AU2001247109A1 - Conductive structure for use in multi-level metallization and process - Google Patents

Conductive structure for use in multi-level metallization and process

Info

Publication number
AU2001247109A1
AU2001247109A1 AU2001247109A AU4710901A AU2001247109A1 AU 2001247109 A1 AU2001247109 A1 AU 2001247109A1 AU 2001247109 A AU2001247109 A AU 2001247109A AU 4710901 A AU4710901 A AU 4710901A AU 2001247109 A1 AU2001247109 A1 AU 2001247109A1
Authority
AU
Australia
Prior art keywords
conductive structure
level metallization
metallization
level
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001247109A
Inventor
Bulent Basol
Homayoun Talieh
Cyprian Uzoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Nutool Inc
Original Assignee
ASM Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc
Publication of AU2001247109A1 publication Critical patent/AU2001247109A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
AU2001247109A 2000-04-27 2000-12-06 Conductive structure for use in multi-level metallization and process Abandoned AU2001247109A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20000200P 2000-04-27 2000-04-27
US60200002 2000-04-27
US64282700A 2000-08-22 2000-08-22
US09642827 2000-08-22
PCT/US2000/042575 WO2001084617A1 (en) 2000-04-27 2000-12-06 Conductive structure for use in multi-level metallization and process

Publications (1)

Publication Number Publication Date
AU2001247109A1 true AU2001247109A1 (en) 2001-11-12

Family

ID=26895373

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001247109A Abandoned AU2001247109A1 (en) 2000-04-27 2000-12-06 Conductive structure for use in multi-level metallization and process

Country Status (4)

Country Link
US (1) US6974769B2 (en)
AU (1) AU2001247109A1 (en)
TW (1) TW541647B (en)
WO (1) WO2001084617A1 (en)

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Also Published As

Publication number Publication date
US20040052930A1 (en) 2004-03-18
TW541647B (en) 2003-07-11
US6974769B2 (en) 2005-12-13
WO2001084617A1 (en) 2001-11-08

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