JP2005277114A5 - - Google Patents

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Publication number
JP2005277114A5
JP2005277114A5 JP2004088266A JP2004088266A JP2005277114A5 JP 2005277114 A5 JP2005277114 A5 JP 2005277114A5 JP 2004088266 A JP2004088266 A JP 2004088266A JP 2004088266 A JP2004088266 A JP 2004088266A JP 2005277114 A5 JP2005277114 A5 JP 2005277114A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
electrode
lead
via hole
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004088266A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005277114A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004088266A priority Critical patent/JP2005277114A/ja
Priority claimed from JP2004088266A external-priority patent/JP2005277114A/ja
Priority to TW94108300A priority patent/TWI323932B/zh
Priority to US11/086,990 priority patent/US7605475B2/en
Priority to CNA2005100591360A priority patent/CN1681116A/zh
Priority to KR20050024408A priority patent/KR100682004B1/ko
Publication of JP2005277114A publication Critical patent/JP2005277114A/ja
Publication of JP2005277114A5 publication Critical patent/JP2005277114A5/ja
Pending legal-status Critical Current

Links

JP2004088266A 2004-03-25 2004-03-25 半導体装置 Pending JP2005277114A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004088266A JP2005277114A (ja) 2004-03-25 2004-03-25 半導体装置
TW94108300A TWI323932B (en) 2004-03-25 2005-03-18 Semiconductor device
US11/086,990 US7605475B2 (en) 2004-03-25 2005-03-23 Semiconductor device
CNA2005100591360A CN1681116A (zh) 2004-03-25 2005-03-24 半导体装置
KR20050024408A KR100682004B1 (ko) 2004-03-25 2005-03-24 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004088266A JP2005277114A (ja) 2004-03-25 2004-03-25 半導体装置

Publications (2)

Publication Number Publication Date
JP2005277114A JP2005277114A (ja) 2005-10-06
JP2005277114A5 true JP2005277114A5 (enExample) 2007-05-17

Family

ID=35053385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004088266A Pending JP2005277114A (ja) 2004-03-25 2004-03-25 半導体装置

Country Status (5)

Country Link
US (1) US7605475B2 (enExample)
JP (1) JP2005277114A (enExample)
KR (1) KR100682004B1 (enExample)
CN (1) CN1681116A (enExample)
TW (1) TWI323932B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040862A (ja) * 2008-08-06 2010-02-18 Fujikura Ltd 半導体装置
KR101014941B1 (ko) * 2008-10-29 2011-02-15 주식회사 케이이씨 반도체 장치 및 그 제조 방법
JP5529494B2 (ja) * 2009-10-26 2014-06-25 株式会社三井ハイテック リードフレーム
EP3547356A4 (en) * 2016-11-28 2020-07-08 Kyocera Corporation SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5095402A (en) * 1990-10-02 1992-03-10 Rogers Corporation Internally decoupled integrated circuit package
JPH0851179A (ja) 1994-08-08 1996-02-20 Sanyo Electric Co Ltd 集積回路装置およびリードフレーム
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
KR100186309B1 (ko) * 1996-05-17 1999-03-20 문정환 적층형 버텀 리드 패키지
JP3173410B2 (ja) * 1997-03-14 2001-06-04 松下電器産業株式会社 パッケージ基板およびその製造方法
JPH10270623A (ja) * 1997-03-24 1998-10-09 Sumitomo Metal Mining Co Ltd ボールグリッドアレイ用リードフレームおよびこれを用いた半導体装置、並びにその製造方法
KR100370852B1 (ko) 1999-12-20 2003-02-05 앰코 테크놀로지 코리아 주식회사 반도체패키지
JP3854054B2 (ja) * 2000-10-10 2006-12-06 株式会社東芝 半導体装置
JP2002270718A (ja) * 2001-03-07 2002-09-20 Seiko Epson Corp 配線基板及びその製造方法、半導体装置及びその製造方法、回路基板並びに電子機器
KR100426330B1 (ko) * 2001-07-16 2004-04-08 삼성전자주식회사 지지 테이프를 이용한 초박형 반도체 패키지 소자
KR100435813B1 (ko) * 2001-12-06 2004-06-12 삼성전자주식회사 금속 바를 이용하는 멀티 칩 패키지와 그 제조 방법
US6979904B2 (en) * 2002-04-19 2005-12-27 Micron Technology, Inc. Integrated circuit package having reduced interconnects
US6800930B2 (en) * 2002-07-31 2004-10-05 Micron Technology, Inc. Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies
JP2004186422A (ja) * 2002-12-03 2004-07-02 Shinko Electric Ind Co Ltd 電子部品実装構造及びその製造方法

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