WO2009034983A1 - 磁気センサモジュール - Google Patents

磁気センサモジュール Download PDF

Info

Publication number
WO2009034983A1
WO2009034983A1 PCT/JP2008/066292 JP2008066292W WO2009034983A1 WO 2009034983 A1 WO2009034983 A1 WO 2009034983A1 JP 2008066292 W JP2008066292 W JP 2008066292W WO 2009034983 A1 WO2009034983 A1 WO 2009034983A1
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic sensor
base material
sensor module
bonding
axis magnetic
Prior art date
Application number
PCT/JP2008/066292
Other languages
English (en)
French (fr)
Inventor
Toshiaki Konno
Naoki Kitaura
Nobuaki Haga
Original Assignee
Alps Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co., Ltd. filed Critical Alps Electric Co., Ltd.
Priority to JP2009532192A priority Critical patent/JP5150637B2/ja
Priority to EP08830814.3A priority patent/EP2189801B1/en
Publication of WO2009034983A1 publication Critical patent/WO2009034983A1/ja
Priority to US12/707,263 priority patent/US7868612B2/en
Priority to US12/961,235 priority patent/US7982460B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/0206—Three-component magnetometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0005—Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/0047—Housings or packaging of magnetic sensors ; Holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Hall/Mr Elements (AREA)
  • Measuring Magnetic Variables (AREA)

Abstract

　コーナーバンプボンディングにより磁気センサと基材との間の電気的接続を行った状態で小型化を図ることができる磁気センサモジュールを提供すること。磁気センサモジュールにおいては、主面上に配線（２１）を有する基材（１１）上に、接合材としてダイボンド樹脂（２２）を用いてＺ軸用磁気センサ（１３ｃ）が実装されている。このＺ軸用磁気センサ（１３ｃ）は、底面に電極パッド（２３）を形成したものを９０°傾けて基材（１１）上に実装するので、電極パッド（２３）が側面に位置することになる。Ｚ軸用磁気センサ（１３ｃ）の基材（１１）の主面に対面する面には、ダイボンド樹脂を充填可能な接合材収容領域が設けられている。この接合材収容領域は、溝構造（２４）で構成されており、この溝構造（２４）は、Ｚ軸用磁気センサ（１３ｃ）の基材（１１）の主面に対面する面において、基材（１１）上に形成された配線（２１）に近い端部に設けられている。
PCT/JP2008/066292 2007-09-10 2008-09-10 磁気センサモジュール WO2009034983A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009532192A JP5150637B2 (ja) 2007-09-10 2008-09-10 磁気センサモジュール
EP08830814.3A EP2189801B1 (en) 2007-09-10 2008-09-10 Magnetic sensor module
US12/707,263 US7868612B2 (en) 2007-09-10 2010-02-17 Magnetic sensor module
US12/961,235 US7982460B2 (en) 2007-09-10 2010-12-06 Magnetic sensor module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007233820 2007-09-10
JP2007-233820 2007-09-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/707,263 Continuation US7868612B2 (en) 2007-09-10 2010-02-17 Magnetic sensor module

Publications (1)

Publication Number Publication Date
WO2009034983A1 true WO2009034983A1 (ja) 2009-03-19

Family

ID=40451990

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066292 WO2009034983A1 (ja) 2007-09-10 2008-09-10 磁気センサモジュール

Country Status (4)

Country Link
US (2) US7868612B2 (ja)
EP (1) EP2189801B1 (ja)
JP (1) JP5150637B2 (ja)
WO (1) WO2009034983A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012124423A1 (ja) * 2011-03-11 2012-09-20 アルプス電気株式会社 物理量センサ装置とその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5150637B2 (ja) * 2007-09-10 2013-02-20 アルプス電気株式会社 磁気センサモジュール
DE102011001422A1 (de) 2011-03-21 2012-09-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Sensormodul und Verfahren zum Herstellen eines Sensormoduls
JP6571411B2 (ja) * 2014-07-04 2019-09-04 ローム株式会社 半導体装置および半導体装置の製造方法
US20190041211A1 (en) * 2016-03-22 2019-02-07 Panasonic Intellectual Property Management Co., Ltd. Sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000155922A (ja) 1998-11-17 2000-06-06 Yamaha Corp 磁気ヘッドのスライダ
JP2000215428A (ja) * 1999-01-27 2000-08-04 Tdk Corp ヘッドスライダ支持体およびヘッド装置、ならびにそれらの製造方法
JP2005190534A (ja) * 2003-12-25 2005-07-14 Shinka Jitsugyo Kk サスペンション、ヘッドジンバルアセンブリ及び該ヘッドジンバルアセンブリを備えたディスクドライブ装置
JP2007178203A (ja) * 2005-12-27 2007-07-12 Alps Electric Co Ltd 磁気方位検出装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10162333A (ja) * 1996-11-29 1998-06-19 Toshiba Corp ヘッド装置およびこれを用いた記録再生装置
JP2000298812A (ja) * 1999-04-12 2000-10-24 Hitachi Ltd 磁気ヘッド組立体及び磁気ヘッド装置
JP2002215428A (ja) 2001-01-17 2002-08-02 Nissin Electric Co Ltd タスク監視装置、タスク監視方法及びこの方法を記録した記録媒体
JP5150637B2 (ja) * 2007-09-10 2013-02-20 アルプス電気株式会社 磁気センサモジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000155922A (ja) 1998-11-17 2000-06-06 Yamaha Corp 磁気ヘッドのスライダ
JP2000215428A (ja) * 1999-01-27 2000-08-04 Tdk Corp ヘッドスライダ支持体およびヘッド装置、ならびにそれらの製造方法
JP2005190534A (ja) * 2003-12-25 2005-07-14 Shinka Jitsugyo Kk サスペンション、ヘッドジンバルアセンブリ及び該ヘッドジンバルアセンブリを備えたディスクドライブ装置
JP2007178203A (ja) * 2005-12-27 2007-07-12 Alps Electric Co Ltd 磁気方位検出装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012124423A1 (ja) * 2011-03-11 2012-09-20 アルプス電気株式会社 物理量センサ装置とその製造方法
CN103443583A (zh) * 2011-03-11 2013-12-11 阿尔卑斯电气株式会社 物理量传感器装置及其制造方法
JP5572259B2 (ja) * 2011-03-11 2014-08-13 アルプス電気株式会社 物理量センサ装置とその製造方法

Also Published As

Publication number Publication date
US7868612B2 (en) 2011-01-11
US7982460B2 (en) 2011-07-19
EP2189801A4 (en) 2017-11-08
US20100141250A1 (en) 2010-06-10
JP5150637B2 (ja) 2013-02-20
US20110074402A1 (en) 2011-03-31
EP2189801A1 (en) 2010-05-26
JPWO2009034983A1 (ja) 2010-12-24
EP2189801B1 (en) 2021-01-27

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