TWI570857B - 封裝結構及其製法 - Google Patents

封裝結構及其製法 Download PDF

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Publication number
TWI570857B
TWI570857B TW103142973A TW103142973A TWI570857B TW I570857 B TWI570857 B TW I570857B TW 103142973 A TW103142973 A TW 103142973A TW 103142973 A TW103142973 A TW 103142973A TW I570857 B TWI570857 B TW I570857B
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package
package structure
substrate
electronic component
sensing
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TW103142973A
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TW201622075A (zh
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鄧汶瑜
洪良易
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矽品精密工業股份有限公司
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Priority to TW103142973A priority Critical patent/TWI570857B/zh
Priority to CN201410800563.9A priority patent/CN105789144A/zh
Priority to US14/631,892 priority patent/US9542598B2/en
Publication of TW201622075A publication Critical patent/TW201622075A/zh
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Publication of TWI570857B publication Critical patent/TWI570857B/zh

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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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Description

封裝結構及其製法
本發明係有關一種封裝結構，尤指一種指紋感測器之封裝結構。
隨著生活水平的提升，消費者對於隱私的注重程度也與日俱增，許多高階電子產品皆會裝載辨識系統，以增加電子產品中資料的安全性，因此辨識系統的研發與設計亦隨著消費者需求成為電子產業開發的方向。
此外，由於高階電子產品皆朝往輕、薄、短、小等高集積度方向發展，因此所裝載的生物辨識裝置多為指紋辨識裝置或人臉辨識裝置，其中又以指紋辨識裝置最廣泛被使用，藉以達到使該電子產品達到輕薄短小之目的。現有指紋辨識裝置中，依據指紋的掃描方式分為掃描指紋圖案的光學指紋辨識裝置以及偵測指紋紋路中的微量電荷的矽晶指紋辨識裝置。
如第1圖所示，習知指紋感測器(fingerprint sensor)之封裝結構1包括具有第一電性連接墊101之基板10、具有感測區110與第二電性連接墊111之感測晶片11、以及包 覆該感測晶片11並外露出該感測區110之封裝膠體12，以供使用者觸滑(swipe)該感測區110而感測指紋。
具體地，該感測晶片11係設置於該基板10上，並以複數條銲線13電性連接該基板10之第一電性連接墊101與該感測晶片11之第二電性連接墊111，且該封裝膠體12係形成於該基板10上以密封該些銲線13。
然而，矽晶指紋影像感測器因手指需直接觸碰該感測晶片11的感測區110，使該感測區110表面易於損壞，遂縮短習知指紋影像感測器的使用壽命。
因此，如何克服上述習知技術的問題，實為業界迫切待開發之方向。
鑒於上述習知技術之缺失，本發明提供一種封裝結構之製法，係包括：於一基板上接置並電性連接複數電子元件；於該基板上形成包覆該電子元件之封裝體；以及於該封裝體上形成一亮光層。
該電子元件係為感測晶片，具有相對之感測面與非感測面，其中，該感測面具有感測區，且該電子元件係以該非感測面結合至該基板。
該接置有電子元件之基板係容置於一具有上模及下模之模具中進行模壓製程，以於該基板上形成封裝體，使該電子元件嵌埋於該封裝體中，且該封裝體完全覆蓋該感測區。該上模內側表面係設置有一離型膜，藉以降低該封裝體的表面粗糙度。
再者，形成該封裝體的材質係包括聚合物與添加物，該添加物係選自陶瓷填充料(Ceramic filler)，以提高封裝體的硬度，另外可藉由不同之添加物調配出不同的外觀顏色，使本發明封裝結構具有色彩多樣性之優點。
本發明復提供一種封裝結構，係包括：一基板；設於該基板上之電子元件，該電子元件係具有感測區；形成於該基板上之封裝體，且該第一封裝體係包覆該電子元件並覆蓋該感測區；以及形成於該封裝體上之亮光層。
綜上所述，本發明之封裝結構及其製法中，係將接置有感測晶片之基板置於內側設置有離型膜之模具中進行模壓作業，以形成一具有低表面粗糙度以包覆該感測晶片之封裝體，且該封裝體的材質係包括聚合物與添加物，該添加物係選自陶瓷填充料，以提高封裝體的摩氏硬度，避免手指直接碰觸感測區而能延長該封裝結構之壽命，同時可藉由不同之添加物調配出不同的外觀顏色，以賦予本發明之封裝結構多彩化的特性，再者，本發明復於該封裝體上形成一亮光層，藉以提高該封裝結構之光澤度，以構成一具高光澤、高硬度及色彩變化之感測器封裝結構。
1、2、3、4‧‧‧封裝結構
10、20、30、40‧‧‧基板
101、201‧‧‧第一電性連接墊
11‧‧‧感測晶片
110、210、410‧‧‧感測區
12‧‧‧封裝膠體
13‧‧‧銲線
111‧‧‧第二電性連接墊
21、31、41‧‧‧電子元件
21a、41a‧‧‧感測面
21b、41b‧‧‧非感測面
25‧‧‧黏著層
211、411‧‧‧電性連接接墊
200a‧‧‧上模
200b‧‧‧下模
200‧‧‧模具
22‧‧‧封裝體
201‧‧‧離型膜
23‧‧‧亮光層
34‧‧‧銲球
46‧‧‧導電凸塊
第1圖係為習知封裝結構之剖面示意圖；第2A至2D圖係為本發明之封裝結構之製法剖面示意圖；第3圖係為本發明之封裝結構第二實施例之剖面示意圖；以及 第4圖係為本發明之封裝結構第三實施例之剖面示意圖。
以下係藉由特定的具體實例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點與功效。本發明亦可藉由其他不同的具體實例加以施行或應用，本說明書中的各項細節亦可基於不同觀點與應用，在不悖離本發明之精神下進行各種修飾與變更。
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本創作可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本創作所能產生之功效及所能達成之目的下，均應仍落在本創作所揭示之技術內容得能涵蓋之範圍內。本文所使用之術語「感測面」係意指，但非限於，具有電子元件中具有感測區的表面，同理，不具有感測區之表面即為「非感測面」。同時，本說明書中所引用之如「上」、「第一」、「第二」、「第三」、「第四」等之用語，亦僅為便於敘述之明瞭，而非用以限定本創作可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本創作可實施之範疇。
請參閱第2A至2D圖係為本發明之封裝結構之製法剖面示意圖。
如第2A圖所示，於一基板20上接置並電性連接複數電子元件21，該電子元件21係具有相對之感測面21a與非感測面21b，其中，該感測面21a具有感測區210，且該電子元件21係以該非感測面21b結合至該基板20。
該基板20係例如為導線架或線路板等承載件。
再者，該電子元件21係為感測晶片，亦即，一種用以偵測生物體電荷變化、溫度差、壓力等的感測晶片，更佳為指紋辨識晶片，該指紋辨識晶片係為能藉由感測區所接收的電容差進行生物辨識。
該電子元件21係以其非感測面21b透過黏著層25固設於該基板20上，且該電子元件21之感測面21a具有電性連接接墊211，並以打線方式電性連接該電子元件之電性連接墊211與該基板20。
如第2B圖所示，將該接置有電子元件21之基板20容置於一具有上模200a及下模200b之模具200中進行模壓製程(molding process)，以於該基板20上形成封裝體22，使該電子元件21嵌埋於該封裝體22中，且該封裝體22完全覆蓋該感測區210。
該上模200a內側表面係設置有一離型膜201，藉以降低該封裝體22的表面粗糙度(Rougghness,Ra)，使該粗糙度Ra小於0.1μm。
再者，形成該封裝體22的材質係包括聚合物與添加物，該添加物係選自陶瓷填充料(Ceramic filler)，以提高封裝體的硬度，使該封裝體22的摩氏硬度大於6，達到鉛筆 的硬度。另外，該封裝體22可藉由不同之添加物而調配出不同的顏色，使本發明封裝結構具有色彩多樣性之優點。
如第2C圖所示，移除該模具200，並於該封裝體22上以噴塗(Speay)或旋轉塗佈(Spin coating)等方式形成一亮光層23，以提高光澤度(gloss unit,GU)至50~60GU。
如第2D圖所示，進行切單製程，以形成複數個封裝結構2。
本發明所揭示之封裝結構2，係包括一基板20；設於該基板20上之一電子元件21，該電子元件21係具有感測區210；以及形成於該基板20上之封裝體22，且該第一封裝體22係包覆該電子元件21並覆蓋該感測區210，其中該封裝體22包含有添加物，該添加物係選自陶瓷填充料(Ceramic filler)。另外於該封裝體22上係形成有一亮光層23。
該電子元件21為具有感測區210之感測晶片，該封裝體22的材質係包括聚合物與添加物，該添加物係選自陶瓷填充料，以提高封裝體的摩氏硬度大於6，且可藉由不同之添加物調配出不同的外觀顏色。於使用具有本發明封裝結構2之指紋感測器時，以手指的電荷變化、溫度差、壓力等方式碰觸該封裝體22表面，感測區210會掃描其所接收到電容差，以供該感測晶片作辨識。
請參閱第3圖，係為本發明之封裝結構第二實施例之剖面示意圖。本實施例之封裝結構3與前述實施例大致相同，主要差異在於本實施例之基板30係為線路板，且於該 基板30相對接置有電子元件31之另一表面植設有複數銲球34，以供該封裝結構3電性連接至外部裝置。
請參閱第4圖，係為本發明之封裝結構第二實施例之剖面示意圖。本實施例之封裝結構4與前述實施例大致相同，主要差異在於本實施例中，該電子元件41係以覆晶方式電性連接至該基板40。
該電子元件41係具有相對之感測面41a與非感測面41b，其中，該感測面41a具有感測區410，該非感測面41b具有複數電性連接墊411，以供該電子元件41以該非感測面41b之電性連接墊411透過導電凸塊46結合至該基板40。
綜上所述，本發明之封裝結構及其製法中，係將接置有感測晶片之基板置於內側設置有離型膜之模具中進行模壓作業，以形成一具有低表面粗糙度並包覆該感測晶片之封裝體，且該封裝體的材質係包括聚合物與添加物，該添加物係選自陶瓷填充料，以提高封裝體的摩氏硬度，避免手指直接碰觸感測區而能延長該封裝結構之壽命，同時可藉由不同之添加物調配出不同的外觀顏色，以賦予本發明之封裝結構多彩化的特性，再者，本發明復於該封裝體上形成一亮光層，藉以提高該封裝結構之光澤度，以構成一具高光澤、高硬度及色彩變化之感測器封裝結構。
上述實施例僅例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修飾與改 變。因此，本發明之權利保護範圍，應如後述之申請專利範圍所列。
2‧‧‧封裝結構
20‧‧‧基板
21‧‧‧電子元件
210‧‧‧感測區
22‧‧‧封裝體
23‧‧‧亮光層

Claims (21)

  1. 一種封裝結構之製法，係包括：於一基板上接置並電性連接至少一電子元件；於該基板上形成包覆該電子元件之封裝體，該封裝體的表面粗糙度小於0.1μm；以及於該封裝體上形成一亮光層。
  2. 如申請專利範圍第1項所述之封裝結構之製法，其中，該電子元件係為指紋感測晶片。
  3. 如申請專利範圍第1項所述之封裝結構之製法，其中，該電子元件具有相對之感測面與非感測面，該感測面具有感測區，使該封裝體完全覆蓋該感測區，且該電子元件係以該非感測面結合至該基板。
  4. 如申請專利範圍第1項所述之封裝結構之製法，其中，該基板為導線架或線路板。
  5. 如申請專利範圍第1項所述之封裝結構之製法，其中，該電子元件係以打線或覆晶方式電性連接至該基板。
  6. 如申請專利範圍第1項所述之封裝結構之製法，其中，該封裝體之形成方法係包括將該接置有電子元件之基板容置於一具有上模及下模之模具中進行模壓製程，該上模內側表面設置有一離型膜，以於該基板上形成包覆該電子元件之封裝體。
  7. 如申請專利範圍第1項所述之封裝結構之製法，其中，形成該封裝體的材質係包括聚合物與添加物，該添加物係選自陶瓷填充料(Ceramic filler)。
  8. 如申請專利範圍第7項所述之封裝結構之製法，其中，該封裝體係藉由不同之添加物而調配出不同的顏色。
  9. 如申請專利範圍第1項所述之封裝結構之製法，其中，該封裝體的摩氏硬度大於6。
  10. 如申請專利範圍第1項所述之封裝結構之製法，其中，該亮光層係以噴塗或旋轉塗佈方式形成於該封裝體上。
  11. 如申請專利範圍第1項所述之封裝結構之製法，其中，該亮光層之光澤度係為50~60GU。
  12. 如申請專利範圍第1項所述之封裝結構之製法，於該基板上接置有複數該電子元件時，復包括進行切單作業。
  13. 如申請專利範圍第1項所述之封裝結構之製法，復包括於該基板相對接置有電子元件之另一表面植設複數銲球。
  14. 一種封裝結構，係包括：一基板；至少一電子元件，係接置並電性連接於該基板上；一封裝體，係形成於該基板上且包覆該電子元件，該封裝體的表面粗糙度小於0.1μm；以及一亮光層，係形成於該封裝體上。
  15. 如申請專利範圍第14項所述之封裝結構，其中，該電子元件係為指紋感測晶片。
  16. 如申請專利範圍第14項所述之封裝結構，其中，該電 子元件具有相對之感測面與非感測面，該感測面具有感測區，使該封裝體完全覆蓋該感測區，且該電子元件係以該非感測面結合至該基板。
  17. 如申請專利範圍第14項所述之封裝結構，其中，該基板為導線架或線路板。
  18. 如申請專利範圍第14項所述之封裝結構，其中，該電子元件係以打線或覆晶方式電性連接至該基板。
  19. 如申請專利範圍第14項所述之封裝結構，其中，形成該封裝體的材質係包括聚合物與添加物。
  20. 如申請專利範圍第19項所述之封裝結構，其中，該添加物係選自陶瓷填充料，且該封裝體的摩氏硬度大於6。
  21. 如申請專利範圍第14項所述之封裝結構，其中，該亮光層之光澤度係為50~60GU。
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