JP2005534176A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP2005534176A JP2005534176A JP2004523280A JP2004523280A JP2005534176A JP 2005534176 A JP2005534176 A JP 2005534176A JP 2004523280 A JP2004523280 A JP 2004523280A JP 2004523280 A JP2004523280 A JP 2004523280A JP 2005534176 A JP2005534176 A JP 2005534176A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- transfer
- substrate
- module
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012545 processing Methods 0.000 title claims abstract description 191
- 239000000758 substrate Substances 0.000 title claims description 150
- 238000012546 transfer Methods 0.000 claims abstract description 238
- 230000033001 locomotion Effects 0.000 claims abstract description 61
- 239000004065 semiconductor Substances 0.000 claims abstract description 25
- 239000012636 effector Substances 0.000 claims description 39
- 238000005530 etching Methods 0.000 claims description 9
- 238000004320 controlled atmosphere Methods 0.000 claims description 6
- 238000001459 lithography Methods 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000014759 maintenance of location Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 64
- 238000004804 winding Methods 0.000 description 49
- 238000000034 method Methods 0.000 description 27
- 230000006870 function Effects 0.000 description 16
- 230000007246 mechanism Effects 0.000 description 16
- 230000008569 process Effects 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000007613 environmental effect Effects 0.000 description 12
- 230000004888 barrier function Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000003491 array Methods 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 230000001360 synchronised effect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 210000000245 forearm Anatomy 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 238000005339 levitation Methods 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 210000000707 wrist Anatomy 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005355 Hall effect Effects 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/12—Storage devices mechanical with separate article supports or holders movable in a closed circuit to facilitate insertion or removal of articles the articles being books, documents, forms or the like
- B65G1/133—Storage devices mechanical with separate article supports or holders movable in a closed circuit to facilitate insertion or removal of articles the articles being books, documents, forms or the like the circuit being confined in a horizontal plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
12 ロードポート
14 エンバイロンメンタルフロントエンドモジュール
16 ロードロック
18、18´ 搬送チャンバ
18S 側壁
20 処理モジュール
22、122A、122B 基板搬送装置
22A 可動移送機構
22B プラテン
22C カート
30 リニアモータ
180 搬送ポート
Claims (41)
- コントロールされた雰囲気をその中に有し得る搬送チャンバと、
基板を前記搬送チャンバとの間で移送可能なように前記搬送チャンバと連通自在に接続されているものであって、前記基板を保持する少なくとも1つの基板保持モジュールと、
ベースと前記ベースに運動自在に接合しており且つ運動自在に取り付けられている基板移送アームとを有し、前記搬送チャンバ内に移動自在に取り付けられている搬送ビークルと、
前記基板を保持することが可能であって、前記搬送チャンバに連通自在に接続されることによって前記基板をそれらの間で移送する他のモジュールと、からなる基板処理装置であって、
前記搬送チャンバは前記ビークル用の直線状トラベルスロットを画定し、前記少なくとも1つの保持モジュールは前記スロットの一方の側面に位置しており、前記アームは基板を前記スロットの反対の側面に移動する関節を有し、よって前記他のモジュールが前記スロットのいずれかの側面において選択的に前記搬送チャンバに接続されることを可能にし、前記搬送ビークルは前記基板の移送を前記搬送チャンバと前記少なくとも1つの保持モジュール及び前記他のモジュールの両方との間で行い得ることを特徴とする基板処理装置。 - 前記少なくとも1つの保持モジュールが基板処理チャンバモジュールであり、前記他のモジュールがロードロックチャンバモジュールであることを特徴とする請求項1記載の装置。
- 前記少なくとも1つの保持モジュールがロードロックチャンバモジュールであり、前記他のモジュールが他のロードロックチャンバモジュールであることを特徴とする請求項1記載の装置。
- 前記少なくとも1つの保持モジュールが基板処理チャンバモジュールであり、前記他のモジュールが他の基板処理チャンバモジュールであることを特徴とする請求項1記載の装置。
- 前記他のモジュールが前記搬送チャンバの端部に接続され得ることを特徴とする請求項1記載の装置。
- 前記他のモジュールが前記スロットにおいて前記少なくとも1つの保持モジュールの反対の側面に接続されているときに、前記搬送チャンバが少なくとも1つの保持モジュールと前記他のモジュールとの間に延在していることを特徴とする請求項1記載の装置。
- 前記アームが前記搬送ビークルの前記ベースに対して回転自在であることを特徴とする請求項1記載の装置。
- 前記装置が前記搬送ビークルを駆動すべく前記搬送チャンバに接続されているリニアモータを更に有することを特徴とする請求項1記載の装置。
- 前記リニアモータが前記アームに接続しており、よって前記アームを前記ベースに対して回転せしめ且つ前記アームを反対方向に関節状に動かすことを特徴とする請求項1記載の装置。
- コントロールされた雰囲気をその中に有し、且つ基板移送開口部を有し得る直線状の搬送チャンバと、
前記移送開口部を介して基板を前記搬送チャンバとの間で移送可能なように前記チャンバの側面に連通自在に接続しているものであって、前記基板を処理する少なくとも1つの処理モジュールと、
前記基板をその中に保持可能であって、前記チャンバにおいて前記少なくとも1つの処理モジュールと同一側面若しくは反対側面の何れかに選択的に接続されている他のモジュールと、
