CN107195610A - A kind of lead frame of rectifier bridge - Google Patents
A kind of lead frame of rectifier bridge Download PDFInfo
- Publication number
- CN107195610A CN107195610A CN201710344115.6A CN201710344115A CN107195610A CN 107195610 A CN107195610 A CN 107195610A CN 201710344115 A CN201710344115 A CN 201710344115A CN 107195610 A CN107195610 A CN 107195610A
- Authority
- CN
- China
- Prior art keywords
- chip
- guide groove
- guide
- rectifier bridge
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/4952—Additional leads the additional leads being a bump or a wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dairy Products (AREA)
Abstract
The invention discloses a kind of lead frame of rectifier bridge, including frame body, middle muscle and chip bearing guide card, the middle muscle is fixedly mounted on frame body, the chip bearing guide card is fixedly connected in matrix form with middle muscle, guide groove is provided with the chip bearing guide card, and is provided with by guide groove on chip, the chip and is provided with pin, the pin correspondence guide groove is provided with guide pillar, and the chip is fixedly connected by guide pillar with guide groove.The lead frame of the rectifier bridge, energy resource consumption is low, is easily installed, and effectively improves the productivity ratio of product, improves the package quality of product.
Description
Technical field
The present invention relates to leadframe technologies field, more particularly to a kind of lead frame of rectifier bridge.
Background technology
Consumption is very big, and annual requirement is at 50,000,000,000 or so, because original design uses 5 slice structures, every group of frame
Frame can only produce 50 products, with the deficiency, the chip knot of matrix form 2 occurred recently such as production efficiency is low, uniformity is poor
Structure causes general of length no more than 200mm due to that can not overcome the adverse effect of raw material stress, and wall scroll total quantity is no more than
180 unit products, due to low production efficiency, occupancy equipment is more, and energy expenditure causes greatly material and labor cost is high,
Seriously restrict the yield of the packing forms product.
The content of the invention
The invention aims to solve shortcoming present in prior art, and a kind of rectifier bridge for proposing draws
Wire frame.
To achieve these goals, present invention employs following technical scheme：
A kind of lead frame of rectifier bridge, including frame body, middle muscle and chip bearing guide card, the middle muscle are fixedly mounted
On frame body, the chip bearing guide card is fixedly connected in matrix form with middle muscle, is provided with the chip bearing guide card
Guide groove, and be provided with by guide groove on chip, the chip and be provided with pin, the pin correspondence guide groove is provided with guide pillar, institute
Chip is stated to be fixedly connected with guide groove by guide pillar.
Preferably, the frame body includes upper drainage framework and lower drainage framework, the upper drainage framework and lower drainage
It is fixedly connected between framework by connecting plate.The quantity of present apparatus encapsulating products successively is improved, productivity effect is improved.
Preferably, supporting plate is provided with the frame body, and supporting plate is consolidated by the end of glue post and frame body
Fixed connection.Frame body is improved when being encapsulated to product, the product on frame body is not destroyed, improve the effect of present apparatus encapsulation
The production yield of rate and product.
Preferably, the chip bearing guide card is set in Z-shaped, is in the setting of falling Z-shaped between the chip and pin, described to draw
Pin is fitted setting with chip bearing guide card.When being arranged on to chip on chip bearing guide card, pin is held by guide pillar with chip
Carry the guide groove on guide card and fix clamping, and pin is fitted setting with chip, core is improved while raising present apparatus production efficiency
The stability that piece is connected with chip bearing guide card.
Preferably, the guide groove is merged with guide pillar by tin cream, and tin cream is conductively connected in coated to guide groove and guide pillar.
Chip is by after guide pillar and guide groove clamping, and tin cream is to chip secure attachment, then through oversintering, plastic packaging, plating and the work such as separates
Sequence obtains semiconductor rectifier bridge device.
In the present invention, when chip is arranged on chip bearing guide card, pin is passed through on guide pillar and chip bearing guide card
Guide groove fixes clamping, and pin fit settings with chip, chip by guide pillar with after guide groove clamping, tin cream glues to chip fixation
It is attached, then semiconductor rectifier bridge device is obtained through processes such as oversintering, plastic packaging, plating and separation, to the product on frame body
During encapsulation, supporting plate, to the product protection on frame body, makes it not be destroyed by glue post.The lead frame of the rectifier bridge
Frame, energy resource consumption is low, is easily installed, and effectively improves the productivity ratio of product, improves the package quality of product.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the lead frame of rectifier bridge proposed by the present invention；
Fig. 2 is a kind of chip installing structure schematic diagram of the lead frame of rectifier bridge proposed by the present invention.
