CN101834166B - 具有支架触点以及管芯附垫的无引脚集成电路封装 - Google Patents

具有支架触点以及管芯附垫的无引脚集成电路封装 Download PDF

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Publication number
CN101834166B
CN101834166B CN200910133612.7A CN200910133612A CN101834166B CN 101834166 B CN101834166 B CN 101834166B CN 200910133612 A CN200910133612 A CN 200910133612A CN 101834166 B CN101834166 B CN 101834166B
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tube core
pad
electric contact
encapsulation
chip
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CN101834166A (zh
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柯克·鲍威尔
约翰·麦克米伦
阿多尼斯·方戈
赛瑞凡·小潘德伦
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UTAC Headquarters Pte Ltd
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Asat Co ltd
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Abstract

本发明提供了一种具有支架触点以及管芯附垫的无引脚集成电路封装，该无引脚集成电路(IC)封装包括：安装到管芯连接焊盘上的IC芯片以及电气地连接到IC芯片的多个电触点。IC芯片、电触点和管芯连接焊盘都由模塑材料所覆盖，并且电触点和管芯连接焊盘的一部分从模塑材料的底面凸出。

Description

具有支架触点以及管芯附垫的无引脚集成电路封装
技术领域
本发明主要涉及一种集成电路(IC)封装技术，更具体地说，涉及一种无引脚IC封装技术以及相关的制作方法。
背景技术
IC封装是制作IC器件的最终步骤。在IC封装过程中，一个或多个IC芯片被安装到封装衬底上，与电触点相连接，之后覆盖包括诸如环氧树脂或硅树脂的模塑混合物的电绝缘物的模塑材料。得到的结构——通常称作“IC封装”——之后连接到其他的电组件，例如，在印刷电路板(PCB)上的电组件。
在大多数IC封装中，在电触点至少部分地暴露使其可以与其他电组件接触的同时，IC芯片完全由模塑材料所覆盖。换言之，电触点被设计为形成模塑材料内的IC芯片与模塑材料之外的电组件之间的连接。这些电触点的最通常的设计为其中形成延伸出模塑材料的“引脚”的设计。引脚通常被向下弯曲以形成与PCB上的电子组件之间的连接。
不幸的是，外部引脚的存在往往会显著地增加IC封装的尺寸。例如，由于引脚的水平延伸，其往往会增加整个IC封装的长度和宽度。这些增加的尺寸可能在PCB的空间被限制的系统中是不利的。此外，因为外部引脚通常沿着IC封装的侧面布置，所以IC封装的针脚数目由围绕IC封装的线性距离所限制。此外，这些引脚需要对其直度、共面度以及其他需要的机械尺寸进行额外的检查步骤(如果它们不满足规格，还需要进行返工或废弃)。最后，引脚(从焊指开始向下到外部部分的末端)增加了整个电信号长度，这影响了IC芯片的电性能。
认识到了传统IC封装的这些和其他问题，研究人员已经发展了外部引脚由电触点所替代的IC封装，其中电触点在其顶部由模塑材料所覆盖但是在IC封装的底部暴露，因此，电气触点可以与IC封装下方的电组件相连接。由于没有外部引脚，这些IC封装——被称作“无引脚”IC封装——往往相对于传统的IC封装占据更少的空间。此外，这些IC封装消除了弯曲引脚以形成连接的需要。
传统无引脚IC封装的一些例子的公开涉及或通常指向美国专利号6,498,099和7,049,177，他们各自公开的内容都被结合在这里作为参考。除去其他内容之外，这些专利描述并示出了无引脚IC封装的各种设计变化以及制作和使用无引脚IC封装的各种技术。
发明内容