ベースと前記ベースに運動自在に取り付けられた接続した基板移送アームとを有しており、前記基板を前記移送チャンバと前記少なくとも1つの処理モジュール及び前記他のモジュールの両方との間で移送できるようにリーチを有しており、前記搬送チャンバ内で直線状にトラベルすべく前記チャンバ内に移動自在に取り付けられている搬送ビークルと、からなる基板処理装置であって、
前記チャンバは、前記基板移送アームの前記所定のリーチ用の最小チャンバ幅若しくは最小基板移送開口部幅の少なくとも1つを有していることを特徴とする基板処理装置。 - 少なくとも1つの前記基板移送開口部が前記少なくとも1つの開口部を開閉するドアを有していることを特徴とする請求項10記載の装置。
- 前記少なくとも1つの開口部が閉じられた場合は、前記搬送チャンバが前記少なくとも1つの処理モジュール内の雰囲気から隔離されることを特徴とする請求項11記載の装置。
- 前記搬送チャンバが前記搬送ビークル用のほぼ直線状のトラベルパスを画定する略管形状を有していることを特徴とする請求項10記載の装置。
- 前記少なくとも1つの開口部が閉じられた場合は、前記搬送チャンバが前記他のモジュールとは異なる環境を有することを特徴とする請求項11記載の装置。
- 前記搬送チャンバが伸長した横側面を備えた略管形状を有しており、前記他のモジュールが前記横側面の1つに接続していることを特徴とする請求項10記載の装置。
- 前記搬送ビークルの前記ベースは前記搬送チャンバの少なくとも1つの壁と相互作用し、よって前記搬送ビークルを前記第1チャンバから移動自在に支持していることを特徴とする請求項10記載の装置。
- 前記装置が更に前記搬送ビークルを駆動し且つ前記移送アームを多軸運動せしめる前記搬送チャンバに接続したリニアモータを有することを特徴とする請求項10記載の装置。
- 前記リニアモータがソリッドステートモータであることを特徴とする請求項17記載の装置。
- 前記リニアモータが前記搬送チャンバの少なくとも一部分に沿って、且つ、前記他のモジュールの少なくとも他の一部分に沿って延在していることを特徴とする請求項17記載の装置。
- 外部環境から隔離されることが可能な第1チャンバと、
ベースと前記ベースに運動自在に取り付けられて前記ベースに対して多軸運動が可能な統合した半導体加工部品移送アームとを有するものであって、前記第1チャンバに対して直線状に移動するように前記第1チャンバから移動自在に支持された、前記第1チャンバ内の搬送ビークルと、
前記第1チャンバと前記他のチャンバとの間で前記開口部を介して前記搬送ビークルが移動し得る大きさであって、閉鎖可能な前記第1チャンバの開口部を介して前記第1チャンバに連通自在に接続された他のチャンバと、からなることを特徴とする半導体加工部品処理装置。 - 前記開口部が前記開口部を開閉するドアを有していることを特徴とする請求項20記載の装置。
- 前記開口部が閉じられた場合は、前記第1チャンバが前記他のチャンバ内の環境から隔離されることを特徴とする請求項20記載の装置。
- 前記第1チャンバが略管形状を有しており、前記搬送ビークル用のほぼ直線状のトラベルパスを画定することを特徴とする請求項20記載の装置。
- 前記第1チャンバ及び前記他のチャンバが前記搬送ビークル用のほぼ直線状のトラベルパスを画定することを特徴とする請求項20記載の装置。
- 前記開口部が閉じられた場合は、前記第1チャンバは前記他のチャンバとは異なる環境を有することを特徴とする請求項20記載の装置。
- 前記第1チャンバが伸長した横側面を備えた略管形状を有し、前記他のチャンバが前記横側面の1つに接続していることを特徴とする請求項20記載の装置。
- 前記搬送ビークルの前記ベースが前記第1チャンバ少なくとも1つの壁に相互作用し、よって前記搬送ビークルを前記第1チャンバから移動自在に支持していることを特徴とする請求項20記載の装置。
- 前記装置が更に前記搬送ビークルを駆動し、且つ前記移送アームを多軸運動せしめる前記第1チャンバに接続するリニアモータを有し、前記リニアモータがソリッドステートモータであることを特徴とする請求項4乃至20記載の装置。
- 前記リニアモータが前記第1チャンバの少なくとも一部分に沿って、且つ前記他のチャンバの少なくとも他の一部分に沿って延在していることを特徴とする請求項28記載の装置。
- 前記リニアモータが作用(forcer)要素と反作用要素とを有し、前記作用要素が前記第1チャンバに取り付けられており、よって前記作用要素は前記第1チャンバ内の環境から隔離されていることを特徴とする請求項28記載の装置。
- 前記反作用要素が前記搬送ビークルに取り付けられており、前記作用要素が前記第1チャンバの垂直壁に取り付けられており、前記反作用要素が不活性化された場合は、前記反作用要素は前記第1チャンバの前記垂直壁に作用し、よって前記第1チャンバ内の前記搬送ビークルを安定して支持することを特徴とする請求項30記載の装置。
- 前記移送アームはその上に半導体加工部品を支持するエンドエフェクタを有し、前記移送アームは運動自在に接続されており、よって前記アームは前記半導体加工部品を前記第1チャンバの対向する側面から対向方向に移動することが可能であることを特徴とする請求項20記載の装置。
- 前記移送アームは前記ベースに対して第1軸の周りで回転可能であり、前記エンドエフェクタを前記ベースに対してラジアル状の軸に沿って移送することが可能であることを特徴とする請求項32記載の装置。
- 前記装置が更に前記第1チャンバに連通自在に接続する更に他のチャンバを有し、よって半導体加工部品が前記更に他のチャンバと前記第1チャンバとの間で移送可能であり、前記更に他のチャンバがフロントエンドモジュール、半導体加工部品保持モジュール、若しくは半導体加工部品処理モジュールのうちの少なくとも1つであることを特徴とする請求項20記載の装置。
- 前記他のチャンバが半導体加工部品保持チャンバ、若しくは半導体加工部品処理 チャンバのうちの少なくとも1つであり、前記半導体加工部品処理チャンバがリソグラフィモジュール、金属堆積モジュール、エッチングモジュール、又は加熱若しくは冷却モジュールのうちの少なくとも1つであることを特徴とする請求項20記載の装置。
- 前記他のチャンバが半導体加工部品搬送コンテナをその中に貯蔵する貯蔵部であることを特徴とする請求項20記載の装置。
- 前記他のチャンバがロードロックチャンバであることを特徴とする請求項20記載の装置。
- 前記他のチャンバが前記半導体加工部品搬送コンテナと前記第1チャンバとの間のインターフェースを提供するフロントエンドモジュールであることを特徴とする請求項20記載の装置。
- コントロールされた雰囲気をその中に有し得る搬送チャンバと、
基板を前記搬送チャンバとの間で移送可能なように、前記搬送チャンバに連通自在に接続しているものであって、前記基板を保持する少なくとも1つの基板保持モジュールと、
前記基板を前記搬送チャンバと前記少なくとも1つの基板保持モジュールとの間で動かすようにした第1可動基板移送アームを有するものであって、前記搬送チャンバ内に移動自在に取り付けられた第1搬送ビークルと、
前記基板を前記搬送チャンバと前記少なくとも1つの基板保持モジュールとの間で動かすようにした第2可動基板移送アームを有するものであって、前記搬送チャンバに移動自在に取り付けられた第2搬送ビークルと、からなる基板処理装置であって、
前記搬送チャンバは前記第1及び第2ビークルを前記搬送チャンバ内でトラベルせしめる数個の直線状のトラベルパスを有し、前記第1ビークルが前記トラベルパスの一方を使用しており且つ前記第2ビークルが前記トラベルパスの他方を使用している時に前記第1及び第2ビークルは互いに他方を通り越して移動可能であることを特徴とする基板処理装置。 - 前記トラベルパスが互いにほぼ整列して並んでいることを特徴とする請求項40記載の装置。
- 前記トラベルパスが前記搬送チャンバの長手方向に延在していることを特徴とする請求項40記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39789502P | 2002-07-22 | 2002-07-22 | |
US60/397,895 | 2002-07-22 | ||
PCT/US2003/022881 WO2004010476A2 (en) | 2002-07-22 | 2003-07-22 | Substrate processing apparatus |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011032153A Division JP5543934B2 (ja) | 2002-07-22 | 2011-02-17 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005534176A true JP2005534176A (ja) | 2005-11-10 |
JP4712379B2 JP4712379B2 (ja) | 2011-06-29 |
Family
ID=30771139
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004523280A Expired - Lifetime JP4712379B2 (ja) | 2002-07-22 | 2003-07-22 | 基板処理装置 |
