DE10197112T1 - Herstellung integrierter Schaltungen - Google Patents

Herstellung integrierter Schaltungen

Info

Publication number
DE10197112T1
DE10197112T1 DE10197112T DE10197112T DE10197112T1 DE 10197112 T1 DE10197112 T1 DE 10197112T1 DE 10197112 T DE10197112 T DE 10197112T DE 10197112 T DE10197112 T DE 10197112T DE 10197112 T1 DE10197112 T1 DE 10197112T1
Authority
DE
Germany
Prior art keywords
manufacture
integrated circuits
circuits
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10197112T
Other languages
English (en)
Inventor
Tracy J Weed
Christophe Pierrat
Yagyensh Buno Pati
Atul Sharan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Synopsys Inc
Original Assignee
Numerical Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Numerical Technologies Inc filed Critical Numerical Technologies Inc
Publication of DE10197112T1 publication Critical patent/DE10197112T1/de
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
DE10197112T 2000-12-27 2001-12-26 Herstellung integrierter Schaltungen Ceased DE10197112T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/752,809 US20040006485A1 (en) 2000-12-27 2000-12-27 Manufacturing integrated circuits
PCT/US2001/050851 WO2002052344A2 (en) 2000-12-27 2001-12-26 Manufacturing integrated circuits using phase-shifting masks

Publications (1)

Publication Number Publication Date
DE10197112T1 true DE10197112T1 (de) 2003-11-20

Family

ID=25027939

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10197112T Ceased DE10197112T1 (de) 2000-12-27 2001-12-26 Herstellung integrierter Schaltungen

Country Status (4)

Country Link
US (1) US20040006485A1 (de)
AU (1) AU2002229132A1 (de)
DE (1) DE10197112T1 (de)
WO (1) WO2002052344A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020156639A1 (en) * 2001-02-27 2002-10-24 Akira Ishikawa Business method for a digital photolithography system
JP2002328463A (ja) * 2001-04-27 2002-11-15 Mitsubishi Electric Corp 半導体回路用フォトマスクの発注方法
US7003477B2 (en) * 2002-03-01 2006-02-21 Phillip Zarrow Certification method for manufacturing process
JP2004053807A (ja) * 2002-07-18 2004-02-19 Renesas Technology Corp マスクメーカ選定方法
US7363236B2 (en) * 2003-03-14 2008-04-22 Chartered Semiconductor Manufacturing Ltd. System, apparatus and method for reticle grade and pricing management
US20050177526A1 (en) * 2004-02-09 2005-08-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method for negotiations using a global pricing system
US20070219929A1 (en) * 2006-03-14 2007-09-20 Jochen Steinbach Planning granularity in manufacturing computing systems
US8027857B2 (en) * 2006-03-14 2011-09-27 Sap Ag Rough-cut manufacturing operations for use in planning

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62193249A (ja) * 1986-02-20 1987-08-25 Fuji Electric Co Ltd 半導体装置の製造方法
DE19540348B4 (de) * 1995-10-28 2007-01-11 Micronas Gmbh Verfahren zum Identifizieren von Bauelementen
JP2692662B2 (ja) * 1995-10-31 1997-12-17 日本電気株式会社 荷電粒子ビーム露光装置及び透過マスク寿命判定方法
US5787012A (en) * 1995-11-17 1998-07-28 Sun Microsystems, Inc. Integrated circuit with identification signal writing circuitry distributed on multiple metal layers
US6049789A (en) * 1998-06-24 2000-04-11 Mentor Graphics Corporation Software pay per use licensing system
US6433146B1 (en) * 1999-05-18 2002-08-13 The Board Of Trustees Of The University Of Illinois Corn oil and protein extraction method

Also Published As

Publication number Publication date
US20040006485A1 (en) 2004-01-08
AU2002229132A1 (en) 2002-07-08
WO2002052344A3 (en) 2003-12-18
WO2002052344A2 (en) 2002-07-04

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: SYNOPSYS, INC., MOUNTAIN VIEW, CALIF., US

8110 Request for examination paragraph 44
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final

Effective date: 20120314