JP2005519187A5 - - Google Patents

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Publication number
JP2005519187A5
JP2005519187A5 JP2003568121A JP2003568121A JP2005519187A5 JP 2005519187 A5 JP2005519187 A5 JP 2005519187A5 JP 2003568121 A JP2003568121 A JP 2003568121A JP 2003568121 A JP2003568121 A JP 2003568121A JP 2005519187 A5 JP2005519187 A5 JP 2005519187A5
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Japan
Prior art keywords
aperture mask
deposition
substrate
aperture
polymer
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JP2003568121A
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Japanese (ja)
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JP4490105B2 (ja
JP2005519187A (ja
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Priority claimed from US10/076,174 external-priority patent/US6897164B2/en
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Publication of JP2005519187A5 publication Critical patent/JP2005519187A5/ja
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Publication of JP4490105B2 publication Critical patent/JP4490105B2/ja
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JP2003568121A 2002-02-14 2003-01-21 高分子アパーチャマスクを介して堆積基板上に材料を堆積する方法 Expired - Fee Related JP4490105B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/076,174 US6897164B2 (en) 2002-02-14 2002-02-14 Aperture masks for circuit fabrication
PCT/US2003/001877 WO2003069015A2 (en) 2002-02-14 2003-01-21 Aperture masks for circuit fabrication

Publications (3)

Publication Number Publication Date
JP2005519187A JP2005519187A (ja) 2005-06-30
JP2005519187A5 true JP2005519187A5 (enExample) 2006-03-09
JP4490105B2 JP4490105B2 (ja) 2010-06-23

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JP2003568121A Expired - Fee Related JP4490105B2 (ja) 2002-02-14 2003-01-21 高分子アパーチャマスクを介して堆積基板上に材料を堆積する方法

Country Status (7)

Country Link
US (3) US6897164B2 (enExample)
EP (2) EP1481111A2 (enExample)
JP (1) JP4490105B2 (enExample)
KR (1) KR20040091038A (enExample)
CN (1) CN100519829C (enExample)
AU (1) AU2003209328A1 (enExample)
WO (1) WO2003069015A2 (enExample)

Families Citing this family (171)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1305838B8 (en) * 2000-03-24 2007-10-03 Cymbet Corporation Low-temperature fabrication of thin-film energy-storage devices
KR100848972B1 (ko) * 2001-08-24 2008-07-30 다이니폰 인사츠 가부시키가이샤 진공증착용 다면부착 마스크장치
US20030151118A1 (en) * 2002-02-14 2003-08-14 3M Innovative Properties Company Aperture masks for circuit fabrication
US6897164B2 (en) * 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
US6821348B2 (en) * 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
SG113448A1 (en) * 2002-02-25 2005-08-29 Semiconductor Energy Lab Fabrication system and a fabrication method of a light emitting device
US6727125B2 (en) * 2002-04-17 2004-04-27 Sharp Laboratories Of America, Inc. Multi-pattern shadow mask system and method for laser annealing
US6667215B2 (en) 2002-05-02 2003-12-23 3M Innovative Properties Method of making transistors
KR100480705B1 (ko) * 2002-07-03 2005-04-06 엘지전자 주식회사 유기 ｅｌ 소자 제작용 새도우 마스크 및 그 제조 방법
JP2004183044A (ja) * 2002-12-03 2004-07-02 Seiko Epson Corp マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器
JP2004186395A (ja) * 2002-12-03 2004-07-02 Fujitsu Ltd セラミック基板の製造方法
US7088145B2 (en) * 2002-12-23 2006-08-08 3M Innovative Properties Company AC powered logic circuitry
US7603144B2 (en) * 2003-01-02 2009-10-13 Cymbet Corporation Active wireless tagging system on peel and stick substrate