JP2011032153A Expired - Lifetime JP5543934B2 (ja) | 2002-07-22 | 2011-02-17 | 基板処理装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011032153A Expired - Lifetime JP5543934B2 (ja) | 2002-07-22 | 2011-02-17 | 基板処理装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7575406B2 (ja) |
EP (1) | EP1535313B1 (ja) |
JP (2) | JP4712379B2 (ja) |
KR (1) | KR101028065B1 (ja) |
CN (1) | CN1759051B (ja) |
AU (1) | AU2003259203A1 (ja) |
TW (1) | TWI304391B (ja) |
WO (1) | WO2004010476A2 (ja) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008028179A (ja) * | 2006-07-21 | 2008-02-07 | Yaskawa Electric Corp | 搬送機構およびそれを備えた処理装置 |
JP2008544485A (ja) * | 2005-06-10 | 2008-12-04 | アプライド マテリアルズ インコーポレイテッド | 直線真空堆積システム |
JP2009537075A (ja) * | 2006-05-11 | 2009-10-22 | ブルックス オートメーション インコーポレイテッド | 低減容量キャリア、搬送機、積載ポート、緩衝装置システム |
JP2009538540A (ja) * | 2006-05-26 | 2009-11-05 | ブルックス オートメーション インコーポレイテッド | 基板処理装置 |
JP2010520648A (ja) * | 2007-03-06 | 2010-06-10 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | イオン注入システムにおけるウェハ保持ロボットのエンドエフェクタの垂直位置決定 |
JP2011512642A (ja) * | 2007-05-17 | 2011-04-21 | ブルックス オートメーション インコーポレイテッド | 側部開口部基板キャリアおよびロードポート |
JP2011517766A (ja) * | 2007-06-27 | 2011-06-16 | ブルックス オートメーション インコーポレイテッド | 多次元位置センサ |
US8602706B2 (en) | 2009-08-17 | 2013-12-10 | Brooks Automation, Inc. | Substrate processing apparatus |
US8823294B2 (en) | 2007-06-27 | 2014-09-02 | Brooks Automation, Inc. | Commutation of an electromagnetic propulsion and guidance system |
JP2015502667A (ja) * | 2011-12-16 | 2015-01-22 | ブルックス オートメーション インコーポレイテッド | 搬送装置 |
US8960099B2 (en) | 2002-07-22 | 2015-02-24 | Brooks Automation, Inc | Substrate processing apparatus |
US9024488B2 (en) | 2007-06-27 | 2015-05-05 | Brooks Automation, Inc. | Robot drive with magnetic spindle bearings |
US9752615B2 (en) | 2007-06-27 | 2017-09-05 | Brooks Automation, Inc. | Reduced-complexity self-bearing brushless DC motor |
JP2020510310A (ja) * | 2017-03-15 | 2020-04-02 | ラム リサーチ コーポレーションLam Research Corporation | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
US11002566B2 (en) | 2007-06-27 | 2021-05-11 | Brooks Automation, Inc. | Position feedback for self bearing motor |
JP2021524159A (ja) * | 2018-05-18 | 2021-09-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | デュアルロードロックチャンバ |
JP7576555B2 (ja) | 2019-02-14 | 2024-10-31 | パーシモン テクノロジーズ コーポレイション | 2リンクアームを有するリニアロボット |
Families Citing this family (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070183871A1 (en) * | 2002-07-22 | 2007-08-09 | Christopher Hofmeister | Substrate processing apparatus |
US7988398B2 (en) | 2002-07-22 | 2011-08-02 | Brooks Automation, Inc. | Linear substrate transport apparatus |
JP2004282002A (ja) * | 2003-02-27 | 2004-10-07 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
US20050038561A1 (en) * | 2003-08-12 | 2005-02-17 | Kai-Chi Lin | Method, system and computer-readable medium for operating a robot in an AMHS |
JP4493955B2 (ja) * | 2003-09-01 | 2010-06-30 | 東京エレクトロン株式会社 | 基板処理装置及び搬送ケース |
US7458763B2 (en) * | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
KR20070008533A (ko) * | 2003-11-10 | 2007-01-17 | 블루쉬프트 테크놀로지스, 인코포레이티드. | 진공-사용 반도체 핸들링 시스템에서 작업 편을 핸들링하기위한 방법 및 시스템 |
US8639489B2 (en) * | 2003-11-10 | 2014-01-28 | Brooks Automation, Inc. | Methods and systems for controlling a semiconductor fabrication process |
KR100578134B1 (ko) * | 2003-11-10 | 2006-05-10 | 삼성전자주식회사 | 멀티 챔버 시스템 |
US8639365B2 (en) * | 2003-11-10 | 2014-01-28 | Brooks Automation, Inc. | Methods and systems for controlling a semiconductor fabrication process |
US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
US20070282480A1 (en) * | 2003-11-10 | 2007-12-06 | Pannese Patrick D | Methods and systems for controlling a semiconductor fabrication process |
US7354845B2 (en) * | 2004-08-24 | 2008-04-08 | Otb Group B.V. | In-line process for making thin film electronic devices |
TWI278416B (en) * | 2004-12-09 | 2007-04-11 | Au Optronics Corp | Cassette stocker |
JP4577886B2 (ja) * | 2005-01-21 | 2010-11-10 | 東京エレクトロン株式会社 | 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム |
US20060177288A1 (en) * | 2005-02-09 | 2006-08-10 | Parker N W | Multiple loadlocks and processing chamber |
US9099506B2 (en) * | 2005-03-30 | 2015-08-04 | Brooks Automation, Inc. | Transfer chamber between workstations |
