JP2005277114A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2005277114A
JP2005277114A JP2004088266A JP2004088266A JP2005277114A JP 2005277114 A JP2005277114 A JP 2005277114A JP 2004088266 A JP2004088266 A JP 2004088266A JP 2004088266 A JP2004088266 A JP 2004088266A JP 2005277114 A JP2005277114 A JP 2005277114A
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Japan
Prior art keywords
electrode
semiconductor device
semiconductor chip
protruding
protruding electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004088266A
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English (en)
Japanese (ja)
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JP2005277114A5 (enExample
Inventor
Akira Ochiai
公 落合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Sanyo Semiconductors Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Kanto Sanyo Semiconductors Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Kanto Sanyo Semiconductors Co Ltd, Sanyo Electric Co Ltd filed Critical Kanto Sanyo Semiconductors Co Ltd
Priority to JP2004088266A priority Critical patent/JP2005277114A/ja
Priority to TW94108300A priority patent/TWI323932B/zh
Priority to US11/086,990 priority patent/US7605475B2/en
Priority to CNA2005100591360A priority patent/CN1681116A/zh
Priority to KR20050024408A priority patent/KR100682004B1/ko
Publication of JP2005277114A publication Critical patent/JP2005277114A/ja
Publication of JP2005277114A5 publication Critical patent/JP2005277114A5/ja
Pending legal-status Critical Current

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Hydrology & Water Resources (AREA)
  • Water Supply & Treatment (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2004088266A 2004-03-25 2004-03-25 半導体装置 Pending JP2005277114A (ja)

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JP2004088266A JP2005277114A (ja) 2004-03-25 2004-03-25 半導体装置
TW94108300A TWI323932B (en) 2004-03-25 2005-03-18 Semiconductor device
US11/086,990 US7605475B2 (en) 2004-03-25 2005-03-23 Semiconductor device
CNA2005100591360A CN1681116A (zh) 2004-03-25 2005-03-24 半导体装置
KR20050024408A KR100682004B1 (ko) 2004-03-25 2005-03-24 반도체 장치

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JP2010040862A (ja) * 2008-08-06 2010-02-18 Fujikura Ltd 半導体装置
KR101014941B1 (ko) * 2008-10-29 2011-02-15 주식회사 케이이씨 반도체 장치 및 그 제조 방법
JP5529494B2 (ja) * 2009-10-26 2014-06-25 株式会社三井ハイテック リードフレーム
EP3547356A4 (en) * 2016-11-28 2020-07-08 Kyocera Corporation SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

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US5095402A (en) * 1990-10-02 1992-03-10 Rogers Corporation Internally decoupled integrated circuit package
JPH0851179A (ja) 1994-08-08 1996-02-20 Sanyo Electric Co Ltd 集積回路装置およびリードフレーム
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
KR100186309B1 (ko) * 1996-05-17 1999-03-20 문정환 적층형 버텀 리드 패키지
JP3173410B2 (ja) * 1997-03-14 2001-06-04 松下電器産業株式会社 パッケージ基板およびその製造方法
JPH10270623A (ja) * 1997-03-24 1998-10-09 Sumitomo Metal Mining Co Ltd ボールグリッドアレイ用リードフレームおよびこれを用いた半導体装置、並びにその製造方法
KR100370852B1 (ko) 1999-12-20 2003-02-05 앰코 테크놀로지 코리아 주식회사 반도체패키지
JP3854054B2 (ja) * 2000-10-10 2006-12-06 株式会社東芝 半導体装置
JP2002270718A (ja) * 2001-03-07 2002-09-20 Seiko Epson Corp 配線基板及びその製造方法、半導体装置及びその製造方法、回路基板並びに電子機器
KR100426330B1 (ko) * 2001-07-16 2004-04-08 삼성전자주식회사 지지 테이프를 이용한 초박형 반도체 패키지 소자
KR100435813B1 (ko) * 2001-12-06 2004-06-12 삼성전자주식회사 금속 바를 이용하는 멀티 칩 패키지와 그 제조 방법
US6979904B2 (en) * 2002-04-19 2005-12-27 Micron Technology, Inc. Integrated circuit package having reduced interconnects
US6800930B2 (en) * 2002-07-31 2004-10-05 Micron Technology, Inc. Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies
JP2004186422A (ja) * 2002-12-03 2004-07-02 Shinko Electric Ind Co Ltd 電子部品実装構造及びその製造方法

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KR20060044670A (ko) 2006-05-16
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US20050218526A1 (en) 2005-10-06
US7605475B2 (en) 2009-10-20
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