SG116647A1 - Lead frame manufacturing method. - Google Patents

Lead frame manufacturing method.

Info

Publication number
SG116647A1
SG116647A1 SG200502571A SG200502571A SG116647A1 SG 116647 A1 SG116647 A1 SG 116647A1 SG 200502571 A SG200502571 A SG 200502571A SG 200502571 A SG200502571 A SG 200502571A SG 116647 A1 SG116647 A1 SG 116647A1
Authority
SG
Singapore
Prior art keywords
lead frame
frame manufacturing
manufacturing
lead
frame
Prior art date
Application number
SG200502571A
Inventor
Kobayashi Tsuyoshi
Furuhata Yoshio
Yamagishi Fumio
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of SG116647A1 publication Critical patent/SG116647A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SG200502571A 2004-04-30 2005-04-27 Lead frame manufacturing method. SG116647A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004135227A JP2005317827A (en) 2004-04-30 2004-04-30 Method for manufacturing lead frame

Publications (1)

Publication Number Publication Date
SG116647A1 true SG116647A1 (en) 2005-11-28

Family

ID=35353134

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200502571A SG116647A1 (en) 2004-04-30 2005-04-27 Lead frame manufacturing method.

Country Status (4)

Country Link
JP (1) JP2005317827A (en)
CN (1) CN100431119C (en)
SG (1) SG116647A1 (en)
TW (1) TW200541037A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367259B2 (en) * 2007-12-27 2013-12-11 新光電気工業株式会社 Bridge cutting method and lead frame strip
CN101937896A (en) * 2010-04-22 2011-01-05 苏州固锝电子股份有限公司 Lead frame for manufacturing rectifier
CN107195610A (en) * 2017-05-16 2017-09-22 四川旭茂微科技有限公司 A kind of lead frame of rectifier bridge

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183552B2 (en) * 1992-03-31 2001-07-09 新光電気工業株式会社 Manufacturing method of multilayer lead frame
JPH06188347A (en) * 1992-08-10 1994-07-08 Mitsui High Tec Inc Method and device for manufacturing lead frame
JPH09237927A (en) * 1995-12-26 1997-09-09 Toshiba Corp Semiconductor film forming method and solar cell manufacturing method
JP3269392B2 (en) * 1996-03-07 2002-03-25 凸版印刷株式会社 Lead frame structure
JPH1161442A (en) * 1997-08-26 1999-03-05 Toppan Printing Co Ltd Etching parts structural body
JP2000073186A (en) * 1998-08-28 2000-03-07 Mitsui High Tec Inc Production of etching product unit frame

Also Published As

Publication number Publication date
TW200541037A (en) 2005-12-16
CN1694233A (en) 2005-11-09
CN100431119C (en) 2008-11-05
JP2005317827A (en) 2005-11-10

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