US20070201967A1 (en) * | 2005-11-07 | 2007-08-30 | Bufano Michael L | Reduced capacity carrier, transport, load port, buffer system |
US20080107507A1 (en) * | 2005-11-07 | 2008-05-08 | Bufano Michael L | Reduced capacity carrier, transport, load port, buffer system |
US8267634B2 (en) * | 2005-11-07 | 2012-09-18 | Brooks Automation, Inc. | Reduced capacity carrier, transport, load port, buffer system |
EP1945541B1 (en) * | 2005-11-07 | 2013-04-10 | Brooks Automation, Inc. | Transport system |
US8398355B2 (en) * | 2006-05-26 | 2013-03-19 | Brooks Automation, Inc. | Linearly distributed semiconductor workpiece processing tool |
KR20140069354A (ko) | 2006-08-18 | 2014-06-09 | 브룩스 오토메이션 인코퍼레이티드 | 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템 |
US8293066B2 (en) | 2006-09-19 | 2012-10-23 | Brooks Automation, Inc. | Apparatus and methods for transporting and processing substrates |
US9524896B2 (en) | 2006-09-19 | 2016-12-20 | Brooks Automation Inc. | Apparatus and methods for transporting and processing substrates |
US7901539B2 (en) | 2006-09-19 | 2011-03-08 | Intevac, Inc. | Apparatus and methods for transporting and processing substrates |
US8419341B2 (en) | 2006-09-19 | 2013-04-16 | Brooks Automation, Inc. | Linear vacuum robot with Z motion and articulated arm |
KR100873236B1 (ko) * | 2007-06-14 | 2008-12-10 | 주식회사 실트론 | 웨이퍼 처리 장치 |
TWI460401B (zh) * | 2007-06-27 | 2014-11-11 | Brooks Automation Inc | 多維位置感測器 |
JP5421255B2 (ja) | 2007-06-27 | 2014-02-19 | ブルックス オートメーション インコーポレイテッド | 揚上機能および低コギングの特性を伴うモータ固定子 |
KR20100056468A (ko) | 2007-07-17 | 2010-05-27 | 브룩스 오토메이션 인코퍼레이티드 | 챔버 벽들에 일체화된 모터들을 갖는 기판 처리 장치 |
US7770714B2 (en) * | 2007-08-27 | 2010-08-10 | Canon Anelva Corporation | Transfer apparatus |
US7967994B2 (en) * | 2007-10-25 | 2011-06-28 | Ovonyx, Inc. | Method and apparatus for chalcogenide device formation |
CN101971318B (zh) * | 2007-12-28 | 2012-07-04 | 朗姆研究公司 | 晶圆载具驱动装置、其操作方法及用于晶圆线性平移的系统 |
US7984543B2 (en) * | 2008-01-25 | 2011-07-26 | Applied Materials, Inc. | Methods for moving a substrate carrier |
KR20100000146A (ko) * | 2008-06-24 | 2010-01-06 | 주성엔지니어링(주) | 챔버리드를 포함하는 기판처리를 위한 진공챔버 |
KR101466003B1 (ko) | 2008-07-23 | 2014-11-27 | 주식회사 뉴파워 프라즈마 | 다중 기판 처리 챔버 및 이의 가스 유동 제어 방법 |
KR101463983B1 (ko) | 2008-07-23 | 2014-11-27 | 주식회사 뉴파워 프라즈마 | 다중 기판 처리 챔버와 이의 기판 처리 방법 |
US20100193132A1 (en) * | 2008-07-23 | 2010-08-05 | New Power Plasama Co., Ltd. | Multi-workpiece processing chamber and workpiece processing system including the same |
DE102008058805B4 (de) * | 2008-11-24 | 2013-11-21 | Asys Automatic Systems Gmbh & Co. Kg | Bearbeitungssystem für flächige Substrate sowie Umsetzvorrichtung hierfür |
US8886354B2 (en) * | 2009-01-11 | 2014-11-11 | Applied Materials, Inc. | Methods, systems and apparatus for rapid exchange of work material |
KR101543681B1 (ko) | 2009-01-15 | 2015-08-11 | 주성엔지니어링(주) | 기판 처리 시스템 |
TWI538094B (zh) * | 2009-03-31 | 2016-06-11 | 蘭研究公司 | 用以處理盤狀物品的裝置 |
TWI680928B (zh) | 2009-04-10 | 2020-01-01 | 美商辛波提克有限責任公司 | 垂直升降系統及在多層儲存結構往返運送空的貨箱單元之方法 |
WO2010126089A1 (ja) | 2009-04-28 | 2010-11-04 | キヤノンアネルバ株式会社 | 識別情報設定装置、および識別情報設定方法 |
US7957118B2 (en) * | 2009-04-30 | 2011-06-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multi-zone electrostatic chuck and chucking method |
CN101908467B (zh) * | 2009-06-05 | 2012-07-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 在线式基板处理系统 |
US8696815B2 (en) | 2009-09-01 | 2014-04-15 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
US8459922B2 (en) | 2009-11-13 | 2013-06-11 | Brooks Automation, Inc. | Manipulator auto-teach and position correction system |
KR101690970B1 (ko) * | 2010-02-19 | 2016-12-29 | 주성엔지니어링(주) | 기판 처리 시스템 및 기판 반송 방법 |
US9008884B2 (en) | 2010-12-15 | 2015-04-14 | Symbotic Llc | Bot position sensing |
US10822168B2 (en) | 2010-12-15 | 2020-11-03 | Symbotic Llc | Warehousing scalable storage structure |
US9475649B2 (en) | 2010-12-15 | 2016-10-25 | Symbolic, LLC | Pickface builder for storage and retrieval systems |
US8694152B2 (en) | 2010-12-15 | 2014-04-08 | Symbotic, LLC | Maintenance access zones for storage and retrieval systems |
US9579150B2 (en) | 2011-04-08 | 2017-02-28 | Covidien Lp | Microwave ablation instrument with interchangeable antenna probe |
KR20130004830A (ko) * | 2011-07-04 | 2013-01-14 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
TWI622540B (zh) | 2011-09-09 | 2018-05-01 | 辛波提克有限責任公司 | 自動化儲存及取放系統 |
US10476354B2 (en) | 2011-09-16 | 2019-11-12 | Persimmon Technologies Corp. | Robot drive with isolated optical encoder |
JP2013243312A (ja) * | 2012-05-22 | 2013-12-05 | Tokyo Electron Ltd | 搬送装置 |
DE112013003227B4 (de) * | 2012-06-28 | 2023-06-22 | Universal Instruments Corporation | Montagemaschine, Bestückungsmaschine und Verfahren |
DE102012220008B4 (de) * | 2012-11-02 | 2023-06-01 | Syntegon Technology Gmbh | Transportvorrichtung mit steuerbarem Förderelement |
KR102548468B1 (ko) * | 2013-01-22 | 2023-06-27 | 브룩스 오토메이션 인코퍼레이티드 | 기판 이송기 |
KR102350530B1 (ko) | 2013-03-15 | 2022-01-14 | 심보틱 엘엘씨 | 통합 보안 직원 액세스 구역 및 원격 로버 조업 중지를 구비한 자율화된 저장 및 인출 시스템 |
TWI594933B (zh) | 2013-03-15 | 2017-08-11 | 辛波提克有限責任公司 | 自動化貯藏及取放系統 |
US20140271064A1 (en) * | 2013-03-15 | 2014-09-18 | Teradyne, Inc. | Parallel operation of system components |
TWI642028B (zh) | 2013-03-15 | 2018-11-21 | 辛波提克有限責任公司 | 具有整合式受保護的人員接觸區及遠端漫遊機關機之運送系統及自動化儲存和取放系統 |
JP6242603B2 (ja) * | 2013-06-25 | 2017-12-06 | 株式会社ディスコ | ウエーハ加工装置 |
US10424498B2 (en) | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
JP6523296B2 (ja) | 2013-09-13 | 2019-05-29 | シムボティック エルエルシー | 自動保管および取出システム |
KR102503399B1 (ko) | 2013-11-13 | 2023-02-24 | 브룩스 오토메이션 인코퍼레이티드 | 씰링된 로봇 드라이브 |
TWI695447B (zh) | 2013-11-13 | 2020-06-01 | 布魯克斯自動機械公司 | 運送設備 |
KR102383699B1 (ko) | 2013-11-13 | 2022-04-06 | 브룩스 오토메이션 인코퍼레이티드 | 브러쉬리스 전기 기계 제어 방법 및 장치 |
JP2016537948A (ja) | 2013-11-13 | 2016-12-01 | ブルックス オートメーション インコーポレイテッド | 密封スイッチトリラクタンスモータ |
US10840102B2 (en) * | 2013-11-27 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated system, integrated system operation method and film treatment method |
CN106416006B (zh) * | 2014-04-21 | 2021-07-27 | 柿子技术公司 | 具有被隔离的定子和编码器的机器人 |
TWI677046B (zh) * | 2015-04-23 | 2019-11-11 | 美商應用材料股份有限公司 | 半導體處理系統中的外部基板材旋轉 |
KR102701415B1 (ko) * | 2016-03-21 | 2024-09-02 | 퍼시몬 테크놀로지스 코포레이션 | 격리된 광학 인코더를 가진 로봇 구동 |
US10361099B2 (en) | 2017-06-23 | 2019-07-23 | Applied Materials, Inc. | Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems |
EP3655562A1 (en) * | 2017-07-19 | 2020-05-27 | Intevac, Inc. | System for forming nano-laminate optical coating |
US11088004B2 (en) | 2018-01-30 | 2021-08-10 | Brooks Automation, Inc. | Automatic wafer centering method and apparatus |
KR102706036B1 (ko) * | 2018-02-15 | 2024-09-11 | 램 리써치 코포레이션 | 기판 이송 챔버 이동 |
US11574830B2 (en) | 2018-03-16 | 2023-02-07 | Brooks Automation Us, Llc | Substrate transport apparatus |
US11437258B2 (en) * | 2018-08-30 | 2022-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Workpiece storage system, method of storing workpiece, and method of transferring workpiece using the same |
CN109015314A (zh) * | 2018-09-07 | 2018-12-18 | 杭州众硅电子科技有限公司 | 一种化学机械平坦化设备 |
WO2020126040A1 (en) * | 2018-12-21 | 2020-06-25 | Applied Materials, Inc. | Magnetic levitation system, carrier for a magnetic levitation system, vacuum system, and method of transporting a carrier |
US11049740B1 (en) | 2019-12-05 | 2021-06-29 | Applied Materials, Inc. | Reconfigurable mainframe with replaceable interface plate |
US11581203B2 (en) * | 2020-09-02 | 2023-02-14 | Applied Materials, Inc. | Systems for integrating load locks into a factory interface footprint space |
JP7548671B2 (ja) * | 2021-03-17 | 2024-09-10 | 東京エレクトロン株式会社 | 開閉装置及び搬送室 |
US12083666B2 (en) * | 2022-01-27 | 2024-09-10 | Persimmon Technologies Corporation | Traversing robot with multiple end effectors |
CN115224186A (zh) * | 2022-07-25 | 2022-10-21 | 复旦大学 | 约瑟夫森结制备装置、方法及约瑟夫森结 |
US20240213078A1 (en) * | 2022-12-22 | 2024-06-27 | Applied Materials, Inc. | Substrate supports and transfer apparatus for substrate deformation |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06338555A (ja) * | 1992-12-21 | 1994-12-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US5417537A (en) * | 1993-05-07 | 1995-05-23 | Miller; Kenneth C. | Wafer transport device |
JPH07176593A (ja) * | 1993-12-20 | 1995-07-14 | Ebara Corp | 搬送装置 |
JPH07228345A (ja) * | 1994-02-14 | 1995-08-29 | Ebara Corp | トンネル搬送装置 |
US5571325A (en) * | 1992-12-21 | 1996-11-05 | Dainippon Screen Mfg. Co., Ltd. | Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus |
JPH09308292A (ja) * | 1996-05-10 | 1997-11-28 | Canon Inc | ブラシレスモータの駆動装置およびこれを用いた位置決めテーブル |
US5700127A (en) * | 1995-06-27 | 1997-12-23 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
JPH11307614A (ja) * | 1998-04-21 | 1999-11-05 | Samsung Electronics Co Ltd | 半導体素子製造用エッチング設備のマルチチャンバーシステム |
US6318951B1 (en) * | 1999-07-09 | 2001-11-20 | Semitool, Inc. | Robots for microelectronic workpiece handling |
JP2002141293A (ja) * | 2000-08-22 | 2002-05-17 | Asm Japan Kk | 半導体製造装置 |
JP2003197709A (ja) * | 2001-12-25 | 2003-07-11 | Tokyo Electron Ltd | 被処理体の搬送機構及び処理システム |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4624617A (en) * | 1984-10-09 | 1986-11-25 | David Belna | Linear induction semiconductor wafer transportation apparatus |
JPS62114403A (ja) * | 1985-11-13 | 1987-05-26 | Fuji Electric Co Ltd | 搬送装置 |
EP0346815A3 (en) * | 1988-06-13 | 1990-12-19 | Asahi Glass Company Ltd. | Vacuum processing apparatus and transportation system thereof |
JPH04275449A (ja) * | 1991-03-04 | 1992-10-01 | Mitsubishi Heavy Ind Ltd | 磁気搬送装置 |
EP0529157A1 (en) * | 1991-08-22 | 1993-03-03 | Mitsubishi Jukogyo Kabushiki Kaisha | Alternating current magnetic levitation transport system |
US5275709A (en) * | 1991-11-07 | 1994-01-04 | Leybold Aktiengesellschaft | Apparatus for coating substrates, preferably flat, more or less plate-like substrates |
DE69316214T2 (de) * | 1992-07-07 | 1998-08-13 | Ebara Corp | Durch magnetische wirkung schwebende transportvorrichtung |
JP3338343B2 (ja) * | 1992-12-21 | 2002-10-28 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JPH07228344A (ja) * | 1994-02-14 | 1995-08-29 | Ebara Corp | トンネル搬送方法及び装置 |
JPH08119409A (ja) * | 1994-10-27 | 1996-05-14 | Tokyo Electron Ltd | 集合処理装置 |
JP3732250B2 (ja) * | 1995-03-30 | 2006-01-05 | キヤノンアネルバ株式会社 | インライン式成膜装置 |
CH691376A5 (de) * | 1995-10-17 | 2001-07-13 | Unaxis Balzers Ag | Vakuumanlage zur Oberflächenbearbeitung von Werkstücken. |
JPH10214872A (ja) * | 1997-01-28 | 1998-08-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US6053687A (en) * | 1997-09-05 | 2000-04-25 | Applied Materials, Inc. | Cost effective modular-linear wafer processing |
US6235634B1 (en) * | 1997-10-08 | 2001-05-22 | Applied Komatsu Technology, Inc. | Modular substrate processing system |
US6011508A (en) | 1997-10-31 | 2000-01-04 | Magnemotion, Inc. | Accurate position-sensing and communications for guideway operated vehicles |
US6101952A (en) | 1997-12-24 | 2000-08-15 | Magnemotion, Inc. | Vehicle guidance and switching via magnetic forces |
JP4061693B2 (ja) * | 1998-02-05 | 2008-03-19 | 神鋼電機株式会社 | 電子部品製造設備 |
JPH11312723A (ja) * | 1998-04-30 | 1999-11-09 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および方法 |
EP1086485A2 (en) | 1998-05-12 | 2001-03-28 | Semitool, Inc. | Process and manufacturing tool architecture for use in the manufacture of one or more metallization levels on a workpiece |
US6176668B1 (en) | 1998-05-20 | 2001-01-23 | Applied Komatsu Technology, Inc. | In-situ substrate transfer shuttle |
US6206176B1 (en) * | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6517303B1 (en) | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US6540896B1 (en) * | 1998-08-05 | 2003-04-01 | Caliper Technologies Corp. | Open-Field serial to parallel converter |
JP2000150611A (ja) * | 1998-11-06 | 2000-05-30 | Canon Inc | 試料の処理システム |
NL1010836C2 (nl) * | 1998-12-17 | 2000-06-23 | O T B Engineering B V | Oven voor het vervaardigen van zonnecellen. |
US6481558B1 (en) * | 1998-12-18 | 2002-11-19 | Asyst Technologies, Inc. | Integrated load port-conveyor transfer system |
JP2000286318A (ja) * | 1999-01-27 | 2000-10-13 | Shinko Electric Co Ltd | 搬送システム |
DE19921244A1 (de) | 1999-05-07 | 2000-11-16 | Siemens Ag | Anlage zur Bearbeitung von Wafern |
US6361268B1 (en) * | 1999-06-21 | 2002-03-26 | Sri International | Frictionless transport apparatus and method |
WO2001002211A1 (en) | 1999-07-02 | 2001-01-11 | Magnemotion, Inc. | System for inductive transfer of power, communication and position sensing to a guideway-operated vehicle |