In figure：1 frame body；Drainage framework on 11；12 times drainage frameworks；121 connecting plates；13 supporting plates；131 glue posts；In 2
Muscle；3 chip bearing guide cards；31 guide grooves；32 chips；33 pins；331 guide pillars；34 tin creams.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.
Reference picture 1-2, a kind of lead frame of rectifier bridge, including frame body 1, middle muscle 2 and chip bearing guide card
3, the frame body 1 includes upper drainage framework 11 and lower drainage framework 12, between the upper drainage framework 11 and lower drainage 12
It is fixedly connected by connecting plate 121.The quantity of present apparatus encapsulating products successively is improved, productivity effect is improved.On the frame body 1
Supporting plate 13 is provided with, and supporting plate 13 is fixedly connected by glue post 131 with the end of frame body 1.Frame body 1 is improved to exist
When being encapsulated to product, the product on frame body 1 is not destroyed, and improves the efficiency of present apparatus encapsulation and the production yield of product.
The middle muscle 2 is fixedly mounted on frame body 1, and the chip bearing guide card 3 is fixedly connected in matrix form with middle muscle 2, described
Guide groove 31 is provided with chip bearing guide card 3, and is provided with by guide groove 31 on chip 32, the chip 32 and is provided with pin
33, the correspondence of pin 33 guide groove 31 is provided with guide pillar 331, and the chip 32 is fixedly connected by guide pillar 331 with guide groove 31.Institute
State chip bearing guide card 3 to set in Z-shaped, be in the setting of falling Z-shaped between the chip 32 and pin 33, the pin 33 is held with chip
The laminating of guide card 3 is carried to set.When being arranged on to chip 32 on chip bearing guide card 3, pin 33 is passed through into guide pillar 331 and chip bearing
Guide groove 31 on guide card 3 fixes clamping, and pin 33 is fitted setting with chip 32, is carried while raising present apparatus production efficiency
The stability that high chip 32 is connected with chip bearing guide card 3.The guide groove 31 is merged with guide pillar 331 by tin cream 34, and tin cream
34 are conductively connected in coated to guide groove 31 and guide pillar 331.After chip 32 is by guide pillar 331 and the clamping of guide groove 31,34 pairs of tin cream
The secure attachment of chip 32, then obtain semiconductor rectifier bridge device through processes such as oversintering, plastic packaging, plating and separation.
In the present invention, when chip 32 is arranged on chip bearing guide card 3, pin 33 is passed through into guide pillar 331 and chip bearing
Guide groove 31 on guide card 3 fixes clamping, and pin 33 is fitted setting with chip 32, and chip 32 passes through guide pillar 331 and guide groove 31
After clamping, to obtain semiconductor whole to the secure attachment of chip 32, then through processes such as oversintering, plastic packaging, plating and separation for tin cream 34
Bridge device is flowed, when being encapsulated to the product on frame body 1, supporting plate 13 is protected by glue post 131 to the product on frame body 1
Shield, makes it not be destroyed.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (5)
1. a kind of lead frame of rectifier bridge, including frame body（1）, middle muscle（2）With chip bearing guide card（3）, it is special
Levy and be, the middle muscle（2）It is fixedly mounted on frame body（1）On, the chip bearing guide card（3）In matrix form and middle muscle
（2）It is fixedly connected, the chip bearing guide card（3）On be provided with guide groove（31）, and pass through guide groove（31）Chip is installed（32）,
The chip（32）On be provided with pin（33）, the pin（33）Correspondence guide groove（31）It is provided with guide pillar（331）, the chip
（32）Pass through guide pillar（331）With guide groove（31）It is fixedly connected.
2. a kind of lead frame of rectifier bridge according to claim 1, it is characterised in that the frame body（1）
Including upper drainage framework（11）With lower drainage framework（12）, the upper drainage framework（11）With lower drainage framework（12）Between pass through
Connecting plate（121）It is fixedly connected.
3. a kind of lead frame of rectifier bridge according to claim 1, it is characterised in that the frame body（1）
On be provided with supporting plate（13）, and supporting plate（13）Pass through glue post（131）With frame body（1）End be fixedly connected.
