JP2005317827A5 - - Google Patents
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- Publication number
- JP2005317827A5 JP2005317827A5 JP2004135227A JP2004135227A JP2005317827A5 JP 2005317827 A5 JP2005317827 A5 JP 2005317827A5 JP 2004135227 A JP2004135227 A JP 2004135227A JP 2004135227 A JP2004135227 A JP 2004135227A JP 2005317827 A5 JP2005317827 A5 JP 2005317827A5
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pattern
- workpiece
- long body
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Claims (2)
このエッチングパターンをマスクとして被加工材をエッチングすることにより、長手方向に連続するレール部が両側縁部に形成され、該レール部に前記接続部を介して個々のリードフレームが支持されたリードフレームの長尺体を形成し、
該リードフレームの長尺体から、シート状のリードフレームを得るリードフレームの製造方法であって、
前記接続部のパターンを、前記リードフレームのレール部間を連結する支持バーと、前記リードフレームを前記支持バーに吊持する支持片とを形成するパターンとして前記リードフレームの長尺体を形成し、
前記支持片と前記リードフレームの端縁との連結部を分離して前記シート状のリードフレームを得ることを特徴とするリードフレームの製造方法。 Forming an etching pattern consisting of a pattern of a lead frame and a pattern of a connecting portion connecting between the edges of the lead frame adjacent to each other in the longitudinal direction of the workpiece on a workpiece made of a long body,
By etching the workpiece using this etching pattern as a mask, a rail portion that is continuous in the longitudinal direction is formed on both side edges, and each lead frame is supported on the rail portion via the connecting portion. Form a long body of
A lead frame manufacturing method for obtaining a sheet-like lead frame from a long body of the lead frame,
A long body of the lead frame is formed as a pattern that forms a pattern of the connecting portion as a support bar for connecting between the rail portions of the lead frame and a support piece for suspending the lead frame on the support bar. ,
A method of manufacturing a lead frame, wherein the sheet-like lead frame is obtained by separating a connecting portion between the support piece and an end edge of the lead frame.
リードフレームが多列に配置されたリードフレームの長尺体からシート状のリードフレームを得ることを特徴とする請求項1記載のリードフレームの製造方法。 As a pattern of the lead frame, a pattern for arranging the lead frame in multiple rows on the workpiece is provided,
2. The method of manufacturing a lead frame according to claim 1, wherein a sheet-like lead frame is obtained from an elongated lead frame in which the lead frames are arranged in multiple rows.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004135227A JP2005317827A (en) | 2004-04-30 | 2004-04-30 | Method for manufacturing lead frame |
SG200502571A SG116647A1 (en) | 2004-04-30 | 2005-04-27 | Lead frame manufacturing method. |
CNB2005100679244A CN100431119C (en) | 2004-04-30 | 2005-04-28 | Manufacturing method of lead frame |
TW94113846A TW200541037A (en) | 2004-04-30 | 2005-04-29 | Lead frame manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004135227A JP2005317827A (en) | 2004-04-30 | 2004-04-30 | Method for manufacturing lead frame |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005317827A JP2005317827A (en) | 2005-11-10 |
JP2005317827A5 true JP2005317827A5 (en) | 2008-08-28 |
Family
ID=35353134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004135227A Pending JP2005317827A (en) | 2004-04-30 | 2004-04-30 | Method for manufacturing lead frame |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2005317827A (en) |
CN (1) | CN100431119C (en) |
SG (1) | SG116647A1 (en) |
TW (1) | TW200541037A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5367259B2 (en) * | 2007-12-27 | 2013-12-11 | 新光電気工業株式会社 | Bridge cutting method and lead frame strip |
CN101937896A (en) * | 2010-04-22 | 2011-01-05 | 苏州固锝电子股份有限公司 | Lead frame for manufacturing rectifier |
CN107195610A (en) * | 2017-05-16 | 2017-09-22 | 四川旭茂微科技有限公司 | A kind of lead frame of rectifier bridge |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3183552B2 (en) * | 1992-03-31 | 2001-07-09 | 新光電気工業株式会社 | Manufacturing method of multilayer lead frame |
JPH06188347A (en) * | 1992-08-10 | 1994-07-08 | Mitsui High Tec Inc | Method and device for manufacturing lead frame |
JPH09237927A (en) * | 1995-12-26 | 1997-09-09 | Toshiba Corp | Semiconductor film forming method and solar cell manufacturing method |
JP3269392B2 (en) * | 1996-03-07 | 2002-03-25 | 凸版印刷株式会社 | Lead frame structure |
JPH1161442A (en) * | 1997-08-26 | 1999-03-05 | Toppan Printing Co Ltd | Etching parts structural body |
JP2000073186A (en) * | 1998-08-28 | 2000-03-07 | Mitsui High Tec Inc | Production of etching product unit frame |
-
2004
- 2004-04-30 JP JP2004135227A patent/JP2005317827A/en active Pending
-
2005
- 2005-04-27 SG SG200502571A patent/SG116647A1/en unknown
- 2005-04-28 CN CNB2005100679244A patent/CN100431119C/en not_active Expired - Fee Related
- 2005-04-29 TW TW94113846A patent/TW200541037A/en unknown
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