KR100682004B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR100682004B1
KR100682004B1 KR20050024408A KR20050024408A KR100682004B1 KR 100682004 B1 KR100682004 B1 KR 100682004B1 KR 20050024408 A KR20050024408 A KR 20050024408A KR 20050024408 A KR20050024408 A KR 20050024408A KR 100682004 B1 KR100682004 B1 KR 100682004B1
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South Korea
Prior art keywords
electrode
semiconductor chip
semiconductor device
lead frame
columnar
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KR20050024408A
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English (en)
Korean (ko)
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KR20060044670A (ko
Inventor
이사오 오찌아이
Original Assignee
산요덴키가부시키가이샤
간또 산요 세미컨덕터즈 가부시끼가이샤
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Publication of KR20060044670A publication Critical patent/KR20060044670A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F11/00—Treatment of sludge; Devices therefor
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    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
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    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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  • Engineering & Computer Science (AREA)
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  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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JP5529494B2 (ja) * 2009-10-26 2014-06-25 株式会社三井ハイテック リードフレーム
EP3547356A4 (en) * 2016-11-28 2020-07-08 Kyocera Corporation SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

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JPH0851179A (ja) 1994-08-08 1996-02-20 Sanyo Electric Co Ltd 集積回路装置およびリードフレーム
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
KR100186309B1 (ko) * 1996-05-17 1999-03-20 문정환 적층형 버텀 리드 패키지
JP3173410B2 (ja) * 1997-03-14 2001-06-04 松下電器産業株式会社 パッケージ基板およびその製造方法
JPH10270623A (ja) * 1997-03-24 1998-10-09 Sumitomo Metal Mining Co Ltd ボールグリッドアレイ用リードフレームおよびこれを用いた半導体装置、並びにその製造方法
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JP3854054B2 (ja) * 2000-10-10 2006-12-06 株式会社東芝 半導体装置
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