CN207637787U - A kind of novel TO types lead frame - Google Patents
A kind of novel TO types lead frame Download PDFInfo
- Publication number
- CN207637787U CN207637787U CN201721084301.2U CN201721084301U CN207637787U CN 207637787 U CN207637787 U CN 207637787U CN 201721084301 U CN201721084301 U CN 201721084301U CN 207637787 U CN207637787 U CN 207637787U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- pin
- seating portion
- connecting plate
- novel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Abstract
The utility model belongs to leadframe world, it is related to a kind of lead frame of semiconductor component packing, more particularly to a kind of novel TO types lead frame, including at least two single group lead frames, described two adjacent single group lead frames are connected by connection component to be arranged, the single group lead frame includes chip seating portion, and the lower part of the chip seating portion is provided with pin portions, and the chip seating portion connect setting with pin portions by tilting connecting plate.The design of connection component in the utility model so that lead frame integrally has better adaptability, corresponding to reduce cost of manufacture and manpower；The utility model without changing present lead frame structure on a large scale, it is easy to accomplish；The utility model is simple in structure, saves equipment investment, reduces processing procedure cost；Production capacity can be increased substantially.
Description
Technical field
The utility model belongs to leadframe world, is related to a kind of lead frame of semiconductor component packing, more particularly to
A kind of novel TO types lead frame.
Background technology
In recent years, the integrated level of semiconductor devices is higher and higher, and its amount of storage, conversion speed and power are rapidly
Increase, but volume is smaller and smaller.Since domestic semiconductor packages enterprise development speed is faster than upstream semiconductor encapsulation material
The development speed of lead frame manufacturing enterprise, causing internal lead frame product, supply falls short of demand, this situation promotes semiconductor package
Package material lead frame manufacturing enterprise is constantly expanded production and technological innovation.
All it is to use machine, by lead frame for various reasons when being designed at this stage for lead frame
Using integrally formed design, it is evident that many problems are had using such design, such as, of lead frame
When number is different, then design is also re-started, so being correspondingly improved cost, and wastes manpower.
Utility model content
The utility model is directed to the problem of above-mentioned lead frame bad adaptability, therefore provides a kind of novel TO types lead
Frame.
In order to achieve the above object, the technical solution adopted in the utility model is that the utility model provides a kind of novel TO
Type lead frame, including at least two single group lead frames, described two adjacent single group lead frames are connected by connection component
Setting is connect, the single group lead frame includes chip seating portion, and the lower part of the chip seating portion is provided with pin portions, described
Chip seating portion connect setting with pin portions by tilting connecting plate；
The pin portions include pin plate part, and the top of the pin portions is provided with inclination and connects
The pin components of fishplate bar both sides, the pin components include be arranged the pin connecting plate in pin portions with
And the T-post on pin connecting plate top is set, the junction of the pin connecting plate and T-post are set
It is equipped with through-hole.
It appears on the stage preferably, the chip seating portion includes slide holder and the slide glass being arranged on slide holder top,
The both sides of the slide holder are provided with dogleg section, and middle part is provided with square hole group, what the slide glass was appeared on the stage
Middle part is provided with circular hole.
Preferably, the connection component includes the connector being arranged in chip seating portion, pin portions side
And be arranged in chip seating portion, the pin portions other side and the connection matching hole coordinated with connector,
The connector includes that the first connection cross-piece being arranged on slide glass is appeared on the stage and setting are connected in pin
The second connection cross-piece on plate.
Preferably, the lower part of the second connection cross-piece is provided with screens ball element.
Preferably, the lead frame further includes left lead frame and the setting being arranged on the left of single group lead frame
Right lead frame on the right side of single group lead frame.
Compared with prior art, it is with good effect the advantages of the utility model,
1, it is opened up by opening up through-hole, through-hole on lead frame T-post so that encapsulating due to the utility model
Resin and interior pin fully merge in journey, avoid the presence of air, improve the binding force of pin and interlaminar resin, ensure that half
The quality of conductor element；The utility model without changing present lead frame structure on a large scale, it is easy to accomplish；This practicality
New structure is simple, saves equipment investment, reduces processing procedure cost；Production capacity can be increased substantially；
2, in the utility model connection component design so that lead frame integrally have better adaptability, accordingly
Reduce cost of manufacture and manpower.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
The attached drawing used is briefly described, it should be apparent that, the accompanying drawings in the following description is some embodiments of the utility model,
For those of ordinary skill in the art, without having to pay creative labor, it can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the dimensional structure diagram for the novel TO types lead frame that embodiment 1 provides；
Fig. 2 is the explosive view for the novel TO types lead frame that embodiment 1 provides；
Fig. 3 is the dimensional structure diagram for the single group lead frame that embodiment 1 provides；
Fig. 4 is the partial enlarged view of M in Fig. 3；
Fig. 5 is the partial enlarged view of N in Fig. 3；
Fig. 6 is the partial enlarged view of L in Fig. 3；
Fig. 7 is the structural schematic diagram of single group lead frame (unlike Fig. 3, Fig. 7 is simply to be illustrated)；
In above each figure, 1, single group lead frame；11, slide holder；111, square hole group；112, dogleg section；12, on slide glass
Platform；121, circular hole；13, pin portions；14, connecting plate is tilted；15, T-post, 16, pin connecting plate；17, through-hole；2, Zuo Yin
Wire frame；3, right lead frame；4, the first connection cross-piece；5, the second connection cross-piece；6, screens ball element.
Specific implementation mode
It is below in conjunction with the accompanying drawings and real in order to be more clearly understood that the above objects, features, and advantages of the utility model
Example is applied to be described further the utility model.It should be noted that in the absence of conflict, embodiments herein and reality
The feature applied in example can be combined with each other.
Many details are elaborated in the following description in order to fully understand the utility model, still, this practicality
Novel to implement using different from other modes described here, therefore, the utility model is not limited to be described below
The limitation of the specific embodiment of specification.
Embodiment 1, as shown in figs 1 to 6, the utility model provide a kind of novel TO types lead frame, including at least two
A single group lead frame, it is well known that lead frame at this stage is all made of several unimodules, and specific number is then
It is arranged according to specific circumstances, after receiving requirement, to make mold, lead frame is then integrally formed and produces
Come, it is clear that use above-mentioned design, adaptability be it is not strong, and cumbersome, it is time-consuming and laborious；So inventor exists
Two adjacent single group lead frames are connected by connection component to be arranged, can from Fig. 3 if more specific point
Go out, it is in the both sides of its single group lead frame to connect component then, and side is provided with half；If by single group lead frame
If detailed point, it can be roughly divided into two parts, i.e., chip seating portion and be set drawing in chip seating portion lower part
Foot part, chip seating portion are then for bearing wafer body, and pin portions are then whole for installing, from Fig. 3
Connecting plate connection setting is tilted as can be seen that being used between its chip seating portion and pin portions, tilts connecting plate
Chip seating portion and pin portions have been arranged to two levels by effect.
Below specifically once, the specific setting of above-mentioned key component,
It appears on the stage as shown in figure 3, its chip seating portion includes slide holder and the slide glass being arranged on slide holder top, the load
The both sides of piece platform are provided with dogleg section, and middle part is provided with square hole group, and the middle part that the slide glass is appeared on the stage is provided with circular hole；
Its pin portions includes pin plate part, and inventor is provided with setting on the top of pin plate part and is tilting connection
The pin components of plate both sides, the pin components include being arranged in the pin connecting plate of pin portions and setting in pin connecting plate
The junction of the T-post on top, pin connecting plate and T-post are provided with through-hole, and through-hole can be manufactured in lead frame
It is completed in the process in T-post punching presses by tool.
For above-mentioned setting, meeting simply carries out the description of making property, when encapsulating, first passes through semiconductor element
Bonding agent is adhered on the slide holder of lead frame, with bonding line the bonding T-post and lead frame of semiconductor element
Weld part connects, and then carries out resin-encapsulated using epoxy resin to the lead frame for being bonded to semiconductor element, will be interior
Pin and semiconductor element seal；Due to offering through-hole on T-post, potting resin can flow into through-hole, so that
Potting resin and interior pin fully merge, and avoid the presence of air, improve binding force between the two.
Its connection component is then important part in the utility model, below in conjunction with the accompanying drawings, to its connection component into
Row detailed description, as shown in figures 3 to 6, connection component include include being arranged in chip seating portion, pin portions side
Connector and it is arranged in chip seating portion, the pin portions other side and the connection matching hole coordinated with connector, connector
With the setting of connection matching hole, then realizes two adjacent single groups and guide the effect that frame is rationally connected into.
Its connector includes being arranged cross-piece and to be arranged the second of pin connecting plate in slide glass upper first connection of appearing on the stage
Cross-piece is connected, from figure 3, it can be seen that the part of its connection is mainly 2 points above, the first connection cross-piece and second
The global design of connection cross-piece is the same, that is, includes cylindrical portion and cross clip bit position, column part is then whole
A fixed part, cross clip bit position then prevent two single groups from guiding frame relative rotation into, its connection are made more to be fixed,
In contrast, the lower part of the second connection cross-piece is provided with screens ball element, and the setting of screens ball element is then to connect in order to prevent
Cross-piece is connect to come out out of connection matching hole.It needs exist for supplementing, the setting of connection matching hole is connected thereto part
What specific setting was consistent.
If the utility model is integrally carried out detailed point, lead frame main body further includes that setting is drawn in single group
Left lead frame on the left of wire frame and the right lead frame being arranged on the right side of single group lead frame, as shown in Fig. 2, it is left,
The right lead frame place different compared to single group lead frame is that the connection side only with single group lead frame is provided with
Corresponding connection cross-piece or connection matching hole.
The above descriptions are merely preferred embodiments of the present invention, is not to make other forms to the utility model
Limitation, any person skilled in the art is changed or is modified as possibly also with the technology contents of the disclosure above equivalent
The equivalent embodiment of variation is applied to other fields, but every without departing from the content of the technical scheme of the utility model, according to this reality
With novel technical spirit to any simple modification, equivalent variations and remodeling made by above example, it is new to still fall within this practicality
The protection domain of type technical solution.
Claims (5)
1. a kind of novel TO types lead frame, it is characterised in that：Including at least two single group lead frames, two adjacent single groups
Lead frame is connected by connection component to be arranged, and the single group lead frame includes chip seating portion, the chip seating portion
Lower part is provided with pin portions, and the chip seating portion connect setting with pin portions by tilting connecting plate；
The pin portions include pin plate part, and the top of the pin portions, which is provided with, tilts connecting plate both sides
Pin components, the pin components include be arranged pin portions pin connecting plate and be arranged on pin connecting plate top
The junction of T-post, the pin connecting plate and T-post are provided with through-hole.
2. a kind of novel TO types lead frame according to claim 1, it is characterised in that：The chip seating portion includes carrying
Piece platform and the slide glass being arranged on slide holder top are appeared on the stage, and the both sides of the slide holder are provided with dogleg section, and middle part is provided with
Square hole group, the middle part that the slide glass is appeared on the stage are provided with circular hole.
3. a kind of novel TO types lead frame according to claim 2, it is characterised in that：The connection component includes setting
Chip seating portion, pin portions side connector and setting chip seating portion, the pin portions other side and with connect
The connection matching hole of part cooperation, the connector include that the first connection cross-piece being arranged on slide glass is appeared on the stage and setting are being drawn
The second connection cross-piece on foot connecting plate.
4. a kind of novel TO types lead frame according to claim 3, it is characterised in that：The second connection cross-piece
Lower part is provided with screens ball element.
5. a kind of novel TO types lead frame according to claim 3, it is characterised in that：The lead frame further includes setting
The right lead frame set the left lead frame on the left of single group lead frame and be arranged on the right side of single group lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721084301.2U CN207637787U (en) | 2017-08-28 | 2017-08-28 | A kind of novel TO types lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721084301.2U CN207637787U (en) | 2017-08-28 | 2017-08-28 | A kind of novel TO types lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207637787U true CN207637787U (en) | 2018-07-20 |
Family
ID=62861869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721084301.2U Expired - Fee Related CN207637787U (en) | 2017-08-28 | 2017-08-28 | A kind of novel TO types lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207637787U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199941A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
| CN111293097A (en) * | 2020-04-09 | 2020-06-16 | 严培刚 | Lead frame of semiconductor device adopting TO type package |
-
2017
- 2017-08-28 CN CN201721084301.2U patent/CN207637787U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199941A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
| CN111199941B (en) * | 2018-11-16 | 2022-03-25 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and gluing method |
| CN111293097A (en) * | 2020-04-09 | 2020-06-16 | 严培刚 | Lead frame of semiconductor device adopting TO type package |
| CN111293097B (en) * | 2020-04-09 | 2021-07-09 | 天水华洋电子科技股份有限公司 | Lead frame of semiconductor device adopting TO type package |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180720 Termination date: 20210828 |