CN100431119C - 引线框架的制造方法 - Google Patents

引线框架的制造方法 Download PDF

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Publication number
CN100431119C
CN100431119C CNB2005100679244A CN200510067924A CN100431119C CN 100431119 C CN100431119 C CN 100431119C CN B2005100679244 A CNB2005100679244 A CN B2005100679244A CN 200510067924 A CN200510067924 A CN 200510067924A CN 100431119 C CN100431119 C CN 100431119C
Authority
CN
China
Prior art keywords
lead frame
workpiece
frame piece
support
rectangular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100679244A
Other languages
English (en)
Chinese (zh)
Other versions
CN1694233A (zh
Inventor
小林刚
古畑吉雄
山岸二三夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN1694233A publication Critical patent/CN1694233A/zh
Application granted granted Critical
Publication of CN100431119C publication Critical patent/CN100431119C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
CNB2005100679244A 2004-04-30 2005-04-28 引线框架的制造方法 Expired - Fee Related CN100431119C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004135227A JP2005317827A (ja) 2004-04-30 2004-04-30 リードフレームの製造方法
JP135227/2004 2004-04-30

Publications (2)

Publication Number Publication Date
CN1694233A CN1694233A (zh) 2005-11-09
CN100431119C true CN100431119C (zh) 2008-11-05

Family

ID=35353134

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100679244A Expired - Fee Related CN100431119C (zh) 2004-04-30 2005-04-28 引线框架的制造方法

Country Status (4)

Country Link
JP (1) JP2005317827A (https=)
CN (1) CN100431119C (https=)
SG (1) SG116647A1 (https=)
TW (1) TW200541037A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367259B2 (ja) * 2007-12-27 2013-12-11 新光電気工業株式会社 ブリッジ切除方法及びリードフレーム条
CN101937896A (zh) * 2010-04-22 2011-01-05 苏州固锝电子股份有限公司 一种用于制造整流器的引线框
CN107195610A (zh) * 2017-05-16 2017-09-22 四川旭茂微科技有限公司 一种新型整流桥的引线框架

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283599A (ja) * 1992-03-31 1993-10-29 Shinko Electric Ind Co Ltd 多層リードフレームの製造方法
JPH06188347A (ja) * 1992-08-10 1994-07-08 Mitsui High Tec Inc リードフレームの製造方法およびその製造装置
JPH09237927A (ja) * 1995-12-26 1997-09-09 Toshiba Corp 半導体薄膜形成方法および太陽電池の製造方法
JPH09298269A (ja) * 1996-03-07 1997-11-18 Toppan Printing Co Ltd リードフレーム構造体
JPH1161442A (ja) * 1997-08-26 1999-03-05 Toppan Printing Co Ltd エッチング部品構造体
JP2000073186A (ja) * 1998-08-28 2000-03-07 Mitsui High Tec Inc エッチング製品ユニットフレームの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283599A (ja) * 1992-03-31 1993-10-29 Shinko Electric Ind Co Ltd 多層リードフレームの製造方法
JPH06188347A (ja) * 1992-08-10 1994-07-08 Mitsui High Tec Inc リードフレームの製造方法およびその製造装置
JPH09237927A (ja) * 1995-12-26 1997-09-09 Toshiba Corp 半導体薄膜形成方法および太陽電池の製造方法
JPH09298269A (ja) * 1996-03-07 1997-11-18 Toppan Printing Co Ltd リードフレーム構造体
JPH1161442A (ja) * 1997-08-26 1999-03-05 Toppan Printing Co Ltd エッチング部品構造体
JP2000073186A (ja) * 1998-08-28 2000-03-07 Mitsui High Tec Inc エッチング製品ユニットフレームの製造方法

Also Published As

Publication number Publication date
SG116647A1 (en) 2005-11-28
JP2005317827A (ja) 2005-11-10
CN1694233A (zh) 2005-11-09
TW200541037A (en) 2005-12-16

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Granted publication date: 20081105

Termination date: 20150428

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