JP5208871B2 - 光検出器 - Google Patents
光検出器 Download PDFInfo
- Publication number
- JP5208871B2 JP5208871B2 JP2009164766A JP2009164766A JP5208871B2 JP 5208871 B2 JP5208871 B2 JP 5208871B2 JP 2009164766 A JP2009164766 A JP 2009164766A JP 2009164766 A JP2009164766 A JP 2009164766A JP 5208871 B2 JP5208871 B2 JP 5208871B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor element
- optical semiconductor
- photodetector
- photodiode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 claims description 101
- 239000000758 substrate Substances 0.000 claims description 98
- 230000003287 optical effect Effects 0.000 claims description 54
- 238000006243 chemical reaction Methods 0.000 claims description 27
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 51
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000010931 gold Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000007789 sealing Methods 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 238000000708 deep reactive-ion etching Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/30—Measuring the intensity of spectral lines directly on the spectrum itself
- G01J3/36—Investigating two or more bands of a spectrum by separate detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0204—Compact construction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
- H01L25/043—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
Description
[第1の実施形態]
[第2の実施形態]
Claims (6)
- 第1の波長域のエネルギ線、及び前記第1の波長域よりも長波長側の第2の波長域のエネルギ線を検出するための光検出器であって、
所定の比抵抗を有する第1の半導体層と、
前記第1の半導体層の一方側の主面に積層された絶縁層と、
前記絶縁層の一方側の主面に積層され、前記所定の比抵抗よりも高い比抵抗を有する第2の半導体層と、
前記第2の半導体層の一方側の主面に絶縁膜を介して設けられ、前記第1の半導体層が含む電気通路部と電気的に接続された配線膜と、
前記第1の半導体層の他方側の主面に形成された凹部を覆うと共に前記凹部内の気密性を確保するように、前記第1の半導体層の他方側の主面上に配置され、前記電気通路部と電気的に接続された第1の光半導体素子と、
前記凹部内に配置され、前記第1の光半導体素子と電気的に接続された第2の光半導体素子と、を備え、
前記第1の光半導体素子は、
第1の半導体基板と、
前記第1の半導体基板の一方側の部分に設けられ、前記第1の波長域のエネルギ線が前記第1の半導体基板に対して他方側から入射したときに電荷を発生する第1の光電変換部と、を有し、
前記第2の光半導体素子は、
第2の半導体基板と、
前記第1の光電変換部と対向するように前記第2の半導体基板の他方側の部分に設けられ、前記第2の波長域のエネルギ線が前記第2の半導体基板に対して他方側から入射したときに電荷を発生する第2の光電変換部と、を有することを特徴とする光検出器。 - 前記第2の光半導体素子は、フリップチップボンディングによって前記第1の光半導体素子と電気的に接続されていることを特徴とする請求項1記載の光検出器。
- 前記凹部内の気密性は、前記電気通路部の他方側の端面に設けられた電極膜に前記第1の光半導体素子の電極パッドが気密に接合されることにより、確保されていることを特徴とする請求項1又は2記載の光検出器。
- 前記配線膜は、前記第2の半導体層に形成された除去部、及び前記絶縁層に形成された除去部を介して、前記電気通路部の一方側の端面と電気的に接続されていることを特徴とする請求項1〜3のいずれか一項記載の光検出器。
- 前記第2の光半導体素子は、前記凹部の底面に接合されていることを特徴とする請求項1〜4のいずれか一項記載の光検出器。
- 前記第2の光半導体素子は、前記凹部の底面から離れていることを特徴とする請求項1〜4のいずれか一項記載の光検出器。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009164766A JP5208871B2 (ja) | 2009-07-13 | 2009-07-13 | 光検出器 |
PCT/JP2010/061549 WO2011007703A1 (ja) | 2009-07-13 | 2010-07-07 | 光検出器 |
CN201080031452.6A CN102473790B (zh) | 2009-07-13 | 2010-07-07 | 光检测器 |
EP10799762.9A EP2455983B1 (en) | 2009-07-13 | 2010-07-07 | Photodetector |
US13/383,282 US8564036B2 (en) | 2009-07-13 | 2010-07-07 | Photodetector for detecting energy line in a first wavelength region and in a second wavelength region |
TW099122721A TWI502725B (zh) | 2009-07-13 | 2010-07-09 | Photodetector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009164766A JP5208871B2 (ja) | 2009-07-13 | 2009-07-13 | 光検出器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011023400A JP2011023400A (ja) | 2011-02-03 |
JP5208871B2 true JP5208871B2 (ja) | 2013-06-12 |
Family
