JP4912275B2 - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

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Publication number
JP4912275B2
JP4912275B2 JP2007288907A JP2007288907A JP4912275B2 JP 4912275 B2 JP4912275 B2 JP 4912275B2 JP 2007288907 A JP2007288907 A JP 2007288907A JP 2007288907 A JP2007288907 A JP 2007288907A JP 4912275 B2 JP4912275 B2 JP 4912275B2
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Japan
Prior art keywords
cavity
silicon substrate
electronic device
semiconductor package
device chip
Prior art date
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Expired - Fee Related
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JP2007288907A
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English (en)
Japanese (ja)
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JP2009117611A5 (enExample
JP2009117611A (ja
Inventor
晶紀 白石
啓 村山
裕一 田口
昌宏 春原
光敏 東
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007288907A priority Critical patent/JP4912275B2/ja
Priority to EP08168216A priority patent/EP2058872A2/en
Priority to US12/265,203 priority patent/US7960820B2/en
Priority to TW097142608A priority patent/TW200921860A/zh
Publication of JP2009117611A publication Critical patent/JP2009117611A/ja
Publication of JP2009117611A5 publication Critical patent/JP2009117611A5/ja
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Publication of JP4912275B2 publication Critical patent/JP4912275B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
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    • H01L2924/11—Device type
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    • H01L2924/1204—Optical Diode
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/151—Die mounting substrate
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    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
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    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Light Receiving Elements (AREA)
JP2007288907A 2007-11-06 2007-11-06 半導体パッケージ Expired - Fee Related JP4912275B2 (ja)

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US12/265,203 US7960820B2 (en) 2007-11-06 2008-11-05 Semiconductor package
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US20090115049A1 (en) 2009-05-07

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