4. a kind of lead frame of rectifier bridge according to claim 1, it is characterised in that the chip bearing guide card
（3）Set in Z-shaped, the chip（32）With pin（33）Between be in the setting of falling Z-shaped, the pin（33）With chip bearing guide card
（3）Laminating is set.
5. a kind of lead frame of rectifier bridge according to claim 1, it is characterised in that the guide groove（31）With leading
Post（331）Pass through tin cream（34）Fusion, and tin cream（34）In coated to guide groove（31）And guide pillar（331）It is conductively connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710344115.6A CN107195610A (en) | 2017-05-16 | 2017-05-16 | A kind of lead frame of rectifier bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710344115.6A CN107195610A (en) | 2017-05-16 | 2017-05-16 | A kind of lead frame of rectifier bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107195610A true CN107195610A (en) | 2017-09-22 |
Family
ID=59872650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710344115.6A Pending CN107195610A (en) | 2017-05-16 | 2017-05-16 | A kind of lead frame of rectifier bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107195610A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112802787A (en) * | 2021-04-13 | 2021-05-14 | 四川旭茂微科技有限公司 | Feeding device for lead frame assembly |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5132772A (en) * | 1991-05-31 | 1992-07-21 | Motorola, Inc. | Semiconductor device having tape automated bonding (TAB) leads which facilitate lead bonding |
| US5270492A (en) * | 1991-08-26 | 1993-12-14 | Rohm Co., Ltd. | Structure of lead terminal of electronic device |
| CN1694233A (en) * | 2004-04-30 | 2005-11-09 | 新光电气工业株式会社 | Manufacturing method of lead frame |
| TWI252574B (en) * | 2004-10-19 | 2006-04-01 | Advanced Semiconductor Eng | Package with flip chip on leadframe |
| US20120241934A1 (en) * | 2011-03-22 | 2012-09-27 | Kabushiki Kaisha Toshiba | Semiconductor apparatus and method for manufacturing the same |
| CN103163604A (en) * | 2011-12-16 | 2013-06-19 | 株式会社东芝 | Method for manufacturing photocoupler, and photocoupler lead frame sheet |
| CN103187383A (en) * | 2013-02-26 | 2013-07-03 | 山东迪一电子科技有限公司 | Package structure of Schottky diode |
| CN204668297U (en) * | 2015-06-18 | 2015-09-23 | 山东晶导微电子有限公司 | A kind of rectangular array SMBF lead frame |
| CN204668296U (en) * | 2015-06-18 | 2015-09-23 | 山东晶导微电子有限公司 | A kind of surface mount chip rectifier bridge lead frame |
-
2017
- 2017-05-16 CN CN201710344115.6A patent/CN107195610A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5132772A (en) * | 1991-05-31 | 1992-07-21 | Motorola, Inc. | Semiconductor device having tape automated bonding (TAB) leads which facilitate lead bonding |
| US5270492A (en) * | 1991-08-26 | 1993-12-14 | Rohm Co., Ltd. | Structure of lead terminal of electronic device |
| CN1694233A (en) * | 2004-04-30 | 2005-11-09 | 新光电气工业株式会社 | Manufacturing method of lead frame |
| TWI252574B (en) * | 2004-10-19 | 2006-04-01 | Advanced Semiconductor Eng | Package with flip chip on leadframe |
| US20120241934A1 (en) * | 2011-03-22 | 2012-09-27 | Kabushiki Kaisha Toshiba | Semiconductor apparatus and method for manufacturing the same |
| CN103163604A (en) * | 2011-12-16 | 2013-06-19 | 株式会社东芝 | Method for manufacturing photocoupler, and photocoupler lead frame sheet |
| CN103187383A (en) * | 2013-02-26 | 2013-07-03 | 山东迪一电子科技有限公司 | Package structure of Schottky diode |
| CN204668297U (en) * | 2015-06-18 | 2015-09-23 | 山东晶导微电子有限公司 | A kind of rectangular array SMBF lead frame |
| CN204668296U (en) * | 2015-06-18 | 2015-09-23 | 山东晶导微电子有限公司 | A kind of surface mount chip rectifier bridge lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112802787A (en) * | 2021-04-13 | 2021-05-14 | 四川旭茂微科技有限公司 | Feeding device for lead frame assembly |
| CN112802787B (en) * | 2021-04-13 | 2021-06-22 | 四川旭茂微科技有限公司 | Feeding device for lead frame assembly |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170922 |