ATE454713T1 - Flip-chip-verbindung über chip-durchgangswege - Google Patents

Flip-chip-verbindung über chip-durchgangswege

Info

Publication number
ATE454713T1
ATE454713T1 AT07826430T AT07826430T ATE454713T1 AT E454713 T1 ATE454713 T1 AT E454713T1 AT 07826430 T AT07826430 T AT 07826430T AT 07826430 T AT07826430 T AT 07826430T AT E454713 T1 ATE454713 T1 AT E454713T1
Authority
AT
Austria
Prior art keywords
integrated circuit
circuit package
chip
pathways
connection via
Prior art date
Application number
AT07826430T
Other languages
English (en)
Inventor
Andrew L Robinson
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE454713T1 publication Critical patent/ATE454713T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/521—Constructional features
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/89—Sonar systems specially adapted for specific applications for mapping or imaging
    • G01S15/8906—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques
    • G01S15/8909—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration
    • G01S15/8915—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array
    • G01S15/8925—Short-range imaging systems; Acoustic microscope systems using pulse-echo techniques using a static transducer configuration using a transducer array the array being a two-dimensional transducer configuration, i.e. matrix or orthogonal linear arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Wire Bonding (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Micromachines (AREA)
AT07826430T 2006-09-25 2007-09-18 Flip-chip-verbindung über chip-durchgangswege ATE454713T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82681506P 2006-09-25 2006-09-25
PCT/IB2007/053771 WO2008038183A1 (en) 2006-09-25 2007-09-18 Flip-chip interconnection through chip vias

Publications (1)

Publication Number Publication Date
ATE454713T1 true ATE454713T1 (de) 2010-01-15

Family

ID=39060260

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07826430T ATE454713T1 (de) 2006-09-25 2007-09-18 Flip-chip-verbindung über chip-durchgangswege

Country Status (9)

Country Link
US (1) US8242665B2 (de)
EP (1) EP2070114B1 (de)
JP (1) JP5175853B2 (de)
CN (1) CN101517737B (de)
AT (1) ATE454713T1 (de)
DE (1) DE602007004242D1 (de)
RU (1) RU2449418C2 (de)
TW (1) TW200826209A (de)
WO (1) WO2008038183A1 (de)

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US10080544B2 (en) * 2008-09-15 2018-09-25 Teratech Corporation Ultrasound 3D imaging system
US8207652B2 (en) * 2009-06-16 2012-06-26 General Electric Company Ultrasound transducer with improved acoustic performance
US8575558B2 (en) 2010-11-30 2013-11-05 General Electric Company Detector array with a through-via interposer
US8659148B2 (en) 2010-11-30 2014-02-25 General Electric Company Tileable sensor array
WO2012112540A2 (en) 2011-02-15 2012-08-23 Fujifilm Dimatix, Inc. Piezoelectric transducers using micro-dome arrays
JP5961246B2 (ja) * 2011-03-22 2016-08-02 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 基板に対して抑制された音響結合を持つ超音波ｃｍｕｔ
RU2603435C2 (ru) 2011-10-17 2016-11-27 Конинклейке Филипс Н.В. Устройство с переходными отверстиями в подложке и способ его производства
US8659212B2 (en) * 2012-02-16 2014-02-25 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
US8742646B2 (en) * 2012-03-29 2014-06-03 General Electric Company Ultrasound acoustic assemblies and methods of manufacture
KR20220097541A (ko) 2013-03-15 2022-07-07 버터플라이 네트워크, 인크. 모놀리식 초음파 이미징 디바이스, 시스템 및 방법
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
AU2014293274B2 (en) 2013-07-23 2018-11-01 Butterfly Network, Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
TWI671059B (zh) 2014-04-18 2019-09-11 美商蝴蝶網路公司 超音波成像壓縮方法和設備
WO2015161157A1 (en) * 2014-04-18 2015-10-22 Butterfly Network, Inc. Architecture of single substrate ultrasonic imaging devices, related apparatuses, and methods
EP3028772B1 (de) * 2014-12-02 2022-12-28 Samsung Medison Co., Ltd. Ultraschallsonde und verfahren zur herstellung davon
KR102373132B1 (ko) * 2014-12-26 2022-03-11 삼성메디슨 주식회사 초음파 프로브 장치 및 초음파 촬영 장치
JP5923205B1 (ja) * 2015-07-07 2016-05-24 日立アロカメディカル株式会社 超音波探触子
CN105097747B (zh) * 2015-09-01 2018-07-06 上海伊诺尔信息技术有限公司 智能卡芯片封装结构及封装方法
US11471911B2 (en) * 2016-05-16 2022-10-18 Baker Hughes, A Ge Company, Llc Phased array ultrasonic transducer and method of manufacture
JP6681784B2 (ja) * 2016-05-20 2020-04-15 新光電気工業株式会社 バッキング部材及びその製造方法と超音波探触子
KR102227329B1 (ko) * 2016-07-26 2021-03-12 지멘스 메디컬 솔루션즈 유에스에이, 인크. 초음파 트랜스듀서 및 그 제조 방법
JP6825290B2 (ja) * 2016-09-29 2021-02-03 Tdk株式会社 圧電素子
CN106558649B (zh) * 2016-11-08 2019-11-26 广东奥迪威传感科技股份有限公司 超声波传感器及其制造方法
US11498096B2 (en) * 2018-11-06 2022-11-15 Siemens Medical Solutions Usa, Inc. Chip-on-array with interposer for a multidimensional transducer array
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Also Published As

Publication number Publication date
EP2070114B1 (de) 2010-01-06
EP2070114A1 (de) 2009-06-17
RU2009115685A (ru) 2010-11-10
US8242665B2 (en) 2012-08-14
DE602007004242D1 (de) 2010-02-25
JP5175853B2 (ja) 2013-04-03
JP2010504639A (ja) 2010-02-12
TW200826209A (en) 2008-06-16
CN101517737A (zh) 2009-08-26
CN101517737B (zh) 2012-10-31
WO2008038183A1 (en) 2008-04-03
RU2449418C2 (ru) 2012-04-27
US20100025785A1 (en) 2010-02-04

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