公开的实施例包括无引脚IC封装，其中电触点延伸到模塑层之下形成“支架”接触。这些IC封装也可以包括由相同的引线框架带所形成的作为电触点并延伸到模塑层的表面之下的管芯连接焊盘。
这些管芯安装焊盘可以通过模塑层暴露以形成从IC芯片到PCB上的铜层的直接热路径。铜层可以作为散发通常工作过程中由IC芯片所产生的热量的散热片。根据IC芯片的尺寸以及是否需要接地连接到该焊盘的内部部分，可以改变暴露的管芯连接焊盘的尺寸。在一些实施例中，暴露的管芯连接焊盘可以比IC芯片小很多以便于给封装之下的PCB上的迹线或路径留出空间。在另一些实施例中，也可能期望根本没有任何暴露的管芯连接焊盘，因为在封装之下的PCB上邻近电路迹线的暴露的金属的出现，可能会导致干涉和不期望的电耦合。在另一些实施例中，为了方便向PCB上的表面安装或者为了在管芯连接焊盘内部提供额特殊的电连通性，暴露的管芯连接焊盘可以具有特殊的结构，诸如分段部分的阵列。在分段部分的情况下，这些分段之间所产生的通道也可以允许表面安装过程中焊接助焊剂的排气。
在一个实施例中，一种无引脚集成电路(IC)封装，包括：管芯连接焊盘，安装到管芯连接焊盘上的IC芯片，电气地连接到IC芯片的多个电触点，以及形成在IC芯片、管芯连接焊盘、电触点以及用于将IC芯片连接到电触点的材料(诸如接合线)上的模塑层。模塑层有顶部分和底部分，顶部分覆盖管芯连接焊盘和电触点并且管芯连接焊盘和电触点的底部通过底部分暴露。管芯连接焊盘的底部的至少一部分延伸到模塑层的底部分之外相对于一个或多个电触点的底部分更小的距离。
在另一个实施例中，一种无引脚集成电路(IC)封装，包括粘合剂层，安装到粘合剂层上IC芯片，连接到IC芯片的多个电触点以及形成在IC芯片、粘合剂层以及电触点上的模塑层。模塑层有顶部分和底部分，顶部分覆盖管芯连接焊盘和电触点并且粘合剂层的底部和电触点的底面通过底部分暴露。管芯连接焊盘延伸到模塑层的底部分之外，粘合剂层形成在模塑层中由管芯连接焊盘产生的区域，管芯连接焊盘与电触点一起由公共金属层形成。
在另一个实施例中，一种制作无引脚集成电路(IC)封装的方法，包括除去引线框架带的一部分以形成限定用于管芯连接焊盘和多个电触点的区域的凹陷。将IC芯片安装到管芯连接焊盘区域中，之后形成电触点区域与IC芯片之间的电连接。使用模塑层覆盖IC芯片、管芯连接焊盘区域和电触点区域以及电连接，模塑层填充凹陷。在引线框架带的底面上的电触点区域形成抗蚀刻层，选择性地蚀刻引线框架带的底面，使用抗蚀刻层作为蚀刻掩模，由此使电触点和管芯连接焊盘形成为分离的组件。引线框架带的底面的选择性蚀刻除去了管芯连接焊盘的至少一部分，使得管芯连接焊盘的底部分从模塑层的底面延伸出相对于一个或多个电触点的底部分更小的距离。
附图说明
图1示出了作为用于解释在此书面描述中出现的其他无引脚IC封装的参考的无引脚IC封装。
图2A和图2B示出了具有与模塑层的底面在相同水平的部分地被蚀刻的管芯连接焊盘的无引脚IC封装。
图3A和图3B示出了管芯连接焊盘被从其上完全除去并且被以黑色物体示出的保护层和/或绝缘层所覆盖的无引脚IC封装。
图4A和图4B示出了管芯连接焊盘被从其上完全如图3中除去并且在管芯连接焊盘的覆盖位置形成凹陷的无引脚IC封装。
图5A和图5B示出了管芯连接焊盘的外周部分被从其上蚀刻掉并且管芯连接焊盘的中央部分的底部与外部触点的底部在相同水平的无引脚IC封装。
图6A和图6B示出了管芯连接焊盘的外周部分被从其上蚀刻第一量并且管芯连接焊盘的中央部分被从其上蚀刻第二量的无引脚IC封装。
图7A到图9B示出了管芯连接焊盘已经图案化以形成多个不连续的凸起部的一种无引脚IC封装。
图10A到图10C示出了具有成形为各种备选形状和结构的管芯连接焊盘和电触点各种无引脚IC封装。
图11A到图14B示出了具有形成在相应的管芯连接焊盘和电触点的底部的焊接材料的无引脚IC封装。
图15A到图15E示出了制作根据本发明的实施例的无引脚IC封装的方法。
图16A到图16E示出了制作根据本发明的另一实施例的无引脚IC封装的方法。
具体实施方式
以下参考附图描述精选的实施例。这些实施例被提供作为教学例子并且不应该被认为是限制权力要求的范围。在附图中，相同的参考数字表示相同的特征。当相同的特征被包括在一个或多个示出的实施例中时，将仅对这些特征进行一次描述以免赘言。
大体上，实施例涉及具有设置为各种结构的支架触点和/或管芯连接焊盘的无引脚封装。这些不同的结构可以被用来实现任何各种不同的目的，诸如防止管芯连接焊盘与封装下方的PCB上的电路迹线之间的电气和/或物理干扰，改善管芯连接焊盘的热传递特性，使其更容易表面安装到PCB上，提供管芯连接焊盘和/或电触点内的特殊电连通以及解决基于空间的IC封装限制(诸如管脚数目)，在此仅列举部分。