DE19945648C2 (de) | 1999-09-23 | 2001-08-02 | Steag Hamatech Ag | Vorrichtung zum Be- und Entladen von Substraten |
JP2001143979A (ja) * | 1999-11-17 | 2001-05-25 | Matsushita Electronics Industry Corp | 半導体基板処理システム |
AU2425401A (en) | 1999-11-23 | 2001-06-04 | Magnemotion, Inc. | Modular linear motor tracks and methods of fabricating same |
US6271606B1 (en) * | 1999-12-23 | 2001-08-07 | Nikon Corporation | Driving motors attached to a stage that are magnetically coupled through a chamber |
JP2001189363A (ja) * | 2000-01-04 | 2001-07-10 | Mitsubishi Electric Corp | 半導体装置製造設備およびその制御方法 |
US6781524B1 (en) | 2000-03-17 | 2004-08-24 | Magnemotion, Inc. | Passive position-sensing and communications for vehicles on a pathway |
TW494523B (en) * | 2000-04-05 | 2002-07-11 | Tokyo Electron Ltd | Processing device |
US6641350B2 (en) * | 2000-04-17 | 2003-11-04 | Hitachi Kokusai Electric Inc. | Dual loading port semiconductor processing equipment |
US6297611B1 (en) * | 2000-07-06 | 2001-10-02 | Genmark Automation | Robot having independent end effector linkage motion |
US20020061248A1 (en) * | 2000-07-07 | 2002-05-23 | Applied Materials, Inc. | High productivity semiconductor wafer processing system |
JP2002068476A (ja) * | 2000-08-29 | 2002-03-08 | Anelva Corp | 磁気搬送装置 |
NL1016733C2 (nl) | 2000-11-29 | 2002-05-31 | Otb Group Bv | Transportinrichting geschikt voor het transporteren van ringvormige producten. |
US6570273B2 (en) | 2001-01-08 | 2003-05-27 | Nikon Corporation | Electric linear motor |
US20020182036A1 (en) | 2001-06-04 | 2002-12-05 | Applied Materials, Inc. | Semiconductor wafer handling robot for linear transfer chamber |
US6752585B2 (en) | 2001-06-13 | 2004-06-22 | Applied Materials Inc | Method and apparatus for transferring a semiconductor substrate |
CN1996552B (zh) * | 2001-08-31 | 2012-09-05 | 克罗辛自动化公司 | 晶片机 |
NL1020633C2 (nl) | 2002-05-21 | 2003-11-24 | Otb Group Bv | Samenstel voor het behandelen van substraten. |
-
2003
- 2003-07-22 US US10/624,987 patent/US7575406B2/en active Active
- 2003-07-22 WO PCT/US2003/022881 patent/WO2004010476A2/en active Application Filing
- 2003-07-22 JP JP2004523280A patent/JP4712379B2/ja not_active Expired - Lifetime
- 2003-07-22 EP EP03765906.7A patent/EP1535313B1/en not_active Expired - Lifetime
- 2003-07-22 KR KR1020057001199A patent/KR101028065B1/ko active IP Right Grant
- 2003-07-22 TW TW092119902A patent/TWI304391B/zh not_active IP Right Cessation
- 2003-07-22 AU AU2003259203A patent/AU2003259203A1/en not_active Abandoned
- 2003-07-22 CN CN03822550.6A patent/CN1759051B/zh not_active Expired - Lifetime
-
2011
- 2011-02-17 JP JP2011032153A patent/JP5543934B2/ja not_active Expired - Lifetime
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06338555A (ja) * | 1992-12-21 | 1994-12-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US5571325A (en) * | 1992-12-21 | 1996-11-05 | Dainippon Screen Mfg. Co., Ltd. | Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus |
US5417537A (en) * | 1993-05-07 | 1995-05-23 | Miller; Kenneth C. | Wafer transport device |
JPH07176593A (ja) * | 1993-12-20 | 1995-07-14 | Ebara Corp | 搬送装置 |
JPH07228345A (ja) * | 1994-02-14 | 1995-08-29 | Ebara Corp | トンネル搬送装置 |
US5700127A (en) * | 1995-06-27 | 1997-12-23 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
JPH09308292A (ja) * | 1996-05-10 | 1997-11-28 | Canon Inc | ブラシレスモータの駆動装置およびこれを用いた位置決めテーブル |
JPH11307614A (ja) * | 1998-04-21 | 1999-11-05 | Samsung Electronics Co Ltd | 半導体素子製造用エッチング設備のマルチチャンバーシステム |
US6503365B1 (en) * | 1998-04-21 | 2003-01-07 | Samsung Electronics Co., Ltd. | Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing |
US6318951B1 (en) * | 1999-07-09 | 2001-11-20 | Semitool, Inc. | Robots for microelectronic workpiece handling |
JP2002141293A (ja) * | 2000-08-22 | 2002-05-17 | Asm Japan Kk | 半導体製造装置 |
JP2003197709A (ja) * | 2001-12-25 | 2003-07-11 | Tokyo Electron Ltd | 被処理体の搬送機構及び処理システム |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8960099B2 (en) | 2002-07-22 | 2015-02-24 | Brooks Automation, Inc | Substrate processing apparatus |
US8651789B2 (en) | 2002-07-22 | 2014-02-18 | Brooks Automation, Inc. | Substrate processing apparatus |
JP2008544485A (ja) * | 2005-06-10 | 2008-12-04 | アプライド マテリアルズ インコーポレイテッド | 直線真空堆積システム |
