JP2009117611A5 - - Google Patents

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Publication number
JP2009117611A5
JP2009117611A5 JP2007288907A JP2007288907A JP2009117611A5 JP 2009117611 A5 JP2009117611 A5 JP 2009117611A5 JP 2007288907 A JP2007288907 A JP 2007288907A JP 2007288907 A JP2007288907 A JP 2007288907A JP 2009117611 A5 JP2009117611 A5 JP 2009117611A5
Authority
JP
Japan
Prior art keywords
cavity
silicon substrate
semiconductor package
package according
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007288907A
Other languages
English (en)
Japanese (ja)
Other versions
JP4912275B2 (ja
JP2009117611A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007288907A priority Critical patent/JP4912275B2/ja
Priority claimed from JP2007288907A external-priority patent/JP4912275B2/ja
Priority to EP08168216A priority patent/EP2058872A2/en
Priority to US12/265,203 priority patent/US7960820B2/en
Priority to TW097142608A priority patent/TW200921860A/zh
Publication of JP2009117611A publication Critical patent/JP2009117611A/ja
Publication of JP2009117611A5 publication Critical patent/JP2009117611A5/ja
Application granted granted Critical
Publication of JP4912275B2 publication Critical patent/JP4912275B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007288907A 2007-11-06 2007-11-06 半導体パッケージ Expired - Fee Related JP4912275B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007288907A JP4912275B2 (ja) 2007-11-06 2007-11-06 半導体パッケージ
EP08168216A EP2058872A2 (en) 2007-11-06 2008-11-03 Semiconductor package
US12/265,203 US7960820B2 (en) 2007-11-06 2008-11-05 Semiconductor package
TW097142608A TW200921860A (en) 2007-11-06 2008-11-05 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007288907A JP4912275B2 (ja) 2007-11-06 2007-11-06 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2009117611A JP2009117611A (ja) 2009-05-28
JP2009117611A5 true JP2009117611A5 (enExample) 2010-11-11
JP4912275B2 JP4912275B2 (ja) 2012-04-11

Family

ID=40230534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007288907A Expired - Fee Related JP4912275B2 (ja) 2007-11-06 2007-11-06 半導体パッケージ

Country Status (4)

Country Link
US (1) US7960820B2 (enExample)
EP (1) EP2058872A2 (enExample)
JP (1) JP4912275B2 (enExample)
TW (1) TW200921860A (enExample)

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Publication number Priority date Publication date Assignee Title
KR100836663B1 (ko) * 2006-02-16 2008-06-10 삼성전기주식회사 캐비티가 형성된 패키지 온 패키지 및 그 제조 방법
DE102009022901A1 (de) * 2009-05-27 2010-12-02 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls
JP2011023709A (ja) * 2009-06-18 2011-02-03 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP5208871B2 (ja) * 2009-07-13 2013-06-12 浜松ホトニクス株式会社 光検出器
JP5100715B2 (ja) * 2009-07-13 2012-12-19 株式会社東芝 半導体装置及び半導体装置の製造方法
TWI453957B (zh) * 2010-05-24 2014-09-21 Advanced Optoelectronic Tech 發光二極體之封裝結構
TWI406435B (zh) * 2010-08-06 2013-08-21 Advanced Optoelectronic Tech 發光二極體製造方法
US9443834B2 (en) * 2010-09-02 2016-09-13 Micron Technology, Inc. Back-to-back solid state lighting devices and associated methods
JP2012119601A (ja) * 2010-12-03 2012-06-21 Nec Corp インターポーザ及び半導体装置
US9013011B1 (en) * 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
US9105635B2 (en) * 2013-03-13 2015-08-11 Intel Corporation Stubby pads for channel cross-talk reduction
US10651150B2 (en) 2014-03-10 2020-05-12 Mitsubishi Heavy Industries, Ltd. Multichip module including surface mounting part embedded therein
JP2016004888A (ja) * 2014-06-17 2016-01-12 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP6663167B2 (ja) * 2015-03-18 2020-03-11 浜松ホトニクス株式会社 光検出装置
US11211305B2 (en) 2016-04-01 2021-12-28 Texas Instruments Incorporated Apparatus and method to support thermal management of semiconductor-based components
US10861796B2 (en) 2016-05-10 2020-12-08 Texas Instruments Incorporated Floating die package
US10179730B2 (en) 2016-12-08 2019-01-15 Texas Instruments Incorporated Electronic sensors with sensor die in package structure cavity
US10411150B2 (en) 2016-12-30 2019-09-10 Texas Instruments Incorporated Optical isolation systems and circuits and photon detectors with extended lateral P-N junctions
US10074639B2 (en) 2016-12-30 2018-09-11 Texas Instruments Incorporated Isolator integrated circuits with package structure cavity and fabrication methods
US9929110B1 (en) 2016-12-30 2018-03-27 Texas Instruments Incorporated Integrated circuit wave device and method
US10121847B2 (en) 2017-03-17 2018-11-06 Texas Instruments Incorporated Galvanic isolation device
JP6993220B2 (ja) * 2017-12-26 2022-01-13 京セラ株式会社 電子部品収納用パッケージ、電子装置および電子モジュール
DE102018100946A1 (de) * 2018-01-17 2019-07-18 Osram Opto Semiconductors Gmbh Bauteil und verfahren zur herstellung eines bauteils
KR102796767B1 (ko) * 2019-07-10 2025-04-16 삼성전자주식회사 인터포저를 포함하는 전자 장치
SG10201908828WA (en) 2019-09-23 2021-04-29 Apple Inc Embedded Packaging Concepts for Integration of ASICs and Optical Components
US11942386B2 (en) 2020-08-24 2024-03-26 Texas Instruments Incorporated Electronic devices in semiconductor package cavities
JP2022186420A (ja) 2021-06-04 2022-12-15 キオクシア株式会社 半導体装置の製造方法および半導体装置
US12153268B2 (en) * 2022-01-03 2024-11-26 Apple Inc. Technologies for increased volumetric and functional efficiencies of optical packages
JP7741745B2 (ja) * 2022-02-15 2025-09-18 キオクシア株式会社 半導体装置およびその製造方法
US20240332105A1 (en) * 2023-04-03 2024-10-03 Nxp Usa, Inc. Multidevice package with recessed mounting surface

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875859A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 半導体装置
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
US6343019B1 (en) * 1997-12-22 2002-01-29 Micron Technology, Inc. Apparatus and method of stacking die on a substrate
US20040038442A1 (en) * 2002-08-26 2004-02-26 Kinsman Larry D. Optically interactive device packages and methods of assembly
JP2004296613A (ja) * 2003-03-26 2004-10-21 Renesas Technology Corp 半導体装置
JP2006186357A (ja) * 2003-10-03 2006-07-13 Matsushita Electric Works Ltd センサ装置及びその製造方法
JP4692260B2 (ja) * 2005-12-12 2011-06-01 株式会社デンソー 半導体力学量センサ装置およびその製造方法
JP4996101B2 (ja) 2006-02-02 2012-08-08 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
JP2007287967A (ja) * 2006-04-18 2007-11-01 Shinko Electric Ind Co Ltd 電子部品装置
JP4933934B2 (ja) * 2007-03-28 2012-05-16 ラピスセミコンダクタ株式会社 半導体装置及び半導体装置の製造方法

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