在以下的描述中，以具体的结构表示出多个实施例，诸如多行四侧小中心距无引脚封装(QFN)结构，其中支架触点设置在IC芯片四周上的多重交错行中。但是，公开的结构仅为了举例说明而没有任何限制目的。例如，可以以并排结构将多个IC芯片安装到管芯连接焊盘上，这种结构公知为多芯片组件(MCM)。如果多个芯片不能共享相同的底板，管芯连接焊盘自身可以为一片或分段的。可选择地，IC芯片可以以堆叠的管芯结构堆叠在其他管芯的上方。此外，如果封装需要尽量的小，那么封装可以根本没有管芯连接焊盘。例如，可以使用电绝缘粘合剂将IC芯片直接的或部分地连接到电触点上方(公知为引脚上芯片)。也可以使用覆晶技术将IC芯片直接地连接到电触点上，其中安装焊盘具有可以回流到电触点的上表面的焊接凸块。
一些实施例也描述了具体的组件，诸如包括半导体处理器管芯的特定类型的IC芯片。但是，这些和其他的组件可以由其他部分组成、修改或用其他组件替换。例如，诸如芯片电阻或电容的被动组件可以与IC芯片一起被连接到电触点上(封装的系统)。此外，描述的实施例中的具体材料，诸如特定类型的材料，可以被类似材料替换。
为了解释的方便，说明书中包括多个特定方位词，诸如“上”、“下”、“上方”以及“之上”等等。这些词不应该被理解为限制所描述的物体的方位，而是仅为了表示其中各个组件或部分的相对位置。例如，“底面”可以被解释为与“顶面”相反的表面，而不考虑具有底面与顶面的物体的方位。
图1示出了根据一个实施例的无引脚IC封装100的例子。图1中示出的实施例用作解释以下多个实施例的参考。因此，图1中示出的参考数字也在其他几个附图一起使用。
参考图1，IC封装100包括IC芯片105、管芯连接焊盘110、电触点125、线接合130以及模塑层120。通过粘合剂层115将IC芯片105安装到管芯连接焊盘110上。粘合剂层115可以包括，例如，诸如环氧树脂、硅树脂、聚酰亚胺和热塑性材料的聚合物材料(糊状或薄膜状均可)或者诸如金-锡或各种锡和铅合金的组合的软焊材料。IC芯片105可以包括，例如，从半导体晶片上切割下来的处理器管芯或存储器芯片。
IC芯片105包括作为输入/输出(I/O)端子并通过线接合130连接到电触点125的焊焊盘140。管芯连接焊盘110和电触点125在其顶面都由镀的可焊金属层135所覆盖。可焊金属层135可以包括金属，诸如堆叠的镍(Ni)、钯(Pd)和金(Au)或者堆叠的镍(Ni)和金(Au)或银(Ag)。管芯连接焊盘110和电触点125的底面可以镀有与顶面相同的金属层，或者由其他的金属涂层覆盖，诸如银(Ag)、金(Au)、镍(Ni)和金(Au)、电镀或沉浸锡(Sn)、锡/铅(Sn/Pb)、锡合金或其他焊料涂层或者涂有有机保焊剂(OSP)的热浸镀铜或裸铜(Cu)。层135可以适合多种功能中的任何功能，包括例如增强顶层的焊线接合能力、保护涂层使其不受氧化、改善可焊性以及改善导电性。
模塑层120覆盖IC芯片105、线接合130、管芯连接焊盘110以及电触点125，仅留出管芯连接焊盘110和电触点125的部分暴露在IC封装100的底面上。管芯连接焊盘110和电触点125暴露的部分从模塑层120突出以分别形成“支架”管芯连接焊盘以及“支架”触点。换言之，术语“支架”表示电触点125和管芯连接焊盘110以可测量的距离突出或离开于模塑层120的底面，例如，0.0005到0.020英寸。
管芯连接焊盘110暴露的部分可以被用作将IC封装100焊接到PCB或其他衬底上的焊接表面。它也可以作为工作过程中用于从IC芯片105吸收热量的热扩散表面或散热片。在另一方面，电触点125暴露的部分可以建立IC芯片105与IC封装100之外的电组件之间的电连接。
管芯连接焊盘110和电触点125通常由单条的金属所形成，诸如铜。这一条带——表示引线框架带——可以被用作用于连续制作多个IC封装的平台。例如，通过以下步骤可以连续地制作多个IC封装：在一个引线框架带上蚀刻多个管芯连接焊盘以及相应的电触点的图案，将IC芯片放置在管芯连接焊盘上，将芯片引线连接到电触点，使用模塑层覆盖整个结构，之后将得到的结构通过例如切割或冲模分为独立的IC封装。因为管芯连接焊盘110和电触点125通常由相同的引线框架带形成，它们也通常(但是不一定)具有相同的初始厚度。
