TW200541037A - Lead frame manufacturing method - Google Patents

Lead frame manufacturing method Download PDF

Info

Publication number
TW200541037A
TW200541037A TW094113846A TW94113846A TW200541037A TW 200541037 A TW200541037 A TW 200541037A TW 094113846 A TW094113846 A TW 094113846A TW 94113846 A TW94113846 A TW 94113846A TW 200541037 A TW200541037 A TW 200541037A
Authority
TW
Taiwan
Prior art keywords
lead frame
workpiece
pattern
sheet
frame sheet
Prior art date
Application number
TW094113846A
Other languages
English (en)
Chinese (zh)
Inventor
Tsuyoshi Kobayashi
Yoshio Furuhata
Fumio Yamagishi
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200541037A publication Critical patent/TW200541037A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
TW094113846A 2004-04-30 2005-04-29 Lead frame manufacturing method TW200541037A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004135227A JP2005317827A (ja) 2004-04-30 2004-04-30 リードフレームの製造方法

Publications (1)

Publication Number Publication Date
TW200541037A true TW200541037A (en) 2005-12-16

Family

ID=35353134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113846A TW200541037A (en) 2004-04-30 2005-04-29 Lead frame manufacturing method

Country Status (4)

Country Link
JP (1) JP2005317827A (https=)
CN (1) CN100431119C (https=)
SG (1) SG116647A1 (https=)
TW (1) TW200541037A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367259B2 (ja) * 2007-12-27 2013-12-11 新光電気工業株式会社 ブリッジ切除方法及びリードフレーム条
CN101937896A (zh) * 2010-04-22 2011-01-05 苏州固锝电子股份有限公司 一种用于制造整流器的引线框
CN107195610A (zh) * 2017-05-16 2017-09-22 四川旭茂微科技有限公司 一种新型整流桥的引线框架

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183552B2 (ja) * 1992-03-31 2001-07-09 新光電気工業株式会社 多層リードフレームの製造方法
JPH06188347A (ja) * 1992-08-10 1994-07-08 Mitsui High Tec Inc リードフレームの製造方法およびその製造装置
JPH09237927A (ja) * 1995-12-26 1997-09-09 Toshiba Corp 半導体薄膜形成方法および太陽電池の製造方法
JP3269392B2 (ja) * 1996-03-07 2002-03-25 凸版印刷株式会社 リードフレーム構造体
JPH1161442A (ja) * 1997-08-26 1999-03-05 Toppan Printing Co Ltd エッチング部品構造体
JP2000073186A (ja) * 1998-08-28 2000-03-07 Mitsui High Tec Inc エッチング製品ユニットフレームの製造方法

Also Published As

Publication number Publication date
SG116647A1 (en) 2005-11-28
JP2005317827A (ja) 2005-11-10
CN1694233A (zh) 2005-11-09
CN100431119C (zh) 2008-11-05

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