CN100431119C - Manufacturing method of lead frame - Google Patents
Manufacturing method of lead frame Download PDFInfo
- Publication number
- CN100431119C CN100431119C CNB2005100679244A CN200510067924A CN100431119C CN 100431119 C CN100431119 C CN 100431119C CN B2005100679244 A CNB2005100679244 A CN B2005100679244A CN 200510067924 A CN200510067924 A CN 200510067924A CN 100431119 C CN100431119 C CN 100431119C
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- Prior art keywords
- lead frame
- frame piece
- workpiece
- support chip
- support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
A work-piece 10 formed by a long component forms an etch picture, which comprises a picture for forming a lead wire frame sheet 12 containing the lead wire frame and a picture for forming a connecting part 14. The connecting part 14 is connected to the edge of the adjacent lead wire frame sheet 12 at the length direction of the work-piece 10. The etch picture is adopted as a mask to etch the work-piece 10, thereby forming long lead wire frame. In the long lead wire frame, the lead wire frame sheet 12 is connected through the connecting part 14. The connecting part is separated from the lead wire frame and every connecting part is arranged between the connecting part 14 and the lead wire frame sheet 12, thereby obtaining the lead wire frame sheet.
Description
Technical field
The present invention relates to a kind of method of making lead frame, relate in particular to the method for such manufacturing lead frame, it is that the workpiece of rectangular member is made lead frame by etching forming.
Background technology
The manufacture method of lead frame is divided into two groups roughly, and a group of methods is made lead frame by impression, and another group of methods is made lead frame by etching.
When making lead frame, adopt the workpiece that constitutes by rectangular member by impression.Then, make lead frame by form single lead frame piece in long workpiece, each described lead frame piece all comprises one or more lead frames.
On the other hand, when making lead frame, there are situation that adopts the workpiece that constitutes by rectangular member and the situation that adopts big sheet material by etching.Employing comprises following situation by the situation of the workpiece that rectangular member constitutes: by in long workpiece lead frame piece being arranged in the single lead frame of making, each described lead frame piece all comprises one or more lead frames; And by in long workpiece lead frame piece being arranged in how row makes lead frame, each described lead frame piece all comprises one or more lead frames.In adopting the situation of sheet material as workpiece, make lead frame by in sheet-like workpiece, lead frame piece being arranged in many rows, each described lead frame piece all comprises one or more lead frames.
Making by etching in the situation of lead frame, at first to the surface-coated photoresists of workpiece.Subsequently, expose and the development photoresists according to the lead-in wire figure that forms on workpiece, thereby form resist pattern, utilize described figure to cover the part that will form lead frame piece, each described lead frame piece all comprises one or more lead frames.Then, by utilizing resist pattern to come etching workpiece as mask.Thereby produce lead frame piece (or lead frame) (referring to JP-A-53-106572, JP-A-2000-073186 and JP-A-11-061442).
In the method for making lead frame, the advantage that has the High-speed machining ability by the method for utilizing impression to make lead frame, but also there is such problem, owing in workpiece, form lead frame by forming the single lead frame piece that comprises one or more lead frames, thereby limited the product quantity that from workpiece, obtains.
On the other hand, has such advantage by the method for utilizing etching to make lead frame, owing to can mounted on surface arrange product more, thereby the product quantity that obtains from workpiece is big, yet, the lead frame piece that one or more lead frames are drawn together in many packages for mounted on surface, the precision (or exposure accuracy) of mounted on surface that need be high.Therefore,, adopt such method usually more, wherein use the workpiece of sheet, and form the etched figure of each sheet of described workpiece, thereby make lead frame making in the situation of lead frame by utilizing etching to come mounted on surface to arrange product.
But for the situation that forms the etched figure of lead frame piece in sheet-like workpiece, wherein each described lead frame piece all comprises one or more lead frames, needs to keep the frame shape periphery of described workpiece, so that carry this workpiece.This causes wasting the problem of workpiece material, because its described periphery has become the waste material zone.
Followingly can avoid this problem, wherein use such workpiece to replace sheet-like workpiece, the rectangular member that constitutes described workpiece is bigger than such zone, can arrange the lead frame piece that one or more lead frames are drawn together in many packages in described zone; And arrange multi-row lead frame frame sheet.Fig. 4 shows the method for arranging multi-row lead frame frame sheet 6 in the workpiece 5 that is configured as rectangular member, and each described lead frame piece all comprises four lead frames.In the figure, part A is an exposure region, and wherein single exposure is all passed through in each zone.