US6906436B2 (en) * 2003-01-02 2005-06-14 Cymbet Corporation Solid state activity-activated battery device and method
US7294209B2 (en) * 2003-01-02 2007-11-13 Cymbet Corporation Apparatus and method for depositing material onto a substrate using a roll-to-roll mask
US7417782B2 (en) 2005-02-23 2008-08-26 Pixtronix, Incorporated Methods and apparatus for spatial light modulation
US6680521B1 (en) * 2003-04-09 2004-01-20 Newport Fab, Llc High density composite MIM capacitor with reduced voltage dependence in semiconductor dies
US7279777B2 (en) * 2003-05-08 2007-10-09 3M Innovative Properties Company Organic polymers, laminates, and capacitors
US7098525B2 (en) 2003-05-08 2006-08-29 3M Innovative Properties Company Organic polymers, electronic devices, and methods
US7109519B2 (en) * 2003-07-15 2006-09-19 3M Innovative Properties Company Bis(2-acenyl)acetylene semiconductors
US20070178710A1 (en) * 2003-08-18 2007-08-02 3M Innovative Properties Company Method for sealing thin film transistors
US20050079418A1 (en) * 2003-10-14 2005-04-14 3M Innovative Properties Company In-line deposition processes for thin film battery fabrication
US7211351B2 (en) 2003-10-16 2007-05-01 Cymbet Corporation Lithium/air batteries with LiPON as separator and protective barrier and method
US7153180B2 (en) * 2003-11-13 2006-12-26 Eastman Kodak Company Continuous manufacture of flat panel light emitting devices
US20050130422A1 (en) * 2003-12-12 2005-06-16 3M Innovative Properties Company Method for patterning films
US7078937B2 (en) * 2003-12-17 2006-07-18 3M Innovative Properties Company Logic circuitry powered by partially rectified ac waveform
KR20070024473A (ko) * 2004-01-06 2007-03-02 사임베트 코퍼레이션 층상 배리어구조와 그 형성방법
US7223674B2 (en) * 2004-05-06 2007-05-29 Micron Technology, Inc. Methods for forming backside alignment markers useable in semiconductor lithography
US7399668B2 (en) * 2004-09-30 2008-07-15 3M Innovative Properties Company Method for making electronic devices having a dielectric layer surface treatment
US20060086321A1 (en) * 2004-10-22 2006-04-27 Advantech Global, Ltd Substrate-to-mask alignment and securing system with temperature control for use in an automated shadow mask vacuum deposition process
US7298084B2 (en) * 2004-11-02 2007-11-20 3M Innovative Properties Company Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with organic light emitting diodes
KR101074389B1 (ko) * 2004-11-05 2011-10-17 엘지디스플레이 주식회사 박막 식각 방법 및 이를 이용한 액정표시장치의 제조방법
US20060107525A1 (en) * 2004-11-22 2006-05-25 Hamburgen William R Method and system for creating alignment holes in a multilayer structure
US20060128165A1 (en) * 2004-12-13 2006-06-15 3M Innovative Properties Company Method for patterning surface modification
GB0427563D0 (en) * 2004-12-16 2005-01-19 Plastic Logic Ltd A method of semiconductor patterning
US7675665B2 (en) 2005-02-23 2010-03-09 Pixtronix, Incorporated Methods and apparatus for actuating displays
US7755582B2 (en) 2005-02-23 2010-07-13 Pixtronix, Incorporated Display methods and apparatus
US7746529B2 (en) 2005-02-23 2010-06-29 Pixtronix, Inc. MEMS display apparatus
US9082353B2 (en) 2010-01-05 2015-07-14 Pixtronix, Inc. Circuits for controlling display apparatus
US7304785B2 (en) 2005-02-23 2007-12-04 Pixtronix, Inc. Display methods and apparatus
US7405852B2 (en) 2005-02-23 2008-07-29 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US8310442B2 (en) 2005-02-23 2012-11-13 Pixtronix, Inc. Circuits for controlling display apparatus
