SG116647A1 - Lead frame manufacturing method. - Google Patents

Lead frame manufacturing method.

Info

Publication number
SG116647A1
SG116647A1 SG200502571A SG200502571A SG116647A1 SG 116647 A1 SG116647 A1 SG 116647A1 SG 200502571 A SG200502571 A SG 200502571A SG 200502571 A SG200502571 A SG 200502571A SG 116647 A1 SG116647 A1 SG 116647A1
Authority
SG
Singapore
Prior art keywords
lead frame
frame manufacturing
manufacturing
lead
frame
Prior art date
Application number
SG200502571A
Other languages
English (en)
Inventor
Kobayashi Tsuyoshi
Furuhata Yoshio
Yamagishi Fumio
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of SG116647A1 publication Critical patent/SG116647A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
SG200502571A 2004-04-30 2005-04-27 Lead frame manufacturing method. SG116647A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004135227A JP2005317827A (ja) 2004-04-30 2004-04-30 リードフレームの製造方法

Publications (1)

Publication Number Publication Date
SG116647A1 true SG116647A1 (en) 2005-11-28

Family

ID=35353134

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200502571A SG116647A1 (en) 2004-04-30 2005-04-27 Lead frame manufacturing method.

Country Status (4)

Country Link
JP (1) JP2005317827A (https=)
CN (1) CN100431119C (https=)
SG (1) SG116647A1 (https=)
TW (1) TW200541037A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367259B2 (ja) * 2007-12-27 2013-12-11 新光電気工業株式会社 ブリッジ切除方法及びリードフレーム条
CN101937896A (zh) * 2010-04-22 2011-01-05 苏州固锝电子股份有限公司 一种用于制造整流器的引线框
CN107195610A (zh) * 2017-05-16 2017-09-22 四川旭茂微科技有限公司 一种新型整流桥的引线框架

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183552B2 (ja) * 1992-03-31 2001-07-09 新光電気工業株式会社 多層リードフレームの製造方法
JPH06188347A (ja) * 1992-08-10 1994-07-08 Mitsui High Tec Inc リードフレームの製造方法およびその製造装置
JPH09237927A (ja) * 1995-12-26 1997-09-09 Toshiba Corp 半導体薄膜形成方法および太陽電池の製造方法
JP3269392B2 (ja) * 1996-03-07 2002-03-25 凸版印刷株式会社 リードフレーム構造体
JPH1161442A (ja) * 1997-08-26 1999-03-05 Toppan Printing Co Ltd エッチング部品構造体
JP2000073186A (ja) * 1998-08-28 2000-03-07 Mitsui High Tec Inc エッチング製品ユニットフレームの製造方法

Also Published As

Publication number Publication date
JP2005317827A (ja) 2005-11-10
CN1694233A (zh) 2005-11-09
TW200541037A (en) 2005-12-16
CN100431119C (zh) 2008-11-05

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