But, in workpiece 5, forming in the situation of etched figure as shown in Figure 4, need adjacent exposure region A is provided with close to each other, to prevent the appearance in waste material zone as much as possible, perhaps adopt high positioning accuracy exposure exposure region A, so that exposure region A can be set continuously, and width W shown in Figure 4 is reduced to zero.Wherein, should prevent the skew of exposure position and the inclination of exposure region (in the figure, part B is the example of the exposure region of inclination).Such method is efficiently on production efficiency, and described method is provided with multi-row lead frame frame sheet in the workpiece 5 that is made of rectangular member, and each described lead frame piece all comprises one or more lead frames.But the size that will be exposed exposure region has once increased.Even exposure region tilts a little, also big error can appear.Need the technology acuracy of height accurately to connect and the exposure region that exposes.In addition, the problem that this method exists the positioning accuracy of exposure position to descend is because the fluctuations of the width value of workpiece 5 own.
Summary of the invention
Therefore, in order to address these problems, realize the present invention.An object of the present invention is, the method of making lead frame by etching is provided, described method is used the workpiece that is made of rectangular member, and specific needs does not form lead frame to the high-precision exposure of etched figure, and can reduce the waste material amount that in manufacture process, produces, thereby make lead frame effectively.
In order to realize above-mentioned purpose of the present invention, according to the present invention, provide a kind of manufacture method of lead frame, it comprises:
Form etched figure in the workpiece that is made of rectangular member, described etched figure comprises, is used to form the figure of at least one lead frame piece, and described lead frame piece comprises at least one lead frame; And the figure that is used to form at least one coupling part, described coupling part is connected the edge of lead frame piece adjacent on the long side direction of this workpiece, is formed with reference bore on the described coupling part;
By utilizing etched figure to come etching workpiece as mask, thereby form rectangular lead frame support body, described lead frame support body comprises the lead frame piece connected to one another by the coupling part; And
The bonding part that is arranged between coupling part and the lead frame piece is separated from rectangular lead frame support body, thereby obtain lead frame piece;
Wherein, be provided for forming at least one first support chip, the figure of at least one second support chip and at least one the 3rd support chip is as the figure that is used to form described coupling part, described first support chip is connected between the edge of described lead frame piece adjacent on the long side direction of described workpiece, described second support chip is connected between the edge and cross bar part of described lead frame piece, described cross bar part forms on the long side direction of the lateral edge portions of the rectangular lead frame support body of described workpiece continuously, and described the 3rd support chip is connected between the edge of described lead frame piece adjacent on the direction perpendicular to the long side direction of described workpiece; And
By separating the described bonding part between described first, second and the 3rd support chip and the described lead frame piece, from described rectangular lead frame support body, obtain described lead frame piece, in described rectangular lead frame support body, be provided with the described lead frame piece of many rows.
In addition, according to the manufacture method of lead frame of the present invention, its feature can be, such figure is provided for forming the figure of lead frame piece, and described figure is used for being provided with multi-row lead frame frame sheet on workpiece; And, obtain lead frame piece from rectangular lead frame support body, in described lead frame support body, be provided with multi-row lead frame frame sheet.Like this, by being set, multi-row lead frame frame sheet can make lead frame effectively.
In addition, according to the manufacture method of lead frame of the present invention, its feature can be, such figure is provided for forming the figure of coupling part, and described figure is used to form the support chip between at least one edge that is connected lead frame piece; And, by being separated in the bonding part between support chip and the lead frame piece, and obtain lead frame piece from rectangular lead frame support body.Single or multiple support chips can be provided in the edge of lead frame.By forming narrower support chip, and be breaking at the bonding part between support chip and the lead frame, can easily support chip be separated from lead frame.
In addition, manufacture method according to lead frame of the present invention, its feature can be, the figure that is used to form support bar and support chip is provided for forming the figure of coupling part, described support bar connects the cross bar part (rail portion) of workpiece, and described support chip is connected between the edge of support bar and lead frame piece; And, by being separated in the bonding part between support chip and the lead frame, and obtain lead frame piece from rectangular lead frame support body.Narrower support bar and support chip can be formed, thereby the narrower bonding part between lead frame piece can be formed.Therefore, by easily being breaking at the bonding part between support chip and the lead frame piece, can easily support chip be separated from lead frame piece.
According to manufacture method according to lead frame of the present invention, between the edge of lead frame piece, provide the coupling part, each described lead frame piece all comprises one or more lead frames.Lead frame piece is formed setting continuously on its long side direction.Therefore, the coupling part is used for being reduced in the precision that workpiece forms etched figure.Especially, help to carry out such operation, wherein form the etched figure that many rows are used to be provided with lead frame piece in long workpiece, each described lead frame piece all comprises one or more lead frames.Go for the large-scale production of lead frame according to the manufacture method of lead frame of the present invention.
Description of drawings
Fig. 1 diagram shows the manufacture method according to lead frame of the present invention;
Fig. 2 diagram enlargedly shows lead frame piece and coupling part;
Fig. 3 (a) to 3 (c) respectively diagram show other example of the structure of coupling part;
Fig. 4 diagram shows by utilizing the workpiece that is made of rectangular member to form the correlation technique of the figure of lead frame.
Embodiment
Describe the preferred embodiments of the present invention in detail below with reference to accompanying drawing.
As shown in Figure 1, wherein the method by manufacturing lead frame according to the present invention has formed rectangular lead frame support body, wherein adopts farm labourer's part 10.Here, rectangular lead frame support body is meant one group of lead frame piece 12 connected to one another on the long side direction of long workpiece 10.Lead frame piece 12 comprises one or more lead frames that are configured as sheet.
Method according to manufacturing lead frame of the present invention is characterized in that, at workpiece 10 upper surfaces that are configured as rectangular member multi-row lead frame frame sheet 12 is installed; And form so rectangular lead frame support body by etching workpiece 10, wherein be formed with predetermined lead-in wire figure, then, lead frame piece 12 is separated from rectangular lead frame support body individually, thereby obtain the product of lead frame piece.
By following process acquisition rectangular lead frame support body as shown in Figure 1, wherein lead frame piece is arranged on the long side direction of workpiece 10.That is, at first, photosensitive film is layered on the surface of workpiece 10.Optionally, on the surface of workpiece 10, apply photosensitive corrosion resistant material.Like this, make on the surface of workpiece 10 and be coated with photoresists.Then, develop to predetermined figure to the photoresists exposure and with it.Thereby,, and form resist pattern to the part exposure that will remove by etching.Then, by utilizing resist pattern to come etching workpiece 10 as mask.
Method according to the manufacturing lead frame of this embodiment, it is characterized in that, on the surface of workpiece 10, form such etched figure, described figure comprises the lead-in wire figure that is used to form lead frame piece 12 and is used to form the figure of coupling part 14 that described coupling part 14 will be connected to each other at the edge of adjacent lead frame piece 12 on the long side direction of workpiece 10.
That is to say that as shown in Figure 1, part A is to operate and exposed areas by carrying out single exposure.This exposure region A comprises the lead-in wire figure that is used to form lead frame piece 12 and is used to form the figure of coupling part 14 that described coupling part 14 is connected to each other the edge of lead frame piece 12.
Like this, form etched figure on the surface of workpiece 10, described etched figure had both comprised the lead-in wire figure that is used to form lead frame piece 12, comprised the figure that is used to form coupling part 14 again.Then, by utilizing this etched figure to come etching workpiece 10 as mask.Thereby, can obtain rectangular as shown in Figure 1 lead frame support body, wherein lead frame piece 12 is arranged on the long side direction of workpiece 10.
Fig. 2 shows the structure of coupling part 14 and each lead frame piece 12 enlargedly.Coupling part 14 comprises, support bar 14a, and it connects cross bar part 16, and part 16 is along forming continuously on the long side direction of the lateral edge portions of rectangular lead frame support body; And support chip 14b, it makes support bar 14a be connected with the edge of each lead frame piece 12.In this embodiment, form rectangular lead frame support body like this, make two support chip 14b be connected with the edge of each lead frame piece 12, and make, on the long side direction of lead frame piece 12, connect on the edge by support chip 14b and support each lead frame piece 12 by support bar 14a.In this embodiment, two support chip 14b are connected with the edge of each lead frame piece 12; But, the quantity of the support chip 14b of each lead frame piece 12 is not limited thereto.
In order to obtain lead frame piece from the rectangular lead frame support body shown in Fig. 1 and 2, in long lead-in wire body that support chip 14b is just passable from lead frame piece 12 separation, described support chip 14b is connected with the edge of lead frame piece 12.
