CN204991696U - 传感芯片封装组件和具有该传感芯片封装组件的电子设备 - Google Patents

传感芯片封装组件和具有该传感芯片封装组件的电子设备 Download PDF

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Publication number
CN204991696U
CN204991696U CN201520701432.5U CN201520701432U CN204991696U CN 204991696 U CN204991696 U CN 204991696U CN 201520701432 U CN201520701432 U CN 201520701432U CN 204991696 U CN204991696 U CN 204991696U
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China
Prior art keywords
sensing chip
chip package
metal substrate
package assembling
pad
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CN201520701432.5U
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Inventor
柳玉平
龙卫
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Shenzhen Goodix Technology Co Ltd
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Shenzhen Huiding Technology Co Ltd
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Priority to CN201520701432.5U priority Critical patent/CN204991696U/zh
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Publication of CN204991696U publication Critical patent/CN204991696U/zh
Priority to PCT/CN2016/098161 priority patent/WO2017041689A1/zh
Priority to EP16843627.7A priority patent/EP3214648A4/en
Priority to KR1020177015547A priority patent/KR101964763B1/ko
Priority to US15/611,766 priority patent/US10121750B2/en
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Abstract

本实用新型公开了传感芯片封装组件和具有该传感芯片封装组件的电子设备，传感芯片封装组件包括：金属基板，其具有焊盘区和放置区，焊盘区具有多个金属焊盘；传感芯片，其位于金属基板的上表面，传感芯片具有多个传感芯片焊盘；电连接组件，其电连接金属焊盘和传感芯片焊盘；封装材料覆盖件，其覆盖金属基板、传感芯片以及电连接组件，其中任意相邻两个金属焊盘之间通过封装材料覆盖件绝缘间隔。该传感芯片封装组件具有开发周期短和翘曲小的优点，从而在节省成本的同时提高后续组装效率，并且由于金属基板上多个金属焊盘彼此独立，可以实现传感芯片与金属基板间多个信号的独立传递，从而明显降低多个信号间的干扰风险。

Description

传感芯片封装组件和具有该传感芯片封装组件的电子设备
技术领域
本实用新型属于电子领域，具体而言，本实用新型涉及一种传感芯片封装组件和具有该传感芯片封装组件的电子设备。
背景技术
当前生物识别的主流封装主要采用PCB基板类封装，然而由于PCB基板类封装每次开发都需要经过单独设计，并且PCB基板开模才能做下去，导致整个开发周期会比较长，成本高，同时该PCB基板存在翘曲大的隐患，从而严重影响后续组装工艺作业，同时由于PCB基板上焊盘间互联，使得传感芯片与PCB基板之间的电信号传递彼此受到干扰，从而影响信号的准确性。
因此，现有的传感芯片封装组件有待进一步改善。
实用新型内容
本实用新型旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本实用新型的一个目的在于提出一种传感芯片封装组件和具有该传感芯片封装组件的电子设备，该传感芯片封装组件具有开发周期较短和翘曲较小的优点，从而在节省成本的同时提高后续组装效率，并且由于金属基板上多个金属焊盘彼此独立，可以实现传感芯片与金属基板间多个信号的独立传递，从而明显降低多个信号间的干扰风险。
在本实用新型的一个方面，本实用新型提出了一种传感芯片封装组件。根据本实用新型的实施例，该传感芯片封装组件包括：金属基板，所述金属基板具有焊盘区和放置区，所述焊盘区具有多个金属焊盘；传感芯片，所述传感芯片位于所述金属基板的上表面，所述传感芯片具有多个传感芯片焊盘；电连接组件，所述电连接组件电连接所述金属焊盘和所述传感芯片焊盘；以及封装材料覆盖件，所述封装材料覆盖件覆盖所述金属基板、所述传感芯片以及所述电连接组件、并且所述金属基板下表面未被所述封装材料覆盖件覆盖，其中任意相邻两个所述金属焊盘之间通过所述封装材料覆盖件绝缘间隔。
根据本实用新型实施例的传感芯片封装组件具有开发周期较短和翘曲较小的优点，从而在节省成本的同时提高后续组装效率，并且由于金属基板上多个金属焊盘彼此独立，可以实现传感芯片与金属基板间多个信号的独立传递，从而明显降低多个信号间的干扰风险。
另外，根据本实用新型上述实施例的传感芯片封装组件还可以具有如下附加的技术特征：
任选地，所述电连接组件为焊线或金属凸块。由此，可以实现传感芯片和金属基板间信号的稳定传递。
任选地，所述焊线为金线、铜线、铝线或合金线。由此，可以进一步实现传感芯片和金属基板间信号的稳定传递。
任选地，所述焊线的线径不低于15微米。由此，可以进一步实现传感芯片和金属基板间信号的稳定传递。
任选地，所述金属凸块为金凸块、铜凸块或锡凸块。由此，可以进一步实现传感芯片和金属基板间信号的稳定传递。
任选地，多个所述金属焊盘的形状不同。由此，可以根据实际需要容纳更多的金属焊盘。
任选地，每个所述金属焊盘均形成为圆形或者多边形。由此，可以根据实际需要容纳更多的金属焊盘。
任选地，所述封装材料覆盖件的介电常数大于3。由此，可以使得所得传感芯片封装组件具有较高的稳定性。
任选地，所述传感芯片与所述金属焊盘之间的距离大于20微米。由此，可以进一步提高所得传感芯片封装组件的稳定性。
任选地，所述金属基板为铜质基板。由此，可以显著降低基板的翘曲程度，从而进一步提高所得传感芯片封装组件的稳定性。
在本实用新型的第二个方面，本实用新型提出了一种电子设备，根据本实用新型的实施例，该电子设备包括上述所述的传感芯片封装组件。由此，通过使用上述传感芯片封装组件，可以显著降低该电子设备的开发周期和原料成本，同时可以显著提高该电子设备内部信号传递稳定性。需要说明的是，前面针对传感芯片封装组件所描述的特征和优点同样适用于该电子设备，在此不再赘述。
本实用新型的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本实用新型的实践了解到。
附图说明
本实用新型的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是根据本实用新型一个实施例的传感芯片封装组件的纵切面示意图；
图2是根据本实用新型一个实施例的传感芯片封装组件的横切面示意图；
图3是根据本实用新型再一个实施例的传感芯片封装组件的横切面示意图；
图4是根据本实用新型又一个实施例的传感芯片封装组件的横切面示意图；
图5是根据本实用新型再一个实施例的传感芯片封装组件的纵切面示意图；
图6是根据本实用新型又一个实施例的传感芯片封装组件的纵切面示意图。
具体实施方式
下面详细描述本实用新型的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本实用新型，而不能理解为对本实用新型的限制。
在本实用新型的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本实用新型和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本实用新型的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本实用新型的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本实用新型中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本实用新型中的具体含义。
在本实用新型中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本实用新型的一个方面，本实用新型提出了一种传感芯片封装组件。根据本实用新型的实施例，参考图1，该传感芯片封装组件包括：金属基板100、传感芯片200、电连接组件300和封装材料覆盖件400，其中，金属基板100具有焊盘区11和放置区12，焊盘区11具有多个金属焊盘13，传感芯片200位于金属基板100的上表面，传感芯片200具有多个传感芯片焊盘21；电连接组件300电连接金属焊盘13和传感芯片焊盘21；封装材料覆盖件400覆盖金属基板100、传感芯片200以及电连接组件300、并且金属基板100下表面未被封装材料覆盖件400覆盖，其中任意相邻两个金属焊盘13之间通过封装材料覆盖件400绝缘间隔。发明人发现，传感芯片封装组件通过采用金属基板替代传统的PCB基板，由于金属基板开发周期短和成本较低的特点，使得可以显著节省该传感芯片封装组件的生产成本，同时由于金属基板热膨胀系数固定，从而可以有效缓解以往PCB基板翘曲大的难题，进而可以显著提高后续组装效率，并且使用金属基板使得选择封装材料的树脂方向更加明确，从而使得产品可以少走很多注塑重复验证的弯路，进而进一步降低该传感芯片封装组件的生产成本，另外通过采用本实用新型结构的金属基板，由于该金属基板上多个金属焊盘彼此独立，可以实现传感芯片与金属基板间多个信号的独立传递，从而明显降低多个信号间的干扰风险。
根据本实用新型的一个实施例，金属基板100上的焊盘区11和放置区12可以为金属基板上分别独立的两个区域，即二者彼此之间并不互联。
根据本实用新型的再一个实施例，金属基板可以为焊盘区和放置区预先彼此断开的金属基板，也可以为焊盘区和放置区预先互联的且后续通过刻蚀使得二者彼此分开的金属基板。具体的，无论是采用焊盘区和放置区预先彼此断开的金属基板还是采用焊盘区和放置区预先互联的且后续通过刻蚀使得二者彼此分开的金属基板，焊盘区的金属焊盘均会在封装材料覆盖件的作用下最终被固定，从而可以实现传感芯片与金属基板之间信号的直连，从而有效避免多个信号的互相干扰。
根据本实用新型的又一个实施例，金属基板100的具体类型并不受特别限制，根据本实用新型的具体实施例，金属基板100可以为铜质基板。由此，通过采用铜质基板，由于铜质基板较传统的PCB基板成分单一，使得其热膨胀系数较为固定，从而可以有效缓解以往PCB基板翘曲大的难题，进而可以显著提高后续组装效率，并且使用铜质基板使得选择封装材料的树脂方向较其他类型的金属基板更加明确，从而使得产品可以少走很多注塑重复验证的弯路，进而进一步降低该传感芯片封装组件的生产成本
根据本实用新型的又一个实施例，金属基板上多个金属焊盘的形状可以不同，本领域技术人员可以根据实际需要进行选择，根据本实用新型的具体实施例，多个金属焊盘可以为圆形或多边形，例如，如图2-4所示，多个金属焊盘可以为形状大小均一的条形金属焊盘，也可以为形状相同长度不同的条形金属焊盘，或者为大小相同的圆形的金属焊盘，具体的，本领域技术人员可以根据信号传递的实际需要进行选择。需要说明的是，本领域技术人员也可以根据实际需要将上述三种形状的金属焊盘进行组合。
根据本实用新型的又一个实施例，传感芯片200的具体类型并不受特别限制，本领域技术人员可以根据实际需要进行选择，根据本实用新型的具体实施例，传感芯片200可以为电容型传感芯片。具体的，该传感芯片中具有集成电路，并且该集成电路可以在通电情况下产生信号，且实现一定目的的功能。
根据本实用新型的又一个实施例，传感芯片200上的传感芯片焊盘21与金属焊盘13一一对应，从而可以实现传感芯片与金属基板之间多个信号的独立传递，进而降低多个信号之间的相互干扰。
根据本实用新型的又一个实施例，电连接组件300的具体类型并不受特别限制，本领域技术人员可以根据实际需要进行选择，根据本实用新型的具体实施例，电连接组件300可以为焊线或金属凸块。根据本实用新型的一个具体示例，如图5所示，电连接组件300为焊线，传感芯片200位于金属基板100的放置区12的上表面上，焊线电连接传感芯片焊盘和金属焊盘，从而可以实现传感芯片与金属基板之间信号的传递。根据本实用新型再一个具体示例，如图6所示，电连接组件300为金属凸块，传感芯片200位于金属基板100之上，并且传感芯片200由金属凸块固定在金属基板100之上且金属凸块电连接传感芯片焊盘和金属焊盘，从而可以实现传感芯片与金属基板之间信号的传递。
根据本实用新型的又一个实施例，焊线的具体类型并不受特别限制，本领域技术人员可以根据实际需要进行选择，根据本实用新型的具体实施例，焊线可以为金线、铜线、铝线或合金线。由此，由于该类焊线具有较低的电阻，从而可以显著提高传感芯片与金属基板之间信号的稳定传递。
根据本实用新型的又一个实施例，焊线的线径并不受特别限制，本领域技术人员可以根据实际需要进行选择，根据本实用新型的具体实施例，焊线的粒径可以为不低于15微米。发明人发现，若焊线线径低于15微米，所得焊线容易因线张力较小而趴在芯片边缘，从而导致芯片短路。
根据本实用新型的又一个实施例，金属凸块的具体类型并不受特别限制，本领域技术人员可以根据实际需要进行选择，根据本实用新型的具体实施例，金属凸块可以为金凸块、铜凸块或锡凸块。由此，可以进一步提高传感芯片与金属基板之间信号传递的稳定性。
根据本实用新型的又一个实施例，封装材料覆盖件400的具体类型并不受特别限制，本领域技术人员可以根据实际需要进行选择，根据本实用新型的具体实施例，封装材料覆盖件可以为由介电常数大于3的材料构成的组件。根据本实用新型的具体示例，封装材料覆盖件可以由环氧树脂制成。发明人发现，该类型的封装材料具有良好的化学稳定性，并且导热性能好、热膨胀系数小，同时具有较好的机械强度，便于加工，另外价格低廉，便于自动化生产等，由此，选择该类型的封装材料可以进一步提高传感芯片封装组件的稳定性和可靠性。
根据本实用新型又一个实施例，传感芯片与金属焊盘之间的距离并不受特别限制，本领域技术人员可以根据实际需要进行选择，根据本实用新型的具体实施例，传感芯片与金属焊盘之间的距离可以大于20微米。发明人发现，工艺上，针对焊线方式，因为线径大于15微米，焊线需烧球，焊球本身存在厚度且芯片本身也有厚度，总厚度会大于20微米，若传感芯片与金属焊盘之间距低于20微米，会导致球颈部剩余连接距离不足；针对金属凸块方式，凸块本身高度通常大于20微米。综上，如传感芯片与金属焊盘之间距低于20微米，芯片与金属焊盘间的连接会存在困难。
根据本实用新型的又一个实施例，封装材料覆盖件可以完全覆盖传感芯片上表面，也可以只覆盖传感芯片四周而裸露传感芯片上表面，针对具体的结构，本领域技术人员可以根据实际需要进行选择。
为了方便理解，下面对制备本实用新型实施例的传感芯片封装组件的方法进行详细描述。下面以电连接组件为焊线，金属基板为完整基板为例。
首先，在金属基板的放置区涂覆粘合剂，以便在金属基板的放置区形成粘合层，本领域技术人员可以根据实际需要对采用的粘合剂类型和粘合层厚度进行选择，然后将传感芯片放置在粘合层上，以便使得传感芯片固定在金属基板放置区的上表面，并且将采用焊线将传感芯片焊盘与金属焊盘实现电连接，接着将所得组件放置在模具中，并且模具的上方可以高于传感芯片上表面，然后向模具中填充液态的封装材料，本领域技术人员可以根据实际需要对液态封装材料的填充量以及填充压力、温度等条件进行调整，接着将上述得到的填充有封装材料的芯片组件进行固化，本领域技术人员可以根据实际需要对固化时间、固化温度和固化压力等条件进行调整，最后沿着焊盘区的边缘对金属基板进行刻蚀，以便使得焊盘区与放置区相互断开，并且多个金属焊盘彼此间隔，同时由于多个金属焊盘之间具有封装材料覆盖件，从而可以获得上述的传感芯片封装组件，当焊盘区被切断开时，独立的金属焊盘可以被封装材料覆盖件完好的固定起来而不会脱落，从而可以保证封装使用安全。
在本实用新型的第二个方面，本实用新型提出了一种电子设备，根据本实用新型的实施例，该电子设备包括上述所述的传感芯片封装组件。由此，通过使用上述传感芯片封装组件，可以显著降低该电子设备的开发周期和原料成本，同时可以显著提高该电子设备内部信号传递稳定性。需要说明的是，前面针对传感芯片封装组件所描述的特征和优点同样适用于该电子设备，在此不再赘述。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本实用新型的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本实用新型的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本实用新型的限制，本领域的普通技术人员在本实用新型的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (11)

1.一种传感芯片封装组件，其特征在于，包括：
金属基板，所述金属基板具有焊盘区和放置区，所述焊盘区具有多个金属焊盘；
传感芯片，所述传感芯片位于所述金属基板的上表面，所述传感芯片具有多个传感芯片焊盘；
电连接组件，所述电连接组件电连接所述金属焊盘和所述传感芯片焊盘；以及
封装材料覆盖件，所述封装材料覆盖件覆盖所述金属基板、所述传感芯片以及所述电连接组件，并且所述金属基板下表面未被所述封装材料覆盖件覆盖，其中任意相邻两个所述金属焊盘之间通过所述封装材料覆盖件绝缘间隔。
2.根据权利要求1所述的传感芯片封装组件，其特征在于，所述电连接组件为焊线或金属凸块。
3.根据权利要求2所述的传感芯片封装组件，其特征在于，所述焊线为金线、铜线、铝线或合金线。
4.根据权利要求2所述的传感芯片封装组件，其特征在于，所述焊线的线径不低于15微米。
5.根据权利要求2所述的传感芯片封装组件，其特征在于，所述金属凸块为金凸块、铜凸块或锡凸块。
6.根据权利要求1所述的传感芯片封装组件，其特征在于，多个所述金属焊盘的形状不同。
7.根据权利要求6所述的传感芯片封装组件，其特征在于，每个所述金属焊盘均形成为圆形或者多边形。
8.根据权利要求1所述的传感芯片封装组件，其特征在于，所述封装材料覆盖件的介电常数大于3。
9.根据权利要求1所述的传感芯片封装组件，其特征在于，所述传感芯片与所述金属焊盘之间的距离大于20微米。
10.根据权利要求1所述的传感芯片封装组件，其特征在于，所述金属基板为铜质基板。
11.一种电子设备，其特征在于，包括权利要求1～10任一项所述的传感芯片封装组件。
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CN106463492A (zh) * 2016-09-06 2017-02-22 深圳市汇顶科技股份有限公司 传感芯片封装组件和具有该传感芯片封装组件的电子设备
WO2017041689A1 (zh) * 2015-09-11 2017-03-16 深圳市汇顶科技股份有限公司 传感芯片封装组件和具有该传感芯片封装组件的电子设备
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