当IC封装100被安装到PCB或其他衬底上时，可以位于非常靠近其它电组件的位置。例如，其可以直接被放置在诸如布线的组件上，以最大化的利用PCB上的空间。如果IC封装100距离其它组件足够近的话，管芯连接焊盘110和电触点125暴露的部分可能产生与其它组件的电气和/或物理干涉。作为例子，由于其位置和/或外形，管芯连接焊盘110暴露的部分可能在布线过程中产生电器短路或电容干涉。因此，下述各个实施例包括可以减少这种干涉的发生几率的特征。此外，也可以方便地使管芯连接焊盘110图案化以在IC封装之下的PCB上实现改善的电路布线能力。此外，管芯连接焊盘110的图案可以提供通道，热处理过程中来自焊膏的气体可以在IC封装被安装到PCB或其他衬底时通过这个通道排出。已经公知当这些气体被阻拦住时可能产生大的空隙和/或抬升IC封装，引起不期望的焊接附着物。所描述的许多实施例都包括可以向这些改善的能力做出贡献的特征。
图2A示出了根据另一个实施例的无引脚IC封装200。如通过公用的参考数字表示的一样，IC封装200与IC封装100之间具有许多相似点。只是在IC封装200中，已经通过使用化学蚀刻或者机械研磨将管芯连接焊盘110的突出部分移除，以产生相对薄的基本与模塑层220的底面齐平的管芯连接焊盘21。此外，管芯连接焊盘210的顶部镀有金属层135以形成用于管芯连接焊盘210上的接地连接应用的接地环245。
通过将一个或更多电触点125焊接到相应的PCB连接焊盘上，可以将IC封装200连接到PCB或者其他衬底上。可选择地，管芯连接焊盘210可以保持分离于(没有焊接到)PCB或衬底的状态。因为管芯连接焊盘210比电触点125更薄，所以它可以与IC封装200下方的PCB或衬底上的电组件或电路迹线之间保持一定的距离，以避免产生电或物理的干涉。
当以四侧都具有电触点125的交错的多行QFN结构形成IC封装200时，图2B示出了其底部。如图2B所示，管芯连接焊盘210覆盖相对大的IC封装200的底面表面面积，允许电路PCB上由IC芯片105所限定的面积之下可以存在与暴露的管芯连接焊盘210没有电或物理的干涉的迹线或者其他组件。触点125形成为两行交错围绕管芯连接焊盘210的形式，在根据这个交错的结构允许将电触点125与IC芯片105相连接的线接合130充分地相互远离的同时，可以产生高的热传导率。
图3A示出了根据另一个实施例的无引脚IC封装300。IC封装300同样类似于IC封装100，并具有以下区别。
在IC封装300中，IC芯片105被直接安装到诸如铜的金属带上由金属触点125所限制的带的中央部分。在形成模塑层120之前，通过使用黑色环氧树脂或其他聚合物材料的粘合剂层将IC芯片105连接，其中其他聚合物材料诸如硅树脂、聚酰亚胺或热塑性塑料(糊状或薄膜状)。在IC芯片105被安装到由金属触点125所限制的铜带的中央部分之前，铜带的顶部被预蚀刻，因此IC芯片105可以被安装到位于电触点125的上表面以下的平面中。之后在IC芯片105上形成模塑层120、线接合130以及电触点125。在模塑层120形成之后，通过化学蚀刻或者机械研磨将管芯连接焊盘的剩余部分全部除去。其后，IC芯片105下方的表面由环氧树脂层310所覆盖。在本例子中，环氧树脂层310与模塑层120具有相同的颜色(例如黑色)，因此如图3B的中间由大的空白区域所示出的，不能从IC封装300的底部看到IC芯片105。
图4A示出了无引脚封装400，其为IC封装300的变体。在IC封装400中，IC芯片105和环氧树脂层310从模塑层120的底面凹进模塑厚度的5％到30％——例如，1到3密耳(28到76微米)。通过例如改变管芯连接焊盘的预蚀刻量，可以控制凹陷的深度。较少的预蚀刻可以导致更深的凹陷而更多的预蚀刻可以导致更浅的凹陷。
通过使用化学蚀刻或机械研磨将剩余管芯连接焊盘除去以产生凹陷。在管芯连接焊盘被完全除去之后，IC芯片105的底面由环氧树脂层310所覆盖，其可以与模塑层120具有相同的颜色。如图4B所示，得到的结构在其底面上具有区域410。
图5A示出了根据另一个实施例的无引脚IC封装500。IC封装500类似于IC封装100，只是在IC封装500中，通过化学蚀刻或者机械研磨使得暴露的管芯连接焊盘110的外周部分510变薄。因此，管芯连接焊盘110的外部边缘基本上与模塑层120的底面齐平。图5B示出了包括已经变薄的管芯连接焊盘110上的外周部分510的IC封装500的底面。注意到这个变薄的部分510增加了触点125与暴露的管芯连接焊盘110之间的物理间隔，并允许PCB上的电路迹线或路径直接位于IC封装500的该区域的下方，以及减少在将IC封装焊接到PCB或衬底上时，管芯安装区域与电触点的第一行之间发生短路的几率。
图6A示出了根据另一个实施例的无引脚IC封装600。IC封装600类似于IC封装100，只是通过化学蚀刻或者机械研磨使得管芯连接焊盘的外周部分610和中央部分615都变薄了，从而使得管芯连接焊盘110的外周部分610与模塑层120的底面齐平并且中央部分615仍然比外周部分610稍厚。换言之，中央部分615已经被蚀刻或研磨到第一深度而外周部分610被蚀刻或研磨到大于第一深度的第二深度。图6B示出了包括已经在管芯连接焊盘110上变薄的部分610和615的IC封装600的底面。
图7A和7B示出了根据另一个实施例的IC封装700。IC封装700类似于IC封装100，只是管芯连接焊盘110在特定区域已经被蚀刻以形成图7A和图7B中示出的图案。管芯连接焊盘110的图案在IC封装700的底部以规律的间隔形成了不连续凸出部715。虽然它们不一定被用作电触点，但是凸出部715可以被认为是管芯连接焊盘电触点部分(DAP ECM)。但是，这些DAP ECM 715与触点125具有相同的暴露的底部尺寸，这允许分配相同量的焊膏，由此方便到PCB上的表面安装。这些不连续的突出部的另一个好处是他们提供了在表面安装操作中助熔剂的排气可以通过其离开的通道。
图8A和8B示出了类似于无引脚IC封装700的无引脚IC封装800。但是，IC封装800包括相对于IC封装700中的突出部715更窄并且更短的突出部815。因此，突出部815的底面所在的平面相对于电触点125的底面更靠近于模塑层120。
图9A和9B示出了类似于无引脚IC封装700的无引脚IC封装900。但是，IC封装900在管芯连接焊盘110中包括相对于IC封装700中的突出部715更宽并且更短的突出部915。作为更宽并且更短的突出部915的替换，IC封装也可以被改变为包括更长并且更窄、更长并且更短或者更宽并且更长的突出部分。换言之，虽然突出部通常不会延伸的比电触点125更长，但是基于电路需要，不连续的突出部分915可以具有许多尺寸和形状变化。图9B示出了包括更宽并且更短的突出部915的IC封装900的底面。
图10A、10B和10C示出了电触点125和DAP ECM的各种备选结构1000。可以通过例如当电触点125最初被限定时修改框架带的蚀刻图案以实现电触点125的备选结构。另一方面，可以在形成模塑层120之前或者之后通过使管芯连接焊盘110图案化以实现DAP ECM的备选结构。
图10A示出了管芯连接焊盘110的结构1005，其具有不一致成形的凸出部，其中当从底面观察时凸出部形成为具有不同尺寸的矩形或者方形。图10A同样示出了电触点125的结构1010，其中当从底面观察时某些触点形成为具有不同尺寸的矩形或者方形。
图10B示出了电触点125的结构1020，其中当从底面观察时每个触点都具有圆的轮廓。在图10B的例子中，管芯连接焊盘110并没有被图案化。
图10C示出了管芯连接焊盘110的结构1025，其具有不一致成形的凸出部，其中当从底面观察时凸出部形成为圆形和卵形或者椭圆形。图10C同样示出了电触点125的结构1030，其中当从底面观察时某些触点形成为卵形或者圆形。
除了图10A到图10C中所示出的之外，可以使管芯连接焊盘110和电触点125形成许多备选形状和图案。例如，它们可以被形成为圆形和直线的形状、更大和更小的形状，等等。此外，根据具体IC封装的电触点和/或连接规格的需要，它们可以被形成为定制的形状和图案。
图11A和图11B示出了类似于无引脚封装100的无引脚封装1100。只是在IC封装100中，已经有焊接材料1105附着在电触点125和管芯连接焊盘110各自的接触表面上。图11B中的阴影部分表示附着到管芯连接焊盘110以及每个电触点125上的焊接材料。在已经组装的PCB的返工过程中，焊接材料的增加方便了坏的IC封装的替换。返工PCB可能涉及有缺陷的IC封装的移除、有缺陷的IC封装从其上移除的PCB区域的焊座(site)整修或清洁、为焊座上助焊剂、放置替换的IC封装1100以及回流焊。因为选择性的丝网印刷由于此PCB上其他组件的存在而变得不再可能了，所以如果没有焊接材料1105，使用者将必须使用手动模板手动地将焊接材料分配到替换的IC封装上。
在一些实施例中，焊接材料1105包括锡和铅的焊接合金。在另一些实施例中，焊接材料包括无铅焊接合金，诸如锡-银、锡-银-铜、锡-银-铜-镍以及其他本领域技术人员所公知的高熔点焊接剂。
图12A和图12B示出了类似于无引脚IC封装1100的无引脚IC封装1200，只是在附着焊接材料1105之前，通过蚀刻或研磨将IC封装1200中电触点125和管芯连接焊盘110的尺寸减小了。这个实施例结合了关于IC封装500和1100所讨论的优点。
图13A和图13B示出了类似于无引脚IC封装1200的无引脚IC封装1300。但是，在IC封装1300中，在附着焊接材料1105之前，已经通过蚀刻或研磨将电触点125和管芯连接焊盘110除去直到它们与模塑材料120的底面齐平。
图14A和图14B示出了类似于无引脚IC封装700的无引脚IC封装1400，只是在IC封装1400中，在施加焊接材料1405之前，管芯连接焊盘110和电触点125不被底部金属镀层135所覆盖，其中焊接材料1405可以以糊状施加并回流以在管芯连接焊盘110和电触点125的不连续凸起部上形成多个焊接凸块。焊接材料1405的连接可以使用多个公知应用技术中的任意技术制成，诸如丝网印刷技术或写图案针管注射技术(pattern-writeneedle dispensing)。
作为附着糊状焊接材料1405的另一选择，焊接材料1405可以以预成型的焊料球的形式附着到电触点125和管芯连接焊盘110的凸出部。可以使用焊膏或助焊剂材料以及回流处理附着焊料球。助焊剂或焊膏材料确保在回流处理的过程中管芯连接焊盘110和电触点125合适的焊料润湿。
图11-图14中示出的实施例中的任意一个都可以被修改为使得焊剂只被施加到电触点125和管芯连接焊盘110的底部接触表面的子集中。例如，在多个实施例中，管芯连接焊盘110可以根本不被焊接。相似地，在一些实施例中，不是所有的电触点125都会被焊接。
图15A-图15E示出了一种制作诸如图2中示出的IC封装200的无引脚IC封装的方法。此方法可以被用来以一个引线框架带连续地制作多个无引脚IC封装。但是，为了简便，只示出和描述一个IC封装。在以下的描述中，示例方法步骤将会以圆括号(XXXX)表示以将它们与示例IC封装组件区别开来。
参考图15A，此方法以铜或其他导电材料制成的导线框架带开始，其中所述导电材料诸如各种金属或者金属合金之一(1501)。将带部分地蚀刻以形成限定管芯连接焊盘110和电触点125的凹陷或图案(1502)。可以使用诸如各种形式的化学或机械蚀刻的多种传统的蚀刻技术之一以图案化。尽管未示出，可以首先通过在引线框架带上形成蚀刻掩模并且基于此蚀刻掩模执行蚀刻而首先限定出此图案。当管芯连接焊盘110和电触点125的区域形成时，使用双侧选择性镀层处理将这些区域的顶面和/或底面镀上镀层135(1503)。镀层135也可以形成管芯连接焊盘上的接地环245以形成IC芯片105的接地。镀层135和245可以包括诸如堆叠的镍(Ni)、钯(Pd)和金(Au)，堆叠的镍(Ni)和金(Au)或银(Ag)。底面上的镀层135可以镀有与顶面相同的金属层或者镀有诸如银(Ag)、金(Au)、镍(Ni)和金(Au)或锡/铅(Sn/Pb)焊接镀层的其他的金属涂层。
参考图15B，之后使用粘合剂层115将IC芯片105附着到限定管芯连接焊盘110的区域上(1504)。粘合剂层115可以包括诸如环氧树脂、硅树脂、聚酰亚胺或热塑性材料的聚合物材料的聚合物材料(糊状或薄膜状)，或者诸如金-锡或各种锡和铅合金的组合的软焊接材料。其后，形成线接合130以将IC芯片105与电触点125和接地环245相连接(1505)。可以使用传统的引线接合工艺制成线接合130，诸如例如金、铜或铝引线接合。
参考图15C，之后在线接合130、IC芯片105和限定管芯连接焊盘110和电触点125的区域上形成模塑层120(1506)。其后，在限定电触点125的区域上方的引线框架带的底面上可选择地形成抗蚀刻层(1507)。之后背向蚀刻引线框架带的底面以除去限定相邻金属触点125的区域之间、管芯连接焊盘110与电触点125之间的金属部分以及部分地除去管芯连接焊盘110的底金属部分(1508)。在得到的结构中，通过电触点125与管芯连接焊盘110之间以及相邻电触点125之间除去的部分使得模塑层120的底面暴露。由于背向蚀刻，管芯连接焊盘110的底面基本上与模塑层120的底面齐平。
参考图15D，将抗蚀刻层从电触点125上剥离以使得镀层135在其底面上重新暴露出来(1509)。当蚀刻层被剥离之后，通过诸如切割或机械冲模的切割处理将得到的封装从其余的引线框架带上分离(1510)。分离的点在图15D中由一对垂直条示出。分离产生分割的IC封装200(1511)。分割的单元的放大的版本在图15E中以与图2相同的标注示出。
图16A-图16E示出了制作诸如图5中示出的IC封装500的无引脚IC封装的另一种方法。此方法可以被用来以一个引线框架带连续地制作多个无引脚IC封装。
参考图16A，此方法以铜或其他导电材料制成的导线框架带开始，其中所述导电材料诸如各种金属或者金属合金之一(1601)。将带部分地蚀刻以形成限定管芯连接焊盘110和电触点125的凹陷或图案(1602)。之后使用双侧选择性镀层处理将限定管芯连接焊盘110和电触点125的区域的顶面和/或底面镀上镀层135(1603)。在图16A的例子中，镀上与图15A的靠近参考数字1503的例子相同的表面，只是在图16A中，额外的部分被镀在限定管芯连接焊盘110的底面上。镀层135和245可以包括诸如堆叠的镍(Ni)、钯(Pd)和金(Au)，堆叠的镍(Ni)和金(Au)或银(Ag)。底面上的镀层135可以镀有与顶面相同的金属层或者以诸如银(Ag)、金(Au)、镍(Ni)和金(Au)或锡/铅(Sn/Pb)焊接镀层的其他的金属涂层。
接下来，在图16B中，使用粘合剂层115将IC芯片105附着到限定管芯连接焊盘110的区域上(1604)。粘合剂层115可以包括诸如环氧树脂、硅树脂、聚酰亚胺或热塑性材料的聚合物材料的聚合物材料(糊状或薄膜状)，或者诸如金-锡或各种锡和铅合金的组合的软焊接材料。其后，形成线接合130以将IC芯片105与电触点125和接地环245相连接(1605)。
随后，在图16C中，在线接合130、IC芯片105和限定管芯连接焊盘110和电触点125的区域上形成模塑层120(1606)。之后，在限定电触点125的区域上方的引线框架带的底面上可选择地形成抗蚀刻层(1607)。之后背向蚀刻引线框架带的底面以除去限定相邻金属触点125的区域之间、管芯连接焊盘110与电触点125之间的金属部分以及部分地除去管芯连接焊盘110的外周部分(1608)。在得到的结构中，通过电触点125与管芯连接焊盘110之间以及相邻电触点125之间所除去的部分使得模塑层120的底面暴露。此外，管芯连接焊盘110的外周部分510基本上与模塑层120的底面齐平。
参考图16D，将抗蚀刻层从电触点125上剥离以使得镀层135在其底面上重新暴露出来(1609)。当蚀刻层被剥离之后，通过诸如切割或机械冲模的切割处理将得到的封装从其余的引线框架带上分离(1610)。分离的点在图16D中由一对垂直条示出。分离产生分割的IC封装500(1611)。分割的IC封装500的放大的版本在图16E中以与图5相同的标注示出。
鉴于上述原因，应该理解无引脚IC封装可以形成有具有多个不同结构中的任意结构的电触点和管芯连接焊盘以实现各种不同结果。可以通过使用诸如上面讨论的技术或者本领域技术人员可以得到的各种变化和/或替代技术以实现不同的结构。

Claims (29)

1.一种制作无引脚集成电路(IC)封装的方法，包括：
除去引线框架带的一部分以形成限定用于管芯连接焊盘区域和多个电触点区域的凹陷；
将所述IC芯片安装到所述管芯连接焊盘区域中；
形成所述电触点区域与所述IC芯片之间的电连接；
使用模塑层覆盖所述IC芯片、所述管芯连接焊盘区域和所述电触点区域以及所述电连接，所述模塑层填充所述凹陷；
在所述引线框架带的底面上的所述电触点区域形成抗蚀刻层；
使用所述抗蚀刻层作为蚀刻掩模，选择性地蚀刻所述引线框架带的底面，由此使所述电触点和所述管芯连接焊盘形成为分离的组件；
其中，所述引线框架带的底面的选择性蚀刻除去了所述管芯连接焊盘的至少一部分，使得与一个或多个所述电触点的底部分相比，所述管芯连接焊盘的底部分从所述模塑层的底面延伸出更小的距离。
2.根据权利要求1所述的方法，还包括，通过在所述管芯连接焊盘的底部分执行化学蚀刻或者机械研磨以完全地除去所述管芯连接焊盘。
3.根据权利要求1所述的方法，还包括：
蚀刻所述管芯连接焊盘以在所述管芯连接焊盘的底面上形成多个不连续的凸起部。
4.根据权利要求1所述的方法，还包括：
在所述管芯连接焊盘区域的底面的至少一部分上形成所述抗蚀刻层；
使用所述抗蚀刻层作为蚀刻掩模在所述管芯连接焊盘中形成凹陷。
5.根据权利要求1所述的方法，还包括：
将焊膏施加到所述管芯连接焊盘和所述电触点上；以及
对所述焊膏执行回流处理以形成多个焊接凸块。
6.根据权利要求1所述的方法，还包括：
将多个预成型的焊料球附加到所述电触点和所述管芯连接焊盘上。
7.根据权利要求6所述的方法，还包括：
将焊膏或助焊剂材料附着到所述管芯连接焊盘和所述电触点上以帮助所述焊料球的连接。
8.根据权利要求6所述的方法，其中所述引线框架带的底面的选择性蚀刻使得所述管芯连接焊盘的外周部分比所述管芯连接焊盘的中央部分变薄了更大的量。
9.根据权利要求1所述的方法，其中形成所述电触点区域和所述IC芯片之间的电连接包括形成所述IC芯片与所述电触点区域之间的引线接合。
10.一种根据权利要求1所述的方法制造的无引脚集成电路(IC)封装，包括：
管芯连接焊盘；
IC芯片，其安装到所述管芯连接焊盘上；
多个电触点，其电气地连接到所述IC芯片；
模塑层，其形成在所述IC芯片、所述管芯连接焊盘和所述电触点上，所述模塑层有顶部分和底部分，所述顶部分覆盖所述管芯连接焊盘和所述电触点的顶部，并且所述管芯连接焊盘和所述电触点的底部通过所述底部分暴露，所述底部分具有设置在所述管芯连接焊盘和所述电触点之间的暴露表面；
其中，所述管芯连接焊盘的所述底部的至少一部分从所述模塑层的所述底部分的所述暴露表面延伸出来；并且
其中，所述管芯连接焊盘从所述模塑层延伸出来的部分延伸出的距离小于所述电触点中的一个或者多个的所述底部从所述模塑层的所述底部分的所述暴露表面延伸出来的距离。
11.根据权利要求10所述的IC封装，还包括：金属镀层，其覆盖所述管芯连接焊盘的底面和所述电触点的顶面和底面。
12.根据权利要求11所述的IC封装，其中，所述金属镀层包括堆叠的镍(Ni)、钯(Pd)和金(Au)，堆叠的镍(Ni)和金(Au)或银(Ag)，银(Ag)，金(Au)，镍(Ni)和金(Au)，电镀或沉浸锡(Sn)，锡/铅(Sn/Pb)，锡合金焊料以及涂有有机保焊剂(OSP)的热浸镀铜或裸铜(Cu)。
13.根据权利要求10所述的IC封装，其中所述管芯连接焊盘包括：
外周部分，其相对于中央部分变薄。
14.根据权利要求13所述的IC封装，其中，所述外周部分的底面与所述模塑层的所述底部分的所述暴露表面基本齐平。
15.根据权利要求10所述的IC封装，其中，所述管芯连接焊盘包括多个不连续的凸起部。
16.根据权利要求15所述的IC封装，其中，当从所述管芯连接焊盘的底面下方观察时，所述不连续的凸起部的一个或多个具有方形或者圆形的轮廓。
17.根据权利要求15所述的IC封装，其中，所述不连续的凸起部比所述电触点更窄或更宽并且可以以任何尺寸的组合出现。
18.根据权利要求15所述的IC封装，其中，当从所述管芯连接焊盘的底面下方观察时，所述不连续的凸起部中的一部分具有方形或矩形轮廓，并且当从所述管芯连接焊盘的底面下方观察时，所述不连续的凸起部中的一部分具有圆形或椭圆形轮廓。
19.根据权利要求10所述的IC封装，其中，当从所述模塑层的底部分下方观察时，所述电触点具有圆形轮廓。
20.根据权利要求10所述的IC封装，还包括形成在所述电触点和所述管芯连接焊盘中至少一个上的焊接材料。
21.根据权利要求20所述的IC封装，其中，所述焊接材料包括锡和铅焊接合金。
22.根据权利要求20所述的IC封装，其中，所述焊接材料包括无铅焊接合金，诸如，锡-银、锡-银-铜、锡-银-铜-镍或其他高熔点焊接合金的组合。
23.根据权利要求10所述的IC封装，其中，使用接合线将所述IC芯片接合到所述电触点上。
24.根据权利要求10所述的IC封装，其中，多个所述电触点沿所述IC封装的四侧的至少一个上以交错结构布置成多行。
25.一种根据权利要求1所述的方法制造的无引脚集成电路(IC)封装，包括：
管芯连接焊盘；
IC芯片，其安装到所述管芯连接焊盘上；
多个电触点，其电连接到所述IC芯片；
模塑层，其形成在所述IC芯片、所述管芯连接焊盘以及所述电触点上，所述模塑层有顶部分和底部分，所述顶部分覆盖所述电触点的顶部，并且所述管芯连接焊盘的底面和所述电触点的底部通过所述底部分暴露；
图案，其选择性地蚀刻到所述管芯连接盘的所述底面以在所述底面上形成多个突出部；以及
其中，所述突出部的底面所在的平面相对于所述电触点的底面更靠近所述模塑层。
26.根据权利要求25所述的IC封装，其中，所述管芯连接焊盘的所述底面的一部分与所述模塑层的底面齐平。
27.根据权利要求25所述的IC封装，其中，使用接合线将所述IC芯片接合到所述电触点。
28.根据权利要求25所述的IC封装，其中，所述多个电触点沿所述IC封装的四侧的至少一个上以交错结构布置成多行。
29.根据权利要求25所述的IC封装，还包括覆盖所述管芯连接焊盘的底面和所述电触点的顶面和底面的金属镀层，其中，所述金属镀层包括堆叠的镍(Ni)、钯(Pd)和金(Au)，堆叠的镍(Ni)和金(Au)或银(Ag)，银(Ag)，金(Au)，镍(Ni)和金(Au)，电镀或沉浸锡(Sn)，锡/铅(Sn/Pb)，锡合金焊料以及涂有有机保焊剂(OSP)的热浸镀铜或裸铜(Cu)。
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US7858443B2 (en) 2010-12-28
US20100224972A1 (en) 2010-09-09
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