Separating the method for coupling part 14 can implement by the following method: utilize the NC punch to cut off each bonding part along the external position of corresponding lead frame piece 12, described bonding part is set between support chip 14b and the lead frame piece 12; And such method, bore a hole the bonding part of break-through between support chip 14b and lead frame piece 12 by slit.
By detecting the link position between support chip 14b and the lead frame piece 12, following method is realized the accurate separation of support chip 14b from lead frame piece 12, described method is cut off bonding part between support chip 14b and the lead frame piece 12 by the processing that for example utilizes the perforation of NC punch and slit, and support chip 14b is separated from lead frame piece 12.
As shown in Figure 2, in each support bar 14a, reference bore 18 is set, so that by utilizing transducer or analog can accurately detect bonding part between support chip 14b and the lead frame piece 12.In addition, can in each cross bar part 16, be provided for carrying and locating the pilot hole 20 of rectangular lead frame support body.
Method according to the manufacturing lead frame of this embodiment, its feature also is: when forming etched figure (being resist pattern) in the workpiece 10 that is being configured as rectangular member, etched figure is set to, comprise lead-in wire figure that is used to form lead frame piece 12 and the figure that is used to form coupling part 14, described coupling part is connected lead frame piece adjacent on the long side direction of workpiece 10 12; When forming rectangular lead frame support body by etching workpiece 10, will on long side direction, be connected to each other at the edge of adjacent lead frame piece 12 by coupling part 14; And, in subsequent process, coupling part 14 is separated from lead frame piece 12, thus the product of acquisition lead frame piece.
Because support bar 14a is supported on lead frame piece adjacent on the long side direction 12 by support chip 14b, wherein each support chip 14b is formed narrower, therefore, by boundary position place support chip 14b is separated from lead frame piece 12, thereby can easily obtain lead frame piece 12 in support chip 14b and lead frame piece 12.
Even in such a case, wherein, when on workpiece 10, forming etched figure, bonding part between the etched figure is offset a little, following method still can easily realize to the identification of the bonding part between support chip 14b and lead frame piece 12 and by using NC punch or analog to cut off described bonding part, described method is separated support chip 14b at the link position place of support chip 14b and lead frame piece 12 from lead frame piece 12, thereby obtains lead frame piece.That is to say,, still can obtain lead frame piece according to the method for the manufacturing lead frame of this embodiment even a little skew occurs when the etched figure that on workpiece 10, forms.
Like this, even in such a case, wherein skew a little appears in etched figure when forming etched figure on workpiece 10, still can easily obtain the product of lead frame according to the method for the manufacturing lead frame of this embodiment, described method is by separating each lead frame piece respectively from rectangular lead frame support body.Like this, this method has such advantage, when in workpiece 10, forming many row's etched figures, will be not need be in association area needed pinpoint accuracy.Therefore, reduced needed accuracy when in long workpiece 10, forming multi-row lead frame frame sheet.Like this, by utilizing conventional equipment, can form multi-row lead frame frame sheet.
Though Fig. 1 shows the example of lead frame piece 12 being lined up four rows, row's number of lead frame piece 12 is not limited thereto.Can easily lead frame piece 12 be lined up many rows, wherein arrange number and be equal to or greater than 5.In addition, even lead frame piece 12 is being lined up in the single situation, the method according to this invention also is effective.In addition, Fig. 1 also shows the example of the lead frame piece 12 that comprises four lead frames; But the quantity of the lead frame in lead frame piece 12 is not limited thereto.Lead frame piece 12 can comprise that quantity is equal to or greater than 5 lead frame.
In addition, though at workpiece 10 on its Width a little under the situation of fluctuation, by in the width of workpiece 10, forming the etched figure of coupling part 14 and lead frame piece 12, the lead frame piece 12 that still can obtain to be scheduled to.
Fig. 3 (a) shows the example of structure of the coupling part 14 of supporting wire frame sheet 12 respectively to 3 (c).Fig. 3 (a) shows the example on the lateral edge portions that wherein support chip 14b is directly connected to lead frame piece 12.Fig. 3 (b) shows wherein in the both sides of coupling part and the example of turning (runout) 14c and 14d is provided in lead frame piece 12.Fig. 3 (c) shows and wherein support chip 14b is formed than narrow example among Fig. 3 (a) and 3 (b).
Thereby the support chip 14b that is used to connect lead frame piece 12 can have the shape of appointment.Can location and the number of support chip 14b suitably be set according to quality of materials and the thickness of support chip 14b.
Though this embodiment is configured to support chip 14b is connected on the edge of the long side direction of lead frame piece, yet, coupling part 14 can be arranged between lead frame piece adjacent on the Width 12, thereby lead frame piece is connected to each other and supports.That is to say, between the lateral edges that support chip is arranged on cross bar part 16 and each lead frame piece 12, the lead frame 12 adjacent to cross bar part 16 can be adjusted into by cross bar part 16 and support.By support chip being arranged between the lateral edges of lead frame piece 12, can being adjusted at the lead frame piece 12 that the centre position on the Width is provided with, thereby making lead frame piece be connected to each other and support by support chip.Can utilize the NC punch or bore a hole and separate the support chip that is arranged on the Width, be similar to situation by using NC punch or analog to separate the support chip 14b on the edge that is connected to lead frame piece 12 by slit.Like this, can easily obtain lead frame piece.In this case, can in each cross bar part 16 or each support chip, provide reference bore, thereby can utilize transducer or analog accurately to detect bonding part between support chip 14b and lead frame piece 12.
In addition, though this embodiment is configured to support bar 14a and support chip 14b are set to coupling part 14, but coupling part 14 can include only support chip 14b, and described support chip 14b is connected the edge of lead frame piece adjacent on the long side direction of workpiece 12.In this case, in order to prevent support chip 14b bending owing to the weight of lead frame piece 12, preferably, coupling part 14 also can comprise such support chip, described support chip be connected between the lead frame piece adjacent on its Width 12 or lead frame piece 12 and cross bar part 16 between, thereby lead frame piece 12 or lead frame piece 12 is connected to each other on its Width with cross bar part 16 and supports.
As mentioned above, according to the method for the manufacturing lead frame of this embodiment, lead frame piece 12 is connected to each other by support bar 14a and support chip 14b.Like this, than by using big sheet material to form the situation of multi-row lead frame frame sheet 12, can reduce the waste material amount that when in rectangular lead frame support body, forming lead frame piece, is produced.In addition, when when workpiece 10 upper surfaces are installed lead frame piece 12,, can reduce the waste of material by reducing the width in the zone that forms coupling part 14 as much as possible.
Claims (5)
1. method of making lead frame comprises:
Form etched figure in the workpiece that is made of rectangular member, described etched figure comprises, is used to form the figure of at least one lead frame piece, and described lead frame piece comprises at least one lead frame; And the figure that is used to form at least one coupling part, described coupling part is connected the edge of described lead frame piece adjacent on the long side direction of described workpiece, is formed with reference bore on the described coupling part;
By utilizing described etched figure to come the described workpiece of etching as mask, thereby form rectangular lead frame support body, described rectangular lead frame support body comprises the described lead frame piece connected to one another by described coupling part; And
Separate from described rectangular lead frame support body with the bonding part between the described lead frame piece being arranged on described coupling part, thereby obtain described lead frame piece;
Wherein, be provided for forming at least one first support chip, the figure of at least one second support chip and at least one the 3rd support chip is as the figure that is used to form described coupling part, described first support chip is connected between the edge of described lead frame piece adjacent on the long side direction of described workpiece, described second support chip is connected between the edge and cross bar part of described lead frame piece, described cross bar part forms on the long side direction of the lateral edge portions of the rectangular lead frame support body of described workpiece continuously, and described the 3rd support chip is connected between the edge of described lead frame piece adjacent on the direction perpendicular to the long side direction of described workpiece; And
By separating the described bonding part between described first, second and the 3rd support chip and the described lead frame piece, from described rectangular lead frame support body, obtain described lead frame piece, in described rectangular lead frame support body, be provided with the described lead frame piece of many rows.
2. according to the method for the manufacturing lead frame of claim 1, wherein:
The figure that provides such figure conduct to be used to form described lead frame piece, described such figure are used for being provided with the described lead frame piece of many rows on described workpiece; And
Obtain described lead frame piece from described rectangular lead frame support body, in described rectangular lead frame support body, be provided with the described lead frame piece of many rows.
3. according to the method for the manufacturing lead frame of claim 1, wherein:
Provide such figure conduct to be used to form the figure of described coupling part, described such figure is used to form at least one support chip between the edge that is connected described lead frame piece; And
By being separated in the described bonding part between described support chip and the described lead frame piece, and obtain described lead frame piece from described rectangular lead frame support body.
4. according to the method for the manufacturing lead frame of claim 1, wherein:
The figure that is provided for forming support bar and support chip is as the figure that is used to form described coupling part, and described support bar connects the described cross bar part of described workpiece, and described support chip is connected between the edge of described support bar and described lead frame piece; And
By separating the described bonding part between described support chip and the described lead frame piece, and obtain described lead frame piece from described rectangular lead frame support body.
5. according to the method for the manufacturing lead frame of claim 1 or 2, wherein:
Be provided for forming the figure of at least one first support chip and at least one second support chip as the figure that is used to form described coupling part, described first support chip is connected between the edge of described lead frame piece adjacent on the long side direction of described workpiece, and described second support chip is connected between the described cross bar part of the edge of described lead frame piece and described workpiece; And
By being separated in the described bonding part between described first and second support chips and the described lead frame piece, and obtain described lead frame piece from described rectangular lead frame support body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP135227/2004 | 2004-04-30 | ||
| JP2004135227A JP2005317827A (en) | 2004-04-30 | 2004-04-30 | Method for manufacturing lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1694233A CN1694233A (en) | 2005-11-09 |
| CN100431119C true CN100431119C (en) | 2008-11-05 |
Family
ID=35353134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100679244A Expired - Fee Related CN100431119C (en) | 2004-04-30 | 2005-04-28 | Manufacturing method of lead frame |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2005317827A (en) |
| CN (1) | CN100431119C (en) |
| SG (1) | SG116647A1 (en) |
| TW (1) | TW200541037A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5367259B2 (en) * | 2007-12-27 | 2013-12-11 | 新光電気工業株式会社 | Bridge cutting method and lead frame strip |
| CN101937896A (en) * | 2010-04-22 | 2011-01-05 | 苏州固锝电子股份有限公司 | Lead frame for manufacturing rectifier |
| CN107195610A (en) * | 2017-05-16 | 2017-09-22 | 四川旭茂微科技有限公司 | A kind of lead frame of rectifier bridge |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283599A (en) * | 1992-03-31 | 1993-10-29 | Shinko Electric Ind Co Ltd | Manufacture of multi-layer lead frame |
| JPH06188347A (en) * | 1992-08-10 | 1994-07-08 | Mitsui High Tec Inc | Method and device for manufacturing lead frame |
| JPH09237927A (en) * | 1995-12-26 | 1997-09-09 | Toshiba Corp | Semiconductor film forming method and solar cell manufacturing method |
| JPH09298269A (en) * | 1996-03-07 | 1997-11-18 | Toppan Printing Co Ltd | Lead frame structure |
| JPH1161442A (en) * | 1997-08-26 | 1999-03-05 | Toppan Printing Co Ltd | Etching parts structural body |
| JP2000073186A (en) * | 1998-08-28 | 2000-03-07 | Mitsui High Tec Inc | Production of etching product unit frame |
-
2004
- 2004-04-30 JP JP2004135227A patent/JP2005317827A/en active Pending
-
2005
- 2005-04-27 SG SG200502571A patent/SG116647A1/en unknown
- 2005-04-28 CN CNB2005100679244A patent/CN100431119C/en not_active Expired - Fee Related
- 2005-04-29 TW TW94113846A patent/TW200541037A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283599A (en) * | 1992-03-31 | 1993-10-29 | Shinko Electric Ind Co Ltd | Manufacture of multi-layer lead frame |
| JPH06188347A (en) * | 1992-08-10 | 1994-07-08 | Mitsui High Tec Inc | Method and device for manufacturing lead frame |
| JPH09237927A (en) * | 1995-12-26 | 1997-09-09 | Toshiba Corp | Semiconductor film forming method and solar cell manufacturing method |
| JPH09298269A (en) * | 1996-03-07 | 1997-11-18 | Toppan Printing Co Ltd | Lead frame structure |
| JPH1161442A (en) * | 1997-08-26 | 1999-03-05 | Toppan Printing Co Ltd | Etching parts structural body |
| JP2000073186A (en) * | 1998-08-28 | 2000-03-07 | Mitsui High Tec Inc | Production of etching product unit frame |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005317827A (en) | 2005-11-10 |
| TW200541037A (en) | 2005-12-16 |
| CN1694233A (en) | 2005-11-09 |
| SG116647A1 (en) | 2005-11-28 |
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