US7271945B2 (en) * 2005-02-23 2007-09-18 Pixtronix, Inc. Methods and apparatus for actuating displays
US8159428B2 (en) 2005-02-23 2012-04-17 Pixtronix, Inc. Display methods and apparatus
US7304786B2 (en) 2005-02-23 2007-12-04 Pixtronix, Inc. Methods and apparatus for bi-stable actuation of displays
US9158106B2 (en) 2005-02-23 2015-10-13 Pixtronix, Inc. Display methods and apparatus
US8482496B2 (en) 2006-01-06 2013-07-09 Pixtronix, Inc. Circuits for controlling MEMS display apparatus on a transparent substrate
US8519945B2 (en) 2006-01-06 2013-08-27 Pixtronix, Inc. Circuits for controlling display apparatus
US9261694B2 (en) 2005-02-23 2016-02-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US7999994B2 (en) 2005-02-23 2011-08-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US7742016B2 (en) 2005-02-23 2010-06-22 Pixtronix, Incorporated Display methods and apparatus
US7616368B2 (en) 2005-02-23 2009-11-10 Pixtronix, Inc. Light concentrating reflective display methods and apparatus
US9229222B2 (en) 2005-02-23 2016-01-05 Pixtronix, Inc. Alignment methods in fluid-filled MEMS displays
US7502159B2 (en) 2005-02-23 2009-03-10 Pixtronix, Inc. Methods and apparatus for actuating displays
US20070205969A1 (en) 2005-02-23 2007-09-06 Pixtronix, Incorporated Direct-view MEMS display devices and methods for generating images thereon
US7151276B2 (en) * 2005-03-09 2006-12-19 3M Innovative Properties Company Semiconductors containing perfluoroether acyl oligothiophene compounds
US7211679B2 (en) * 2005-03-09 2007-05-01 3M Innovative Properties Company Perfluoroether acyl oligothiophene compounds
US7645478B2 (en) * 2005-03-31 2010-01-12 3M Innovative Properties Company Methods of making displays
US7667929B2 (en) * 2005-04-04 2010-02-23 Hitachi Global Storage Technologies Netherlands B.V. Apparatus, method and system for fabricating a patterned media imprint master
ITRM20050258A1 (it) * 2005-05-25 2006-11-26 Istituto Naz Fisica Nucleare Procedimento di produzione di gioielli, utilizzante tecniche di deposizione pvd e di mascheratura di film metallico o minerale su substrati metallici, minerali, plastici e autoadesivi.
US7507618B2 (en) * 2005-06-27 2009-03-24 3M Innovative Properties Company Method for making electronic devices using metal oxide nanoparticles
JP2009501280A (ja) 2005-07-12 2009-01-15 スリーエム イノベイティブ プロパティズ カンパニー 基材上に材料模様を連続的に付着させるための装置及び方法
WO2007011898A2 (en) * 2005-07-15 2007-01-25 Cymbet Corporation Apparatus and method for making thin-film batteries with soft and hard electrolyte layers
US7776478B2 (en) * 2005-07-15 2010-08-17 Cymbet Corporation Thin-film batteries with polymer and LiPON electrolyte layers and method
US20070012244A1 (en) * 2005-07-15 2007-01-18 Cymbet Corporation Apparatus and method for making thin-film batteries with soft and hard electrolyte layers
US7319153B2 (en) * 2005-07-29 2008-01-15 3M Innovative Properties Company 6,13-Bis(thienyl)pentacene compounds
US7615501B2 (en) * 2005-08-11 2009-11-10 3M Innovative Properties Company Method for making a thin film layer
US7544755B2 (en) * 2005-09-30 2009-06-09 3M Innovative Properties Company Crosslinked polymers with amine binding groups
US7544756B2 (en) * 2005-09-30 2009-06-09 3M Innovative Properties Company Crosslinked polymers with amine binding groups
US7544754B2 (en) * 2005-09-30 2009-06-09 3M Innovative Properties Company Crosslinked polymers with amine binding groups
