FR2813707B1 - Fabrication d'un transistor bipolaire - Google Patents
Fabrication d'un transistor bipolaireInfo
- Publication number
- FR2813707B1 FR2813707B1 FR0011419A FR0011419A FR2813707B1 FR 2813707 B1 FR2813707 B1 FR 2813707B1 FR 0011419 A FR0011419 A FR 0011419A FR 0011419 A FR0011419 A FR 0011419A FR 2813707 B1 FR2813707 B1 FR 2813707B1
- Authority
- FR
- France
- Prior art keywords
- manufacture
- bipolar transistor
- bipolar
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66242—Heterojunction transistors [HBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1004—Base region of bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66272—Silicon vertical transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0011419A FR2813707B1 (fr) | 2000-09-07 | 2000-09-07 | Fabrication d'un transistor bipolaire |
US09/947,190 US6642096B2 (en) | 2000-09-07 | 2001-09-05 | Bipolar transistor manufacturing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0011419A FR2813707B1 (fr) | 2000-09-07 | 2000-09-07 | Fabrication d'un transistor bipolaire |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2813707A1 FR2813707A1 (fr) | 2002-03-08 |
FR2813707B1 true FR2813707B1 (fr) | 2002-11-29 |
Family
ID=8854065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0011419A Expired - Fee Related FR2813707B1 (fr) | 2000-09-07 | 2000-09-07 | Fabrication d'un transistor bipolaire |
Country Status (2)
Country | Link |
---|---|
US (1) | US6642096B2 (fr) |
FR (1) | FR2813707B1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1377697A1 (fr) * | 2001-03-30 | 2004-01-07 | Koninklijke Philips Electronics N.V. | Suppression d'autodopage de type n dans les epitaxies de si et sige a basse temperature |
US6534371B2 (en) * | 2001-06-11 | 2003-03-18 | International Business Machines Corporation | C implants for improved SiGe bipolar yield |
TWI223446B (en) * | 2002-11-05 | 2004-11-01 | Ind Tech Res Inst | Method of ultra thin base fabrication for Si/SiGe hetro bipolar transistor |
KR100654354B1 (ko) * | 2005-07-25 | 2006-12-08 | 삼성전자주식회사 | 게더링 기능을 가지는 저결함 에피택셜 반도체 기판, 이를이용한 이미지 센서 및 이의 제조 방법 |
US8299500B2 (en) * | 2005-08-23 | 2012-10-30 | International Business Machines Corporation | Silicon germanium heterojunction bipolar transistor having interstitial trapping layer in base region |
US7378324B2 (en) * | 2006-03-30 | 2008-05-27 | International Business Machines Corporation | Selective links in silicon hetero-junction bipolar transistors using carbon doping and method of forming same |
US9425260B2 (en) | 2014-03-13 | 2016-08-23 | International Business Machines Corporation | Application of super lattice films on insulator to lateral bipolar transistors |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3855009A (en) * | 1973-09-20 | 1974-12-17 | Texas Instruments Inc | Ion-implantation and conventional epitaxy to produce dielectrically isolated silicon layers |
DE3825701A1 (de) * | 1987-07-29 | 1989-02-09 | Toshiba Kawasaki Kk | Verfahren zur herstellung eines bipolaren transistors |
DE69107779T2 (de) * | 1990-10-31 | 1995-09-21 | Ibm | Transistor mit selbstjustierender epitaxialer Basis und dessen Herstellungsverfahren. |
US5670788A (en) * | 1992-01-22 | 1997-09-23 | Massachusetts Institute Of Technology | Diamond cold cathode |
US5516710A (en) * | 1994-11-10 | 1996-05-14 | Northern Telecom Limited | Method of forming a transistor |
DE19755979A1 (de) * | 1996-12-09 | 1999-06-10 | Inst Halbleiterphysik Gmbh | Silizium-Germanium-Heterobipolartransistor |
JPH10242153A (ja) * | 1997-02-26 | 1998-09-11 | Hitachi Ltd | 半導体ウエハ、半導体ウエハの製造方法、半導体装置および半導体装置の製造方法 |
US5885861A (en) * | 1997-05-30 | 1999-03-23 | Advanced Micro Devices, Inc. | Reduction of dopant diffusion by the co-implantation of impurities into the transistor gate conductor |
JPH11297976A (ja) * | 1998-04-07 | 1999-10-29 | Sony Corp | エピタキシャル半導体基板およびその製造方法ならびに半導体装置の製造方法ならびに固体撮像装置の製造方法 |
FR2795233B1 (fr) * | 1999-06-18 | 2001-08-24 | St Microelectronics Sa | Procede de fabrication autoaligne de transistors bipolaires |
-
2000
- 2000-09-07 FR FR0011419A patent/FR2813707B1/fr not_active Expired - Fee Related
-
2001
- 2001-09-05 US US09/947,190 patent/US6642096B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20020042178A1 (en) | 2002-04-11 |
FR2813707A1 (fr) | 2002-03-08 |
US6642096B2 (en) | 2003-11-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20090529 |