ID=43449312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009164766A Active JP5208871B2 (ja) | 2009-07-13 | 2009-07-13 | 光検出器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8564036B2 (ja) |
EP (1) | EP2455983B1 (ja) |
JP (1) | JP5208871B2 (ja) |
CN (1) | CN102473790B (ja) |
TW (1) | TWI502725B (ja) |
WO (1) | WO2011007703A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101765473B1 (ko) * | 2010-06-21 | 2017-08-24 | 삼성전자 주식회사 | 인쇄 회로 기판 및 이를 포함하는 반도체 패키지 |
JP2012238648A (ja) * | 2011-05-10 | 2012-12-06 | Sony Corp | 固体撮像装置及び電子機器 |
KR102324732B1 (ko) * | 2019-07-31 | 2021-11-09 | 가부시키가이샤 교토 세미컨덕터 | 수광 소자 유닛 |
JP6890857B2 (ja) * | 2019-07-31 | 2021-06-18 | 株式会社京都セミコンダクター | 受光素子ユニット |
US11610927B2 (en) * | 2020-02-27 | 2023-03-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Capping structure along image sensor element to mitigate damage to active layer |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0318069A (ja) * | 1989-06-14 | 1991-01-25 | Matsushita Electron Corp | 半導体受光装置 |
JP4786035B2 (ja) * | 1999-04-13 | 2011-10-05 | 浜松ホトニクス株式会社 | 半導体装置 |
FR2844635B1 (fr) * | 2002-09-16 | 2005-08-19 | Commissariat Energie Atomique | Dispositif detecteur de rayonnement electromagnetique avec boitier integre comportant deux detecteurs superposes |
JP2005277063A (ja) * | 2004-03-24 | 2005-10-06 | Matsushita Electric Ind Co Ltd | 受光素子 |
JP4912275B2 (ja) * | 2007-11-06 | 2012-04-11 | 新光電気工業株式会社 | 半導体パッケージ |
-
2009
- 2009-07-13 JP JP2009164766A patent/JP5208871B2/ja active Active
-
2010
- 2010-07-07 EP EP10799762.9A patent/EP2455983B1/en active Active
- 2010-07-07 WO PCT/JP2010/061549 patent/WO2011007703A1/ja active Application Filing
- 2010-07-07 US US13/383,282 patent/US8564036B2/en active Active
- 2010-07-07 CN CN201080031452.6A patent/CN102473790B/zh active Active
- 2010-07-09 TW TW099122721A patent/TWI502725B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2011023400A (ja) | 2011-02-03 |
CN102473790A (zh) | 2012-05-23 |
WO2011007703A1 (ja) | 2011-01-20 |
TWI502725B (zh) | 2015-10-01 |
EP2455983A4 (en) | 2017-05-10 |
EP2455983A1 (en) | 2012-05-23 |
TW201115715A (en) | 2011-05-01 |
US20120187517A1 (en) | 2012-07-26 |
CN102473790B (zh) | 2014-08-27 |
US8564036B2 (en) | 2013-10-22 |
EP2455983B1 (en) | 2017-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5791461B2 (ja) | 光検出装置 | |
JP4499386B2 (ja) | 裏面入射型光検出素子の製造方法 | |
US7420257B2 (en) | Backside-illuminated photodetector | |
JP5832852B2 (ja) | 光検出装置 | |
JP2012059881A (ja) | 撮像素子、撮像モジュール及び撮像素子の製造方法 | |
JP5208871B2 (ja) | 光検出器 | |
WO2005093857A1 (ja) | 半導体光検出素子及びその製造方法 | |
KR101004243B1 (ko) | 이면 입사형 포토다이오드 어레이, 그 제조방법 및반도체장치 | |
JP2018198286A (ja) | 半導体受光素子、及び半導体受光素子の製造方法 | |
JP5911629B2 (ja) | 光検出装置 | |
JP4647955B2 (ja) | 光電陰極板及び電子管 | |
JP2005129689A (ja) | 半導体受光素子及び光受信モジュール | |
JP6095903B2 (ja) | 固体撮像装置の製造方法及び固体撮像装置 | |
JP6244403B2 (ja) | 半導体光検出素子 | |
JP6116728B2 (ja) | 半導体光検出素子 | |
JP6282307B2 (ja) | 半導体光検出素子 | |
JP5989872B2 (ja) | 光検出装置の接続構造 | |
JP2006203076A (ja) | 光検出素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120322 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130205 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130220 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160301 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5208871 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |