KR960029741U - 반도체 팩키지 성형용 몰드 - Google Patents
반도체 팩키지 성형용 몰드Info
- Publication number
- KR960029741U KR960029741U KR2019950001762U KR19950001762U KR960029741U KR 960029741 U KR960029741 U KR 960029741U KR 2019950001762 U KR2019950001762 U KR 2019950001762U KR 19950001762 U KR19950001762 U KR 19950001762U KR 960029741 U KR960029741 U KR 960029741U
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- semiconductor package
- molding semiconductor
- molding
- package
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950001762U KR0122888Y1 (ko) | 1995-02-07 | 1995-02-07 | 반도체 팩키지 성형용 몰드 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950001762U KR0122888Y1 (ko) | 1995-02-07 | 1995-02-07 | 반도체 팩키지 성형용 몰드 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960029741U true KR960029741U (ko) | 1996-09-17 |
| KR0122888Y1 KR0122888Y1 (ko) | 1999-02-18 |
Family
ID=19407545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950001762U KR0122888Y1 (ko) | 1995-02-07 | 1995-02-07 | 반도체 팩키지 성형용 몰드 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0122888Y1 (ko) |
-
1995
- 1995-02-07 KR KR2019950001762U patent/KR0122888Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR0122888Y1 (ko) | 1999-02-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20040510 Year of fee payment: 7 |
|
| LAPS | Lapse due to unpaid annual fee |