JP2005317827A5 - - Google Patents

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Publication number
JP2005317827A5
JP2005317827A5 JP2004135227A JP2004135227A JP2005317827A5 JP 2005317827 A5 JP2005317827 A5 JP 2005317827A5 JP 2004135227 A JP2004135227 A JP 2004135227A JP 2004135227 A JP2004135227 A JP 2004135227A JP 2005317827 A5 JP2005317827 A5 JP 2005317827A5
Authority
JP
Japan
Prior art keywords
lead frame
pattern
workpiece
long body
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004135227A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005317827A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004135227A priority Critical patent/JP2005317827A/ja
Priority claimed from JP2004135227A external-priority patent/JP2005317827A/ja
Priority to SG200502571A priority patent/SG116647A1/en
Priority to CNB2005100679244A priority patent/CN100431119C/zh
Priority to TW094113846A priority patent/TW200541037A/zh
Publication of JP2005317827A publication Critical patent/JP2005317827A/ja
Publication of JP2005317827A5 publication Critical patent/JP2005317827A5/ja
Pending legal-status Critical Current

Links

JP2004135227A 2004-04-30 2004-04-30 リードフレームの製造方法 Pending JP2005317827A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004135227A JP2005317827A (ja) 2004-04-30 2004-04-30 リードフレームの製造方法
SG200502571A SG116647A1 (en) 2004-04-30 2005-04-27 Lead frame manufacturing method.
CNB2005100679244A CN100431119C (zh) 2004-04-30 2005-04-28 引线框架的制造方法
TW094113846A TW200541037A (en) 2004-04-30 2005-04-29 Lead frame manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004135227A JP2005317827A (ja) 2004-04-30 2004-04-30 リードフレームの製造方法

Publications (2)

Publication Number Publication Date
JP2005317827A JP2005317827A (ja) 2005-11-10
JP2005317827A5 true JP2005317827A5 (https=) 2008-08-28

Family

ID=35353134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004135227A Pending JP2005317827A (ja) 2004-04-30 2004-04-30 リードフレームの製造方法

Country Status (4)

Country Link
JP (1) JP2005317827A (https=)
CN (1) CN100431119C (https=)
SG (1) SG116647A1 (https=)
TW (1) TW200541037A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5367259B2 (ja) * 2007-12-27 2013-12-11 新光電気工業株式会社 ブリッジ切除方法及びリードフレーム条
CN101937896A (zh) * 2010-04-22 2011-01-05 苏州固锝电子股份有限公司 一种用于制造整流器的引线框
CN107195610A (zh) * 2017-05-16 2017-09-22 四川旭茂微科技有限公司 一种新型整流桥的引线框架

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183552B2 (ja) * 1992-03-31 2001-07-09 新光電気工業株式会社 多層リードフレームの製造方法
JPH06188347A (ja) * 1992-08-10 1994-07-08 Mitsui High Tec Inc リードフレームの製造方法およびその製造装置
JPH09237927A (ja) * 1995-12-26 1997-09-09 Toshiba Corp 半導体薄膜形成方法および太陽電池の製造方法
JP3269392B2 (ja) * 1996-03-07 2002-03-25 凸版印刷株式会社 リードフレーム構造体
JPH1161442A (ja) * 1997-08-26 1999-03-05 Toppan Printing Co Ltd エッチング部品構造体
JP2000073186A (ja) * 1998-08-28 2000-03-07 Mitsui High Tec Inc エッチング製品ユニットフレームの製造方法

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