FR2809228B1 - Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique - Google Patents
Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optiqueInfo
- Publication number
- FR2809228B1 FR2809228B1 FR0006513A FR0006513A FR2809228B1 FR 2809228 B1 FR2809228 B1 FR 2809228B1 FR 0006513 A FR0006513 A FR 0006513A FR 0006513 A FR0006513 A FR 0006513A FR 2809228 B1 FR2809228 B1 FR 2809228B1
- Authority
- FR
- France
- Prior art keywords
- semiconductor package
- optical semiconductor
- manufacture
- injection mold
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title 2
- 239000004065 semiconductor Substances 0.000 title 2
- 238000002347 injection Methods 0.000 title 1
- 239000007924 injection Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0006513A FR2809228B1 (fr) | 2000-05-22 | 2000-05-22 | Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique |
US09/862,984 US6858933B2 (en) | 2000-05-22 | 2001-05-22 | Injection mold for an optical semiconductor package and corresponding optical semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0006513A FR2809228B1 (fr) | 2000-05-22 | 2000-05-22 | Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2809228A1 FR2809228A1 (fr) | 2001-11-23 |
FR2809228B1 true FR2809228B1 (fr) | 2003-10-17 |
Family
ID=8850475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0006513A Expired - Fee Related FR2809228B1 (fr) | 2000-05-22 | 2000-05-22 | Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique |
Country Status (2)
Country | Link |
---|---|
US (1) | US6858933B2 (fr) |
FR (1) | FR2809228B1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2820240B1 (fr) * | 2001-01-26 | 2004-07-16 | St Microelectronics Sa | Substrat support de puce a circuits integres adapte pour etre place dans un moule |
SG132533A1 (en) | 2005-11-21 | 2007-06-28 | St Microelectronics Asia | Ultra-thin quad flat no-lead (qfn) package and method of fabricating the same |
TWI570857B (zh) * | 2014-12-10 | 2017-02-11 | 矽品精密工業股份有限公司 | 封裝結構及其製法 |
US9355870B1 (en) | 2015-01-15 | 2016-05-31 | Silicon Laboratories Inc. | Integrated circuit with sensor area and resin dam |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4644384A (en) * | 1984-02-02 | 1987-02-17 | National Semiconductor Corporation | Apparatus and method for packaging eprom integrated circuits |
JPH01255514A (ja) * | 1988-04-05 | 1989-10-12 | Pioneer Electron Corp | トランスファーモールド金型 |
FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
JP3161142B2 (ja) * | 1993-03-26 | 2001-04-25 | ソニー株式会社 | 半導体装置 |
JPH07214600A (ja) * | 1994-02-02 | 1995-08-15 | Fuji Electric Co Ltd | 透明樹脂封止型半導体装置の成形用金型 |
JPH07254623A (ja) * | 1994-03-16 | 1995-10-03 | Sony Corp | 光電変換装置及びその製造方法 |
JP3329145B2 (ja) * | 1995-06-28 | 2002-09-30 | 株式会社デンソー | 光センサの製造方法 |
JPH09191022A (ja) * | 1996-01-09 | 1997-07-22 | Sony Corp | 半導体樹脂封止用金型及び半導体製造方法 |
DE19607212C1 (de) * | 1996-02-26 | 1997-04-10 | Richard Herbst | Verbundkörper, Verfahren und Kunststoff-Spritzgießwerkzeug zur Herstellung eines solchen |
-
2000
- 2000-05-22 FR FR0006513A patent/FR2809228B1/fr not_active Expired - Fee Related
-
2001
- 2001-05-22 US US09/862,984 patent/US6858933B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2809228A1 (fr) | 2001-11-23 |
US6858933B2 (en) | 2005-02-22 |
US20020043703A1 (en) | 2002-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69518958T2 (de) | Spritzgegossene BGA-Packung | |
DE60010837D1 (de) | Optische Halbleitervorrichtung und zugehöriges Herstellungsverfahren | |
FR2809228B1 (fr) | Moule d'injection pour la fabrication d'un boitier semi- conducteur optique et boitier semi-conducteur optique | |
DE59704493D1 (de) | Monolithisch integriertes optisches Halbleiterbauelement und Herstellungsverfahren | |
FR2809229B1 (fr) | Moule d'injection anti-bavure d'un materiau d'encapsulation d'une puce de circuits integres | |
NO20002742D0 (no) | Støping av keramiske former | |
FR2813707B1 (fr) | Fabrication d'un transistor bipolaire | |
FR2763582B1 (fr) | Moule en alliage cupro-aluminium pour la fabrication de bouteilles | |
FR2819940B1 (fr) | Procede de fabrication d'un boitier semi-conducteur optique et boitier semi-conducteur optique | |
FR2792243B1 (fr) | Vanne d'injection, en particulier pour moule pour lentille optique | |
FR2809344B1 (fr) | Moule d'injection a demoulage par deformation | |
FR2833710B1 (fr) | Microscope a thermoreflectance pour la mesure de la temperature d'un circuit integre | |
FR2808232B1 (fr) | Dispositif de manutention de moule d'injection | |
KR970000720U (ko) | 사출금형의 냉각장치 | |
FR2817793B1 (fr) | Moule d'injection d'une ebauche de tube de conditionnement et procede de fabrication d'un tel tube | |
FR2798906B1 (fr) | Pochette d'ordre pour la livraison de travaux photographiques | |
KR960003103U (ko) | 반도체 패키지의 성형용 금형 | |
KR980005390U (ko) | Bga반도체패키지의 패키지성형 몰드금형 구조 | |
KR960029741U (ko) | 반도체 팩키지 성형용 몰드 | |
KR950028718U (ko) | 반도체 팩키지 성형용 금형의 센터블럭 | |
KR960035621U (ko) | 반도체패키지 제작금형의 가이드포스트 승강안내장치 | |
KR970046769U (ko) | 반도체 제조장비의 몰딩 및 성형장치 | |
KR940021340U (ko) | 반도체 패키지 성형용 금형의 상부 몰드다이 구조 | |
KR960038721U (ko) | 반도체 몰드 다이 | |
KR960035607U (ko) | 패키지 성형용 금형 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20080131 |