JP2005317827A - リードフレームの製造方法 - Google Patents

リードフレームの製造方法 Download PDF

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Publication number
JP2005317827A
JP2005317827A JP2004135227A JP2004135227A JP2005317827A JP 2005317827 A JP2005317827 A JP 2005317827A JP 2004135227 A JP2004135227 A JP 2004135227A JP 2004135227 A JP2004135227 A JP 2004135227A JP 2005317827 A JP2005317827 A JP 2005317827A
Authority
JP
Japan
Prior art keywords
lead frame
pattern
workpiece
connecting portion
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004135227A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005317827A5 (https=
Inventor
Takeshi Kobayashi
剛 小林
Yoshio Furuhata
吉雄 古畑
Fumio Yamagishi
二三夫 山岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2004135227A priority Critical patent/JP2005317827A/ja
Priority to SG200502571A priority patent/SG116647A1/en
Priority to CNB2005100679244A priority patent/CN100431119C/zh
Priority to TW094113846A priority patent/TW200541037A/zh
Publication of JP2005317827A publication Critical patent/JP2005317827A/ja
Publication of JP2005317827A5 publication Critical patent/JP2005317827A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2004135227A 2004-04-30 2004-04-30 リードフレームの製造方法 Pending JP2005317827A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004135227A JP2005317827A (ja) 2004-04-30 2004-04-30 リードフレームの製造方法
SG200502571A SG116647A1 (en) 2004-04-30 2005-04-27 Lead frame manufacturing method.
CNB2005100679244A CN100431119C (zh) 2004-04-30 2005-04-28 引线框架的制造方法
TW094113846A TW200541037A (en) 2004-04-30 2005-04-29 Lead frame manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004135227A JP2005317827A (ja) 2004-04-30 2004-04-30 リードフレームの製造方法

Publications (2)

Publication Number Publication Date
JP2005317827A true JP2005317827A (ja) 2005-11-10
JP2005317827A5 JP2005317827A5 (https=) 2008-08-28

Family

ID=35353134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004135227A Pending JP2005317827A (ja) 2004-04-30 2004-04-30 リードフレームの製造方法

Country Status (4)

Country Link
JP (1) JP2005317827A (https=)
CN (1) CN100431119C (https=)
SG (1) SG116647A1 (https=)
TW (1) TW200541037A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158828A (ja) * 2007-12-27 2009-07-16 Shinko Electric Ind Co Ltd リードフレームシートのブリッジ切除方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101937896A (zh) * 2010-04-22 2011-01-05 苏州固锝电子股份有限公司 一种用于制造整流器的引线框
CN107195610A (zh) * 2017-05-16 2017-09-22 四川旭茂微科技有限公司 一种新型整流桥的引线框架

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183552B2 (ja) * 1992-03-31 2001-07-09 新光電気工業株式会社 多層リードフレームの製造方法
JPH06188347A (ja) * 1992-08-10 1994-07-08 Mitsui High Tec Inc リードフレームの製造方法およびその製造装置
JPH09237927A (ja) * 1995-12-26 1997-09-09 Toshiba Corp 半導体薄膜形成方法および太陽電池の製造方法
JP3269392B2 (ja) * 1996-03-07 2002-03-25 凸版印刷株式会社 リードフレーム構造体
JPH1161442A (ja) * 1997-08-26 1999-03-05 Toppan Printing Co Ltd エッチング部品構造体
JP2000073186A (ja) * 1998-08-28 2000-03-07 Mitsui High Tec Inc エッチング製品ユニットフレームの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158828A (ja) * 2007-12-27 2009-07-16 Shinko Electric Ind Co Ltd リードフレームシートのブリッジ切除方法

Also Published As

Publication number Publication date
SG116647A1 (en) 2005-11-28
CN1694233A (zh) 2005-11-09
TW200541037A (en) 2005-12-16
CN100431119C (zh) 2008-11-05

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