JP2005338849A - 感光性樹脂組成物、ｌｃｄ基板及びｌｃｄ基板のパターン形成方法 - Google Patents

感光性樹脂組成物、ｌｃｄ基板及びｌｃｄ基板のパターン形成方法 Download PDF

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Publication number
JP2005338849A
JP2005338849A JP2005153818A JP2005153818A JP2005338849A JP 2005338849 A JP2005338849 A JP 2005338849A JP 2005153818 A JP2005153818 A JP 2005153818A JP 2005153818 A JP2005153818 A JP 2005153818A JP 2005338849 A JP2005338849 A JP 2005338849A
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JP
Japan
Prior art keywords
photosensitive resin
resin composition
acrylate
methacrylate
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005153818A
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English (en)
Japanese (ja)
Inventor
Tefun Yo
テフン ヨ
Byonuku Kim
ビョンウク キム
Dong Min Kim
ドンミン キム
Hyokumin Yun
ヒョクミン ユン
Kihyoku Kuu
キヒョク クー
Ju-Pyo Yun
ジューピョ ユン
Uichoru Jon
ウイチョル ジョン
Donmyon Kim
ドンミョン キム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongjin Semichem Co Ltd
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of JP2005338849A publication Critical patent/JP2005338849A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2005153818A 2004-05-27 2005-05-26 感光性樹脂組成物、ｌｃｄ基板及びｌｃｄ基板のパターン形成方法 Pending JP2005338849A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040037951A KR20050113351A (ko) 2004-05-27 2004-05-27 감광성 수지 조성물

Publications (1)

Publication Number Publication Date
JP2005338849A true JP2005338849A (ja) 2005-12-08

Family

ID=35492413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005153818A Pending JP2005338849A (ja) 2004-05-27 2005-05-26 感光性樹脂組成物、ｌｃｄ基板及びｌｃｄ基板のパターン形成方法

Country Status (4)

Country Link
JP (1) JP2005338849A (zh)
KR (1) KR20050113351A (zh)
CN (1) CN1702554B (zh)
TW (1) TWI403836B (zh)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006126397A (ja) * 2004-10-28 2006-05-18 Jsr Corp 感光性樹脂組成物、表示パネル用スペーサーおよび表示パネル
JP2006336016A (ja) * 2005-06-04 2006-12-14 Samsung Electronics Co Ltd 感光性樹脂組成物と、これを用いた薄膜トランジスタ基板の製造方法、及び共通電極基板の製造方法
JP2007224293A (ja) * 2006-02-03 2007-09-06 Samsung Electronics Co Ltd 有機絶縁膜用樹脂組成物及びその製造方法、前記樹脂組成物を含む表示板
WO2007132890A1 (ja) * 2006-05-16 2007-11-22 Nissan Chemical Industries, Ltd. ポジ型感光性樹脂組成物及びそれから得られる多孔質膜
JP2008216569A (ja) * 2007-03-02 2008-09-18 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物
JP2009126942A (ja) * 2007-11-22 2009-06-11 Jsr Corp 硬化性樹脂組成物、保護膜および保護膜の形成方法
JP2010151999A (ja) * 2008-12-24 2010-07-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2010152336A (ja) * 2008-11-18 2010-07-08 Sumitomo Chemical Co Ltd 感光性樹脂組成物及び表示装置
CN101825843A (zh) * 2009-03-02 2010-09-08 株式会社东进世美肯 感光性树脂组合物
JP2014071373A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2014164305A (ja) * 2013-02-27 2014-09-08 Samsung Display Co Ltd 感光性樹脂造成物及びこれを用いた表示装置
US20150004547A1 (en) * 2008-07-14 2015-01-01 Jsr Corporation Resin composition for making resist pattern insoluble, and method for formation of resist pattern by using the same
JP2018146978A (ja) * 2018-05-31 2018-09-20 旭化成株式会社 感光性樹脂組成物

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4905700B2 (ja) * 2007-05-16 2012-03-28 Ｊｓｒ株式会社 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズならびにそれらの形成方法
JP5451048B2 (ja) * 2008-12-05 2014-03-26 株式会社ダイセル 共重合体及び感光性樹脂組成物
KR101717784B1 (ko) * 2009-03-31 2017-03-17 도쿄 오카 고교 가부시키가이샤 감광성 수지 조성물 및 액정 패널
KR102194981B1 (ko) * 2013-10-24 2020-12-29 삼성디스플레이 주식회사 표시기판 제조방법 및 이를 이용한 표시장치 제조방법
KR102630945B1 (ko) * 2015-11-20 2024-01-30 주식회사 동진쎄미켐 감광성 수지 조성물
KR102433199B1 (ko) * 2017-03-09 2022-08-17 주식회사 동진쎄미켐 포지티브형 감광성 수지 조성물
KR102655952B1 (ko) * 2018-10-31 2024-04-09 주식회사 동진쎄미켐 포지티브형 감광성 수지 조성물

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05165214A (ja) * 1991-12-11 1993-07-02 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH0675370A (ja) * 1992-08-25 1994-03-18 Kansai Paint Co Ltd ポジ型感光性カチオン電着レジスト組成物およびこの組成物を用いたプリント配線基板の製造方法
JPH06348017A (ja) * 1993-06-08 1994-12-22 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH08262709A (ja) * 1995-03-24 1996-10-11 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH09146276A (ja) * 1995-11-22 1997-06-06 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH09230596A (ja) * 1996-02-23 1997-09-05 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH11174673A (ja) * 1997-12-17 1999-07-02 Jsr Corp 表示パネルスペーサー用感放射線性樹脂組成物
JP2000250208A (ja) * 1999-03-03 2000-09-14 Jsr Corp 感放射線性樹脂組成物
JP2000327875A (ja) * 1999-05-21 2000-11-28 Jsr Corp カラーフィルター保護膜またはｔｆｔ層間絶縁膜と一体となったスペーサー用感放射線性樹脂組成物
JP2002287351A (ja) * 2001-03-28 2002-10-03 Jsr Corp 感放射線性樹脂組成物、その層間絶縁膜およびマイクロレンズの形成への使用、ならびに層間絶縁膜およびマイクロレンズ
WO2003017001A1 (en) * 2001-08-20 2003-02-27 Dongjin Semichem Co., Ltd. Photosensitive resin composition for photoresist
JP2003076012A (ja) * 2001-09-07 2003-03-14 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物及びそれを用いたパターンの形成方法
WO2003036388A1 (en) * 2001-10-24 2003-05-01 Dongjin Semichem Co., Ltd. Photosnesitive resin composition comprising quinonediazide sulfate ester compound
JP2004004733A (ja) * 2002-04-15 2004-01-08 Sharp Corp 感放射線性樹脂組成物、パターン状絶縁性被膜の形成方法、アクティブマトリクス基板およびそれを備えた平面表示装置、並びに平面表示装置の製造方法
JP2005070735A (ja) * 2003-08-01 2005-03-17 Jsr Corp 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法
JP2005134440A (ja) * 2003-10-28 2005-05-26 Jsr Corp 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478682A (en) * 1993-05-27 1995-12-26 Japan Synthetic Rubber Co., Ltd. Method for domain-dividing liquid crystal alignment film and liquid crystal device using domain-divided alignment film
JP2000347397A (ja) * 1999-06-04 2000-12-15 Jsr Corp 感放射線性樹脂組成物およびその層間絶縁膜への使用
KR100824356B1 (ko) * 2002-01-09 2008-04-22 삼성전자주식회사 감광성 수지 조성물 및 이를 사용한 패턴의 형성방법
US6984476B2 (en) * 2002-04-15 2006-01-10 Sharp Kabushiki Kaisha Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05165214A (ja) * 1991-12-11 1993-07-02 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH0675370A (ja) * 1992-08-25 1994-03-18 Kansai Paint Co Ltd ポジ型感光性カチオン電着レジスト組成物およびこの組成物を用いたプリント配線基板の製造方法
JPH06348017A (ja) * 1993-06-08 1994-12-22 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH08262709A (ja) * 1995-03-24 1996-10-11 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH09146276A (ja) * 1995-11-22 1997-06-06 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH09230596A (ja) * 1996-02-23 1997-09-05 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JPH11174673A (ja) * 1997-12-17 1999-07-02 Jsr Corp 表示パネルスペーサー用感放射線性樹脂組成物
JP2000250208A (ja) * 1999-03-03 2000-09-14 Jsr Corp 感放射線性樹脂組成物
JP2000327875A (ja) * 1999-05-21 2000-11-28 Jsr Corp カラーフィルター保護膜またはｔｆｔ層間絶縁膜と一体となったスペーサー用感放射線性樹脂組成物
JP2002287351A (ja) * 2001-03-28 2002-10-03 Jsr Corp 感放射線性樹脂組成物、その層間絶縁膜およびマイクロレンズの形成への使用、ならびに層間絶縁膜およびマイクロレンズ
WO2003017001A1 (en) * 2001-08-20 2003-02-27 Dongjin Semichem Co., Ltd. Photosensitive resin composition for photoresist
JP2003076012A (ja) * 2001-09-07 2003-03-14 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物及びそれを用いたパターンの形成方法
WO2003036388A1 (en) * 2001-10-24 2003-05-01 Dongjin Semichem Co., Ltd. Photosnesitive resin composition comprising quinonediazide sulfate ester compound
JP2004004733A (ja) * 2002-04-15 2004-01-08 Sharp Corp 感放射線性樹脂組成物、パターン状絶縁性被膜の形成方法、アクティブマトリクス基板およびそれを備えた平面表示装置、並びに平面表示装置の製造方法
JP2005070735A (ja) * 2003-08-01 2005-03-17 Jsr Corp 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法
JP2005134440A (ja) * 2003-10-28 2005-05-26 Jsr Corp 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006126397A (ja) * 2004-10-28 2006-05-18 Jsr Corp 感光性樹脂組成物、表示パネル用スペーサーおよび表示パネル
JP2006336016A (ja) * 2005-06-04 2006-12-14 Samsung Electronics Co Ltd 感光性樹脂組成物と、これを用いた薄膜トランジスタ基板の製造方法、及び共通電極基板の製造方法
JP2007224293A (ja) * 2006-02-03 2007-09-06 Samsung Electronics Co Ltd 有機絶縁膜用樹脂組成物及びその製造方法、前記樹脂組成物を含む表示板
WO2007132890A1 (ja) * 2006-05-16 2007-11-22 Nissan Chemical Industries, Ltd. ポジ型感光性樹脂組成物及びそれから得られる多孔質膜
JP2008216569A (ja) * 2007-03-02 2008-09-18 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物
JP2009126942A (ja) * 2007-11-22 2009-06-11 Jsr Corp 硬化性樹脂組成物、保護膜および保護膜の形成方法
US20150004547A1 (en) * 2008-07-14 2015-01-01 Jsr Corporation Resin composition for making resist pattern insoluble, and method for formation of resist pattern by using the same
US9029067B2 (en) * 2008-07-14 2015-05-12 Jsr Corporation Resin composition for making resist pattern insoluble, and method for formation of resist pattern by using the same
JP2010152336A (ja) * 2008-11-18 2010-07-08 Sumitomo Chemical Co Ltd 感光性樹脂組成物及び表示装置
JP2010151999A (ja) * 2008-12-24 2010-07-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物
CN101825843B (zh) * 2009-03-02 2013-12-04 株式会社东进世美肯 感光性树脂组合物、tft-lcd及tft-lcd用层间有机绝缘膜形成方法
CN101825843A (zh) * 2009-03-02 2010-09-08 株式会社东进世美肯 感光性树脂组合物
JP2014071373A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2014164305A (ja) * 2013-02-27 2014-09-08 Samsung Display Co Ltd 感光性樹脂造成物及びこれを用いた表示装置
JP2018146978A (ja) * 2018-05-31 2018-09-20 旭化成株式会社 感光性樹脂組成物

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Publication number Publication date
TW200613907A (en) 2006-05-01
KR20050113351A (ko) 2005-12-02
TWI403836B (zh) 2013-08-01
CN1702554B (zh) 2010-08-18
CN1702554A (zh) 2005-11-30

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