KR960003103U - 반도체 패키지의 성형용 금형 - Google Patents

반도체 패키지의 성형용 금형

Info

Publication number
KR960003103U
KR960003103U KR2019940015210U KR19940015210U KR960003103U KR 960003103 U KR960003103 U KR 960003103U KR 2019940015210 U KR2019940015210 U KR 2019940015210U KR 19940015210 U KR19940015210 U KR 19940015210U KR 960003103 U KR960003103 U KR 960003103U
Authority
KR
South Korea
Prior art keywords
mold
semiconductor package
molding semiconductor
molding
package
Prior art date
Application number
KR2019940015210U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019940015210U priority Critical patent/KR960003103U/ko
Publication of KR960003103U publication Critical patent/KR960003103U/ko

Links

KR2019940015210U 1994-06-25 1994-06-25 반도체 패키지의 성형용 금형 KR960003103U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940015210U KR960003103U (ko) 1994-06-25 1994-06-25 반도체 패키지의 성형용 금형

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940015210U KR960003103U (ko) 1994-06-25 1994-06-25 반도체 패키지의 성형용 금형

Publications (1)

Publication Number Publication Date
KR960003103U true KR960003103U (ko) 1996-01-22

Family

ID=60667388

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940015210U KR960003103U (ko) 1994-06-25 1994-06-25 반도체 패키지의 성형용 금형

Country Status (1)

Country Link
KR (1) KR960003103U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970022562A (ko) * 1995-10-12 1997-05-30 김광호 노광장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970022562A (ko) * 1995-10-12 1997-05-30 김광호 노광장치

Similar Documents

Publication Publication Date Title
DE69518958D1 (de) Spritzgegossene BGA-Packung
SG38849A1 (en) Paddleless molded plastic semiconductor chip package
KR950010192U (ko) 반도체 팩키지 성형용 몰드프레스
EP0690499A3 (en) Molded plastic packaging for semiconductor chip without support
KR960003103U (ko) 반도체 패키지의 성형용 금형
KR960029741U (ko) 반도체 팩키지 성형용 몰드
KR960035607U (ko) 패키지 성형용 금형
KR970003278U (ko) 반도체 팩키지 성형용 북몰드
KR950028718U (ko) 반도체 팩키지 성형용 금형의 센터블럭
KR960038721U (ko) 반도체 몰드 다이
KR950021482U (ko) 반도체 패키지용 리드 프레임 및 패키지 성형용 금형
GB2289011B (en) Mold for a semiconductor package
KR950023957U (ko) 패키지 성형용 트랜스퍼 몰드 다이
KR950026870U (ko) 성형용 금형
KR970007238U (ko) 반도체팩키지의 리드성형장치
KR920013716U (ko) 팩키지 몰딩용 다이
KR960025461U (ko) 반도체 몰드용 플런저
KR950028670U (ko) 반도체 몰드 다이
KR950021465U (ko) 몰딩이 필요없는 반도체 패키지
KR940019727U (ko) 반도체 제조용 몰드금형
KR970046767U (ko) 엘오씨 패캐이지용 몰딩장치
KR960025444U (ko) 반도체 몰딩용 지그
KR970046939U (ko) 반도체패키지 제조용 몰딩프레스의 금형장치
KR950034700U (ko) 반도체 금형의 리드절단장치
KR970059855U (ko) 패키지 제조용 몰딩금형의 몰드체이스 결합구조

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application