KR100652442B1 (ko) * 2005-11-09 2006-12-01 삼성전자주식회사 반도체 칩 및 그 제조 방법
US20070137568A1 (en) * 2005-12-16 2007-06-21 Schreiber Brian E Reciprocating aperture mask system and method
US7763114B2 (en) * 2005-12-28 2010-07-27 3M Innovative Properties Company Rotatable aperture mask assembly and deposition system
US8526096B2 (en) 2006-02-23 2013-09-03 Pixtronix, Inc. Mechanical light modulators with stressed beams
US7608679B2 (en) * 2006-03-31 2009-10-27 3M Innovative Properties Company Acene-thiophene copolymers
US7667230B2 (en) * 2006-03-31 2010-02-23 3M Innovative Properties Company Electronic devices containing acene-thiophene copolymers
US7666968B2 (en) * 2006-04-21 2010-02-23 3M Innovative Properties Company Acene-thiophene copolymers with silethynly groups
US7495251B2 (en) * 2006-04-21 2009-02-24 3M Innovative Properties Company Electronic devices containing acene-thiophene copolymers with silylethynyl groups
DE102006024175B3 (de) * 2006-05-23 2007-09-27 Touchtek Corporation, Chunan Verfahren zum Herstellen von primären Mehrschichtelektroden
US7876489B2 (en) 2006-06-05 2011-01-25 Pixtronix, Inc. Display apparatus with optical cavities
US20080011225A1 (en) * 2006-07-11 2008-01-17 Mcclure Donald J Apparatus and methods for continuously depositing a pattern of material onto a substrate
DE102006042617B4 (de) * 2006-09-05 2010-04-08 Q-Cells Se Verfahren zur Erzeugung von lokalen Kontakten
US20080094853A1 (en) 2006-10-20 2008-04-24 Pixtronix, Inc. Light guides and backlight systems incorporating light redirectors at varying densities
KR100836471B1 (ko) * 2006-10-27 2008-06-09 삼성에스디아이 주식회사 마스크 및 이를 이용한 증착 장치
US8357540B2 (en) * 2006-12-21 2013-01-22 3M Innovative Properties Company Polymeric substrates with fluoroalkoxycarbonyl groups for amine capture
US8906703B2 (en) 2006-12-21 2014-12-09 3M Innovative Properties Company Surface-bound fluorinated esters for amine capture
US20080171422A1 (en) * 2007-01-11 2008-07-17 Tokie Jeffrey H Apparatus and methods for fabrication of thin film electronic devices and circuits
US7852546B2 (en) 2007-10-19 2010-12-14 Pixtronix, Inc. Spacers for maintaining display apparatus alignment
US9176318B2 (en) 2007-05-18 2015-11-03 Pixtronix, Inc. Methods for manufacturing fluid-filled MEMS displays
US9944031B2 (en) 2007-02-13 2018-04-17 3M Innovative Properties Company Molded optical articles and methods of making same
KR20090115803A (ko) 2007-02-13 2009-11-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 렌즈를 갖는 ｌｅｄ 소자 및 그 제조 방법
JP5132213B2 (ja) * 2007-07-18 2013-01-30 富士フイルム株式会社 蒸着装置及び蒸着方法並びにその方法を用いてパターン形成した層を有する電子素子及び有機エレクトロルミネッセンス素子
TWI466298B (zh) * 2007-09-11 2014-12-21 Au Optronics Corp 畫素結構的製作方法
KR100947442B1 (ko) * 2007-11-20 2010-03-12 삼성모바일디스플레이주식회사 수직 증착형 마스크 제조장치 및 이를 이용한 수직 증착형마스크의 제조방법
US8248560B2 (en) 2008-04-18 2012-08-21 Pixtronix, Inc. Light guides and backlight systems incorporating prismatic structures and light redirectors
US8169679B2 (en) 2008-10-27 2012-05-01 Pixtronix, Inc. MEMS anchors
JP5623786B2 (ja) 2009-05-22 2014-11-12 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置
JP5328726B2 (ja) 2009-08-25 2013-10-30 三星ディスプレイ株式會社 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法
JP5677785B2 (ja) 2009-08-27 2015-02-25 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
US8876975B2 (en) 2009-10-19 2014-11-04 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101084184B1 (ko) 2010-01-11 2011-11-17 삼성모바일디스플레이주식회사 박막 증착 장치
KR101193186B1 (ko) 2010-02-01 2012-10-19 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
BR112012019383A2 (pt) 2010-02-02 2017-09-12 Pixtronix Inc Circuitos para controlar aparelho de exibição
CN102834763B (zh) 2010-02-02 2015-07-22 皮克斯特罗尼克斯公司 用于制造填充冷密封流体的显示装置的方法
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
KR101202348B1 (ko) 2010-04-06 2012-11-16 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US8894458B2 (en) 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method
KR101223723B1 (ko) 2010-07-07 2013-01-18 삼성디스플레이 주식회사 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
JP5410377B2 (ja) * 2010-07-15 2014-02-05 株式会社ディスコ マスクセット
KR101673017B1 (ko) * 2010-07-30 2016-11-07 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법
KR101723506B1 (ko) 2010-10-22 2017-04-19 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101738531B1 (ko) 2010-10-22 2017-05-23 삼성디스플레이 주식회사 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치
KR20120045865A (ko) 2010-11-01 2012-05-09 삼성모바일디스플레이주식회사 유기층 증착 장치
KR20120065789A (ko) 2010-12-13 2012-06-21 삼성모바일디스플레이주식회사 유기층 증착 장치
KR101760897B1 (ko) 2011-01-12 2017-07-25 삼성디스플레이 주식회사 증착원 및 이를 구비하는 유기막 증착 장치
KR101693578B1 (ko) * 2011-03-24 2017-01-10 삼성디스플레이 주식회사 증착 마스크
KR101852517B1 (ko) 2011-05-25 2018-04-27 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101840654B1 (ko) 2011-05-25 2018-03-22 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101857249B1 (ko) 2011-05-27 2018-05-14 삼성디스플레이 주식회사 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치
KR20130028165A (ko) * 2011-06-21 2013-03-19 삼성디스플레이 주식회사 마스크 유닛
US11996517B2 (en) 2011-06-29 2024-05-28 Space Charge, LLC Electrochemical energy storage devices
US9853325B2 (en) 2011-06-29 2017-12-26 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US10601074B2 (en) 2011-06-29 2020-03-24 Space Charge, LLC Rugged, gel-free, lithium-free, high energy density solid-state electrochemical energy storage devices
US11527774B2 (en) 2011-06-29 2022-12-13 Space Charge, LLC Electrochemical energy storage devices
KR101826068B1 (ko) 2011-07-04 2018-02-07 삼성디스플레이 주식회사 유기층 증착 장치
US9108216B2 (en) 2012-01-12 2015-08-18 Dai Nippon Printing Co., Ltd. Vapor deposition mask, method for producing vapor deposition mask device and method for producing organic semiconductor element
CN105296929B (zh) 2012-01-12 2018-06-08 大日本印刷株式会社 拼版蒸镀掩模的制造方法及有机半导体元件的制造方法
CN105821375A (zh) * 2012-01-12 2016-08-03 大日本印刷株式会社 蒸镀掩模的制造方法及有机半导体元件的制造方法
JP5958690B2 (ja) * 2012-03-29 2016-08-02 パナソニックＩｐマネジメント株式会社 成膜方法
US8897002B2 (en) 2012-06-08 2014-11-25 Apple Inc. Internal components of a portable computing device
US20140065321A1 (en) * 2012-08-31 2014-03-06 Apple Inc. Pull-back design to mitigate plastic sensor cracks
CN103862744A (zh) * 2012-12-10 2014-06-18 昆山允升吉光电科技有限公司 一种复合掩模板
JP6078746B2 (ja) * 2012-12-21 2017-02-15 株式会社ブイ・テクノロジー 蒸着マスクの製造方法
JP5976527B2 (ja) * 2012-12-27 2016-08-23 株式会社ブイ・テクノロジー 蒸着マスク及びその製造方法
US9134552B2 (en) 2013-03-13 2015-09-15 Pixtronix, Inc. Display apparatus with narrow gap electrostatic actuators
JP6142388B2 (ja) * 2013-04-09 2017-06-07 株式会社ブイ・テクノロジー 蒸着マスク及び蒸着マスクの製造方法
WO2014167989A1 (ja) * 2013-04-12 2014-10-16 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP6197423B2 (ja) * 2013-07-11 2017-09-20 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP5846287B1 (ja) * 2013-12-27 2016-01-20 大日本印刷株式会社 フレーム付き蒸着マスクの製造方法、引張装置、有機半導体素子の製造装置及び有機半導体素子の製造方法
CN103757588B (zh) * 2013-12-30 2016-02-03 昆山工研院新型平板显示技术中心有限公司 一种掩膜板及该掩膜板的制备方法和应用
US8927393B1 (en) * 2014-01-29 2015-01-06 Applied Materials, Inc. Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
CN103839864A (zh) * 2014-02-24 2014-06-04 合肥鑫晟光电科技有限公司 一种镀膜对位装置和镀膜系统
CN110306156A (zh) * 2014-06-06 2019-10-08 大日本印刷株式会社 蒸镀掩模及其前体、以及有机半导体元件的制造方法
US20150367452A1 (en) * 2014-06-24 2015-12-24 Indian Institute Of Technology Kanpur Shadow masks and methods for their preparation and use
US20160070096A1 (en) * 2014-09-05 2016-03-10 Pixtronix, Inc. Aperture plate perimeter routing using encapsulated spacer contact
CN107075658B (zh) * 2014-10-23 2019-02-19 夏普株式会社 蒸镀掩模的制造方法、蒸镀掩模、蒸镀装置、蒸镀方法
TWI564408B (zh) * 2015-02-02 2017-01-01 鴻海精密工業股份有限公司 蒸鍍遮罩、蒸鍍方法及蒸鍍遮罩之製造方法
CN106191783A (zh) * 2015-02-02 2016-12-07 鸿海精密工业股份有限公司 蒸镀遮罩、蒸镀方法及蒸镀遮罩之制造方法
CN104993070A (zh) * 2015-07-02 2015-10-21 深圳市华星光电技术有限公司 一种制作柔性oled显示器件的方法
US10768528B2 (en) 2015-09-28 2020-09-08 3M Innovative Properties Company Patterned film article comprising cleavable crosslinker and methods
US10840449B2 (en) 2015-09-30 2020-11-17 Hon Hai Precision Industry Co., Ltd. Method for producing resin film having fine pattern, method for producing organic el display device, base film for forming fine pattern, and resin film provided with supporting member
WO2017119153A1 (ja) * 2016-01-06 2017-07-13 鴻海精密工業股▲ふん▼有限公司 蒸着マスク及びその製造方法、有機ｅｌ表示装置の製造方法
JP6596106B2 (ja) * 2016-01-26 2019-10-23 鴻海精密工業股▲ふん▼有限公司 蒸着マスクの製造方法及びその蒸着マスクを使った有機発光ダイオードの製造方法
KR101817246B1 (ko) * 2016-04-22 2018-01-10 (주)포인트엔지니어링 유기발광다이오드용 마스크
KR102618351B1 (ko) * 2016-07-19 2023-12-28 삼성디스플레이 주식회사 패턴위치조정기구가 구비된 마스크 프레임 조립체 및 그것을 이용한 패턴 위치 조정 방법
KR20220104846A (ko) 2016-10-07 2022-07-26 다이니폰 인사츠 가부시키가이샤 증착 마스크의 제조 방법, 증착 마스크가 배치된 중간 제품 및 증착 마스크
WO2018100739A1 (ja) * 2016-12-02 2018-06-07 シャープ株式会社 蒸着マスク、蒸着装置、蒸着マスクの製造方法、エレクトロルミネッセンス表示装置の製造方法
KR101930450B1 (ko) 2017-05-31 2018-12-18 포항공과대학교 산학협력단 마스크 제조장치와 그의 제조 방법 및 리소그래피용 마스크
JP6521003B2 (ja) * 2017-08-23 2019-05-29 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、及び有機半導体素子の製造方法
KR102480090B1 (ko) * 2017-11-01 2022-12-23 삼성디스플레이 주식회사 증착 마스크의 제조방법
KR101963982B1 (ko) * 2017-12-27 2019-03-29 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법, 및 전자 디바이스의 제조 방법
EP3762989A4 (en) 2018-03-07 2021-12-15 Space Charge, LLC THIN FILM SOLID STATE ENERGY STORAGE DEVICES
US11640934B2 (en) * 2018-03-30 2023-05-02 Intel Corporation Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate
CN110767088B (zh) * 2019-10-28 2022-01-11 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
KR20210091383A (ko) 2020-01-13 2021-07-22 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
JP7055156B2 (ja) * 2020-01-30 2022-04-15 株式会社ジャパンディスプレイ 表示装置製造用マスク
JP2021192363A (ja) * 2020-06-03 2021-12-16 大日本印刷株式会社 電子デバイス、電子デバイスの製造方法及び蒸着マスク群
KR102385554B1 (ko) * 2020-06-16 2022-04-13 재단법인 아산사회복지재단 나노구조체 기반의 표면증강라만 기판 및 그 제조 방법
CN117276559B (zh) * 2022-06-14 2025-01-17 广东小天才科技有限公司 模板及制作方法和应用、中间结构和锂二次电池电极
CN117276476B (zh) * 2022-06-14 2025-02-25 广东小天才科技有限公司 中间结构及制备方法、锂二次电池电极及制备方法
WO2024125833A1 (en) 2022-12-15 2024-06-20 University Of Copenhagen Polarizer stencil mask

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3669060A (en) 1970-09-24 1972-06-13 Westinghouse Electric Corp Mask changing mechanism for use in the evaporation of thin film devices
US3995283A (en) * 1976-01-05 1976-11-30 Zenith Radio Corporation Screening lighthouse for color cathode ray tubes
US4096821A (en) 1976-12-13 1978-06-27 Westinghouse Electric Corp. System for fabricating thin-film electronic components
US4677738A (en) 1980-05-19 1987-07-07 Energy Conversion Devices, Inc. Method of making a photovoltaic panel
US4335161A (en) 1980-11-03 1982-06-15 Xerox Corporation Thin film transistors, thin film transistor arrays, and a process for preparing the same
DE3128982C2 (de) 1981-07-22 1985-12-12 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung mindestens eines Josephson-Tunnelelementes
DE3374790D1 (en) 1983-03-11 1988-01-14 Hitachi Ltd Method for forming thin films
JPS59179777A (ja) * 1983-03-30 1984-10-12 Ulvac Corp 連続薄膜形成装置に於けるパタ−ン形成装置
US4676193A (en) 1984-02-27 1987-06-30 Applied Magnetics Corporation Stabilized mask assembly for direct deposition of a thin film pattern onto a substrate
US4883359A (en) * 1984-02-28 1989-11-28 Canon Kabushiki Kaisha Alignment method and pattern forming method using the same
JPS61130480A (ja) 1984-11-30 1986-06-18 Hitachi Maxell Ltd 蒸着用マスク
DE3604368A1 (de) 1985-02-13 1986-08-14 Sharp K.K., Osaka Verfahren zur herstellung eines duennfilm-transistors
US4963921A (en) 1985-06-24 1990-10-16 Canon Kabushiki Kaisha Device for holding a mask
US4746548A (en) 1985-10-23 1988-05-24 Gte Products Corporation Method for registration of shadow masked thin-film patterns
US4915057A (en) 1985-10-23 1990-04-10 Gte Products Corporation Apparatus and method for registration of shadow masked thin-film patterns
US4877738A (en) * 1986-07-25 1989-10-31 Wisconsin Alumni Research Foundation Biological control of damping off and root rot and inoculum preparation therefor
US5154797A (en) 1991-08-14 1992-10-13 The United States Of America As Represented By The Secretary Of The Army Silicon shadow mask
JPH05228669A (ja) 1991-12-27 1993-09-07 Polymer Processing Res Inst 光線による穴開きウェブの製法および装置
GB2276589B (en) 1993-04-03 1996-07-31 David Godfrey Williams Improved stencil or mask for applying solder to circuit boards
JP3402681B2 (ja) * 1993-06-02 2003-05-06 サンエー技研株式会社 露光における位置合わせ方法
US5397607A (en) 1994-05-17 1995-03-14 International Business Machines Corporation Input/output (I/O) thin film repair process
TW289901B (enExample) 1994-12-28 1996-11-01 Ricoh Microelectronics Kk
US5626784A (en) 1995-03-31 1997-05-06 Motorola, Inc. In-situ sizing of photolithographic mask or the like, and frame therefore
WO1996033839A1 (en) 1995-04-26 1996-10-31 Minnesota Mining And Manufacturing Company Method and apparatus for step and repeat exposures
US5648188A (en) * 1995-06-07 1997-07-15 International Business Machines Corporation Real time alignment system for a projection electron beam lithographic system
JPH0927454A (ja) 1995-07-13 1997-01-28 Fuji Electric Co Ltd 選択蒸着用マスク
US5710619A (en) * 1995-10-31 1998-01-20 Anvik Corporation Large-area, scan-and-repeat, projection patterning system with unitary stage and magnification control capability
US6106627A (en) 1996-04-04 2000-08-22 Sigma Laboratories Of Arizona, Inc. Apparatus for producing metal coated polymers
JP2833605B2 (ja) 1997-02-07 1998-12-09 日本電気株式会社 発光ディスプレイの製造方法
JP3999837B2 (ja) * 1997-02-10 2007-10-31 Ｔｄｋ株式会社 有機エレクトロルミネッセンス表示装置
DE29707686U1 (de) * 1997-04-28 1997-06-26 Balzers Prozess Systeme Vertriebs- und Service GmbH, 81245 München Magnethalterung für Folienmasken
JPH10319870A (ja) 1997-05-15 1998-12-04 Nec Corp シャドウマスク及びこれを用いたカラー薄膜ｅｌ表示装置の製造方法
US6040892A (en) 1997-08-19 2000-03-21 Micron Technology, Inc. Multiple image reticle for forming layers
US6071597A (en) * 1997-08-28 2000-06-06 3M Innovative Properties Company Flexible circuits and carriers and process for manufacture
AU1503199A (en) 1997-12-08 1999-06-28 Peter Anthony Fry Herbert A method and apparatus for the production of multilayer electrical components
US6087196A (en) 1998-01-30 2000-07-11 The Trustees Of Princeton University Fabrication of organic semiconductor devices using ink jet printing
JP2002512124A (ja) 1998-04-21 2002-04-23 プレジデント・アンド・フェローズ・オブ・ハーバード・カレッジ エラストマ・マスク、およびピクセル化されたエレクトロルミネセンス・ディスプレイを含む装置の製造における使用
KR100451381B1 (ko) 1998-07-30 2005-06-01 엘지.필립스 엘시디 주식회사 박막트랜지스터및그제조방법
US6384529B2 (en) 1998-11-18 2002-05-07 Eastman Kodak Company Full color active matrix organic electroluminescent display panel having an integrated shadow mask
US6168845B1 (en) * 1999-01-19 2001-01-02 International Business Machines Corporation Patterned magnetic media and method of making the same using selective oxidation
ATE450895T1 (de) 1999-07-21 2009-12-15 E Ink Corp Bevorzugte methode, elektrische leiterbahnen für die kontrolle eines elektronischen displays herzustellen
JP3870014B2 (ja) * 1999-07-26 2007-01-17 キヤノン株式会社 真空処理装置および真空処理方法
US6741019B1 (en) * 1999-10-18 2004-05-25 Agere Systems, Inc. Article comprising aligned nanowires
US6259408B1 (en) * 1999-11-19 2001-07-10 Intermec Ip Corp. RFID transponders with paste antennas and flip-chip attachment
TW504605B (en) * 1999-12-03 2002-10-01 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the same, the device and mask
JP3415551B2 (ja) * 2000-03-27 2003-06-09 日本電気株式会社 半導体装置の製造方法
US20020110733A1 (en) 2000-08-07 2002-08-15 Johnson Lonnie G. Systems and methods for producing multilayer thin film energy storage devices
KR100382491B1 (ko) 2000-11-28 2003-05-09 엘지전자 주식회사 유기 ｅｌ의 새도우 마스크
JP2002184669A (ja) * 2000-12-14 2002-06-28 Hitachi Ltd 半導体集積回路装置の製造方法
US6611453B2 (en) * 2001-01-24 2003-08-26 Infineon Technologies Ag Self-aligned cross-point MRAM device with aluminum metallization layers
JP4092914B2 (ja) 2001-01-26 2008-05-28 セイコーエプソン株式会社 マスクの製造方法、有機エレクトロルミネッセンス装置の製造方法
US6440816B1 (en) * 2001-01-30 2002-08-27 Agere Systems Guardian Corp. Alignment mark fabrication process to limit accumulation of errors in level to level overlay
US7396558B2 (en) * 2001-01-31 2008-07-08 Toray Industries, Inc. Integrated mask and method and apparatus for manufacturing organic EL device using the same
US6455931B1 (en) * 2001-05-15 2002-09-24 Raytheon Company Monolithic microelectronic array structure having substrate islands and its fabrication
AU2002322301A1 (en) 2001-06-26 2003-03-03 Gene Logic, Inc. Methods for the diagnosis and treatment of cardiac tissue rejection
US6635496B2 (en) * 2001-10-12 2003-10-21 Infineon Technologies, Ag Plate-through hard mask for MRAM devices
US6589382B2 (en) * 2001-11-26 2003-07-08 Eastman Kodak Company Aligning mask segments to provide a stitched mask for producing OLED devices
US6897164B2 (en) * 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
US6821348B2 (en) * 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
US20030151118A1 (en) * 2002-02-14 2003-08-14 3M Innovative Properties Company Aperture masks for circuit fabrication
JP4044769B2 (ja) * 2002-02-22 2008-02-06 富士通株式会社 半導体装置用基板及びその製造方法及び半導体パッケージ
US6667215B2 (en) * 2002-05-02 2003-12-23 3M Innovative Properties Method of making transistors
JP4280509B2 (ja) * 2003-01-31 2009-06-17 キヤノン株式会社 投影露光用マスク、投影露光用マスクの製造方法、投影露光装置および投影露光方法
US7153180B2 (en) * 2003-11-13 2006-12-26 Eastman Kodak Company Continuous manufacture of flat panel light emitting devices

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