CN1681116A - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN1681116A
CN1681116A CNA2005100591360A CN200510059136A CN1681116A CN 1681116 A CN1681116 A CN 1681116A CN A2005100591360 A CNA2005100591360 A CN A2005100591360A CN 200510059136 A CN200510059136 A CN 200510059136A CN 1681116 A CN1681116 A CN 1681116A
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CN
China
Prior art keywords
electrode
semiconductor device
semiconductor chip
electrodes
protruding
Prior art date
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Pending
Application number
CNA2005100591360A
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English (en)
Chinese (zh)
Inventor
落合公
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northeast Sanyo Semi-Conductive Co Ltd
Kanto Sanyo Semiconductors Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Northeast Sanyo Semi-Conductive Co Ltd
Sanyo Electric Co Ltd
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Filing date
Publication date
Application filed by Northeast Sanyo Semi-Conductive Co Ltd, Sanyo Electric Co Ltd filed Critical Northeast Sanyo Semi-Conductive Co Ltd
Publication of CN1681116A publication Critical patent/CN1681116A/zh
Pending legal-status Critical Current

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    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
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    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
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    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Molecular Biology (AREA)
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  • Water Supply & Treatment (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CNA2005100591360A 2004-03-25 2005-03-24 半导体装置 Pending CN1681116A (zh)

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CN102105969A (zh) * 2008-08-06 2011-06-22 株式会社藤仓 半导体装置

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JP5529494B2 (ja) * 2009-10-26 2014-06-25 株式会社三井ハイテック リードフレーム
EP3547356A4 (en) * 2016-11-28 2020-07-08 Kyocera Corporation SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

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JPH0851179A (ja) 1994-08-08 1996-02-20 Sanyo Electric Co Ltd 集積回路装置およびリードフレーム
US5973396A (en) 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
KR100186309B1 (ko) * 1996-05-17 1999-03-20 문정환 적층형 버텀 리드 패키지
JP3173410B2 (ja) 1997-03-14 2001-06-04 松下電器産業株式会社 パッケージ基板およびその製造方法
JPH10270623A (ja) * 1997-03-24 1998-10-09 Sumitomo Metal Mining Co Ltd ボールグリッドアレイ用リードフレームおよびこれを用いた半導体装置、並びにその製造方法
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JP3854054B2 (ja) * 2000-10-10 2006-12-06 株式会社東芝 半導体装置
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KR100435813B1 (ko) * 2001-12-06 2004-06-12 삼성전자주식회사 금속 바를 이용하는 멀티 칩 패키지와 그 제조 방법
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CN102105969A (zh) * 2008-08-06 2011-06-22 株式会社藤仓 半导体装置

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KR100682004B1 (ko) 2007-02-15
KR20060044670A (ko) 2006-05-16

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