化物層
14 酸化物
16 Tiの層
18 Al−Cuの層
20 TiNの層
M1 Ti/Al−Cu/Tiの層
M2 Ti/Al−Cu/Tiの層
Claims (3)
- 半導体素子に使用するための軟金属導体において、
Al、CuおよびAgから成るグループから選択された単金属材料、または、Al、CuおよびAgから成るグループから選択された2元合金材料もしくは3元合金材料から成る第1の軟金属層と、
前記第1の軟金属層の上に形成され、厚さが30nm未満の第1のTi層と、
Al、CuおよびAgから成るグループから選択された単金属材料、または、Al、CuおよびAgから成るグループから選択された2元合金材料もしくは3元合金材料から成り、前記第1のTi層の上に形成された第2の軟金属層であって、当該第2の軟金属層の厚さの20%以上の粒子サイズの金属粒子をその最上層に有する第2の軟金属層と、
前記第2の軟金属層の上にある第2のTi層とを含み、
室温より高い温度でアニールしたときに、2つの軟金属層の間に挟まれた少なくとも前記第1のTi層がTiAl3に転換させ、電流が前記第1のTi層を通過するときに前記TiAl3を通しての前記軟金属の原子の拡散を生じさせることにより、前記軟金属導体のエレクトロマイグレーション抵抗を改善した軟金属導体。 - 前記第2のTi層が30nm未満の厚さを有することを特徴とする請求項1に記載の軟金属導体。
- 前記第1のTi層が、バイアの最下部に位置することを特徴とする請求項2に記載の軟金属導体。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/367,565 US6285082B1 (en) | 1995-01-03 | 1995-01-03 | Soft metal conductor |
US367565 | 2003-02-15 |
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JP7340833A Division JPH08236481A (ja) | 1995-01-03 | 1995-12-27 | 軟金属導体およびその形成方法 |
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JP2006066930A true JP2006066930A (ja) | 2006-03-09 |
JP4771526B2 JP4771526B2 (ja) | 2011-09-14 |
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Application Number | Title | Priority Date | Filing Date |
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JP7340833A Pending JPH08236481A (ja) | 1995-01-03 | 1995-12-27 | 軟金属導体およびその形成方法 |
JP2003091887A Expired - Lifetime JP4215546B2 (ja) | 1995-01-03 | 2003-03-28 | 軟金属導体およびその形成方法 |
JP2005295811A Expired - Lifetime JP4771526B2 (ja) | 1995-01-03 | 2005-10-11 | 軟金属導体 |
JP2008106417A Expired - Lifetime JP5132400B2 (ja) | 1995-01-03 | 2008-04-16 | 軟金属導体およびその形成方法 |
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JP7340833A Pending JPH08236481A (ja) | 1995-01-03 | 1995-12-27 | 軟金属導体およびその形成方法 |
JP2003091887A Expired - Lifetime JP4215546B2 (ja) | 1995-01-03 | 2003-03-28 | 軟金属導体およびその形成方法 |
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JP2008106417A Expired - Lifetime JP5132400B2 (ja) | 1995-01-03 | 2008-04-16 | 軟金属導体およびその形成方法 |
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US (4) | US6285082B1 (ja) |
EP (1) | EP0721216B1 (ja) |
JP (4) | JPH08236481A (ja) |
KR (1) | KR100239027B1 (ja) |
DE (1) | DE69517295T2 (ja) |
TW (1) | TW351833B (ja) |
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Also Published As
Publication number | Publication date |
---|---|
DE69517295T2 (de) | 2000-12-21 |
TW351833B (en) | 1999-02-01 |
KR960030335A (ko) | 1996-08-17 |
KR100239027B1 (ko) | 2000-01-15 |
JPH08236481A (ja) | 1996-09-13 |
JP4771526B2 (ja) | 2011-09-14 |
EP0721216A2 (en) | 1996-07-10 |
JP2004006768A (ja) | 2004-01-08 |
US6335569B1 (en) | 2002-01-01 |
US20020096768A1 (en) | 2002-07-25 |
JP4215546B2 (ja) | 2009-01-28 |
JP5132400B2 (ja) | 2013-01-30 |
EP0721216B1 (en) | 2000-05-31 |
US6285082B1 (en) | 2001-09-04 |
EP0721216A3 (ja) | 1996-08-14 |
DE69517295D1 (de) | 2000-07-06 |
JP2008182269A (ja) | 2008-08-07 |
US6030895A (en) | 2000-02-29 |
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