JP2009537075A (ja) * | 2006-05-11 | 2009-10-22 | ブルックス オートメーション インコーポレイテッド | 低減容量キャリア、搬送機、積載ポート、緩衝装置システム |
KR101415708B1 (ko) * | 2006-05-26 | 2014-07-04 | 브룩스 오토메이션 인코퍼레이티드 | 기판 처리 장치 |
JP2009538540A (ja) * | 2006-05-26 | 2009-11-05 | ブルックス オートメーション インコーポレイテッド | 基板処理装置 |
JP4660434B2 (ja) * | 2006-07-21 | 2011-03-30 | 株式会社安川電機 | 搬送機構およびそれを備えた処理装置 |
JP2008028179A (ja) * | 2006-07-21 | 2008-02-07 | Yaskawa Electric Corp | 搬送機構およびそれを備えた処理装置 |
JP2010520648A (ja) * | 2007-03-06 | 2010-06-10 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | イオン注入システムにおけるウェハ保持ロボットのエンドエフェクタの垂直位置決定 |
JP2011512642A (ja) * | 2007-05-17 | 2011-04-21 | ブルックス オートメーション インコーポレイテッド | 側部開口部基板キャリアおよびロードポート |
US8823294B2 (en) | 2007-06-27 | 2014-09-02 | Brooks Automation, Inc. | Commutation of an electromagnetic propulsion and guidance system |
US9752615B2 (en) | 2007-06-27 | 2017-09-05 | Brooks Automation, Inc. | Reduced-complexity self-bearing brushless DC motor |
US11002566B2 (en) | 2007-06-27 | 2021-05-11 | Brooks Automation, Inc. | Position feedback for self bearing motor |
US8803513B2 (en) | 2007-06-27 | 2014-08-12 | Brooks Automation, Inc. | Multiple dimension position sensor |
JP2011517766A (ja) * | 2007-06-27 | 2011-06-16 | ブルックス オートメーション インコーポレイテッド | 多次元位置センサ |
US9024488B2 (en) | 2007-06-27 | 2015-05-05 | Brooks Automation, Inc. | Robot drive with magnetic spindle bearings |
JP2015043457A (ja) * | 2008-12-09 | 2015-03-05 | ブルックス オートメーション インコーポレイテッド | 基板処理装置 |
US8602706B2 (en) | 2009-08-17 | 2013-12-10 | Brooks Automation, Inc. | Substrate processing apparatus |
JP2015502667A (ja) * | 2011-12-16 | 2015-01-22 | ブルックス オートメーション インコーポレイテッド | 搬送装置 |
JP2020510310A (ja) * | 2017-03-15 | 2020-04-02 | ラム リサーチ コーポレーションLam Research Corporation | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
JP7275039B2 (ja) | 2017-03-15 | 2023-05-17 | ラム リサーチ コーポレーション | リニア真空搬送モジュールを有する省スペースプラットフォームアーキテクチャ |
JP2021524159A (ja) * | 2018-05-18 | 2021-09-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | デュアルロードロックチャンバ |
JP7106681B2 (ja) | 2018-05-18 | 2022-07-26 | アプライド マテリアルズ インコーポレイテッド | デュアルロードロックチャンバ |
JP7576555B2 (ja) | 2019-02-14 | 2024-10-31 | パーシモン テクノロジーズ コーポレイション | 2リンクアームを有するリニアロボット |
Also Published As
Publication number | Publication date |
---|---|
EP1535313B1 (en) | 2018-10-31 |
WO2004010476A2 (en) | 2004-01-29 |
AU2003259203A1 (en) | 2004-02-09 |
EP1535313A2 (en) | 2005-06-01 |
KR20050035247A (ko) | 2005-04-15 |
JP2011139086A (ja) | 2011-07-14 |
TWI304391B (en) | 2008-12-21 |
US7575406B2 (en) | 2009-08-18 |
TW200403183A (en) | 2004-03-01 |
CN1759051B (zh) | 2014-01-08 |
KR101028065B1 (ko) | 2011-04-08 |
EP1535313A4 (en) | 2010-05-26 |
JP5543934B2 (ja) | 2014-07-09 |
JP4712379B2 (ja) | 2011-06-29 |
AU2003259203A8 (en) | 2004-02-09 |
CN1759051A (zh) | 2006-04-12 |
WO2004010476A3 (en) | 2004-06-03 |
US20040151562A1 (en) | 2004-08-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4712379B2 (ja) | 基板処理装置 | |
US8602706B2 (en) | Substrate processing apparatus | |
US8827617B2 (en) | Substrate processing apparatus | |
US9570330B2 (en) | Substrate processing apparatus | |
US8960099B2 (en) | Substrate processing apparatus | |
US20070183871A1 (en) | Substrate processing apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060719 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090421 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20090708 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20090715 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091021 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100202 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100428 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100511 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100802 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100817 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20101109 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20101116 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110217 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110308 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110323 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4712379 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |