KR940017889U - 반도체 패키지 금형장치의 분리형 캐비티 블럭 - Google Patents

반도체 패키지 금형장치의 분리형 캐비티 블럭

Info

Publication number
KR940017889U
KR940017889U KR2019920025150U KR920025150U KR940017889U KR 940017889 U KR940017889 U KR 940017889U KR 2019920025150 U KR2019920025150 U KR 2019920025150U KR 920025150 U KR920025150 U KR 920025150U KR 940017889 U KR940017889 U KR 940017889U
Authority
KR
South Korea
Prior art keywords
semiconductor package
mold device
cavity block
package mold
separable cavity
Prior art date
Application number
KR2019920025150U
Other languages
English (en)
Other versions
KR0132442Y1 (ko
Inventor
오룡영
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019920025150U priority Critical patent/KR0132442Y1/ko
Publication of KR940017889U publication Critical patent/KR940017889U/ko
Application granted granted Critical
Publication of KR0132442Y1 publication Critical patent/KR0132442Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR2019920025150U 1992-12-11 1992-12-11 반도체 패키지 금형장치의 분리형 캐비티 블럭 KR0132442Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019920025150U KR0132442Y1 (ko) 1992-12-11 1992-12-11 반도체 패키지 금형장치의 분리형 캐비티 블럭

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019920025150U KR0132442Y1 (ko) 1992-12-11 1992-12-11 반도체 패키지 금형장치의 분리형 캐비티 블럭

Publications (2)

Publication Number Publication Date
KR940017889U true KR940017889U (ko) 1994-07-28
KR0132442Y1 KR0132442Y1 (ko) 1999-02-01

Family

ID=19346329

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019920025150U KR0132442Y1 (ko) 1992-12-11 1992-12-11 반도체 패키지 금형장치의 분리형 캐비티 블럭

Country Status (1)

Country Link
KR (1) KR0132442Y1 (ko)

Also Published As

Publication number Publication date
KR0132442Y1 (ko) 1999-02-01

Similar Documents

Publication Publication Date Title
KR950010192U (ko) 반도체 팩키지 성형용 몰드프레스
KR940017889U (ko) 반도체 패키지 금형장치의 분리형 캐비티 블럭
KR940008668U (ko) 반도체 패키지 성형용 금형의 캐비티 세정용 리드프레임
KR970000720U (ko) 사출금형의 냉각장치
KR950028718U (ko) 반도체 팩키지 성형용 금형의 센터블럭
KR970046763U (ko) 반도체금형의 성형품 취출장치
KR940021340U (ko) 반도체 패키지 성형용 금형의 상부 몰드다이 구조
KR880021516U (ko) 다이 캐스팅 금형의 냉각장치
KR890017364U (ko) 이형 압출물 성형조의 냉각장치
KR950021402U (ko) 반도체 팩키지의 리이드 성형용 금형의 펀치부 구조
KR930022414U (ko) 반도체 패키지성형용 금형의 로케이션핀 고정장치
KR960003103U (ko) 반도체 패키지의 성형용 금형
KR920017859U (ko) 몰드다이의 캐비티 구조
KR890014824U (ko) 반도체금형의 캐비티블럭
KR890014825U (ko) 반도체금형의 캐비티블럭
KR950021482U (ko) 반도체 패키지용 리드 프레임 및 패키지 성형용 금형
KR980005390U (ko) Bga반도체패키지의 패키지성형 몰드금형 구조
KR960038721U (ko) 반도체 몰드 다이
KR940017916U (ko) 패키지 리드 포밍용 금형장치
KR970015322U (ko) 반도체소자 패키지 공정용 몰딩 다이의 컬 블록구조
KR960003099U (ko) 반도체금형의 레진제거장치
KR960029741U (ko) 반도체 팩키지 성형용 몰드
KR900021153U (ko) 반도체칩의 컴파운드성형모울드
KR960003105U (ko) 반도체금형의 펀치
KR970046768U (ko) 초박형 반도체패키지의 슬러쉬 컷팅 몰딩장치

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040820

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee