KR970046763U - 반도체금형의 성형품 취출장치 - Google Patents

반도체금형의 성형품 취출장치

Info

Publication number
KR970046763U
KR970046763U KR2019950038007U KR19950038007U KR970046763U KR 970046763 U KR970046763 U KR 970046763U KR 2019950038007 U KR2019950038007 U KR 2019950038007U KR 19950038007 U KR19950038007 U KR 19950038007U KR 970046763 U KR970046763 U KR 970046763U
Authority
KR
South Korea
Prior art keywords
taking out
molded products
out molded
semiconductor mold
mold
Prior art date
Application number
KR2019950038007U
Other languages
English (en)
Other versions
KR0132216Y1 (ko
Inventor
이순표
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950038007U priority Critical patent/KR0132216Y1/ko
Publication of KR970046763U publication Critical patent/KR970046763U/ko
Application granted granted Critical
Publication of KR0132216Y1 publication Critical patent/KR0132216Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR2019950038007U 1995-12-04 1995-12-04 반도체금형의 성형품 취출장치 KR0132216Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950038007U KR0132216Y1 (ko) 1995-12-04 1995-12-04 반도체금형의 성형품 취출장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950038007U KR0132216Y1 (ko) 1995-12-04 1995-12-04 반도체금형의 성형품 취출장치

Publications (2)

Publication Number Publication Date
KR970046763U true KR970046763U (ko) 1997-07-31
KR0132216Y1 KR0132216Y1 (ko) 1999-02-01

Family

ID=19431875

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950038007U KR0132216Y1 (ko) 1995-12-04 1995-12-04 반도체금형의 성형품 취출장치

Country Status (1)

Country Link
KR (1) KR0132216Y1 (ko)

Also Published As

Publication number Publication date
KR0132216Y1 (ko) 1999-02-01

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
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Payment date: 20100825

Year of fee payment: 13

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