KR900021153U - 반도체칩의 컴파운드성형모울드 - Google Patents

반도체칩의 컴파운드성형모울드

Info

Publication number
KR900021153U
KR900021153U KR2019890006522U KR890006522U KR900021153U KR 900021153 U KR900021153 U KR 900021153U KR 2019890006522 U KR2019890006522 U KR 2019890006522U KR 890006522 U KR890006522 U KR 890006522U KR 900021153 U KR900021153 U KR 900021153U
Authority
KR
South Korea
Prior art keywords
semiconductor chip
molding mold
compound molding
compound
mold
Prior art date
Application number
KR2019890006522U
Other languages
English (en)
Other versions
KR920001987Y1 (ko
Inventor
곽노권
Original Assignee
주식회사 한미금형
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 한미금형 filed Critical 주식회사 한미금형
Priority to KR2019890006522U priority Critical patent/KR920001987Y1/ko
Publication of KR900021153U publication Critical patent/KR900021153U/ko
Application granted granted Critical
Publication of KR920001987Y1 publication Critical patent/KR920001987Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
KR2019890006522U 1989-05-19 1989-05-19 반도체칩의 컴파운드성형모울드 KR920001987Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019890006522U KR920001987Y1 (ko) 1989-05-19 1989-05-19 반도체칩의 컴파운드성형모울드

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019890006522U KR920001987Y1 (ko) 1989-05-19 1989-05-19 반도체칩의 컴파운드성형모울드

Publications (2)

Publication Number Publication Date
KR900021153U true KR900021153U (ko) 1990-12-14
KR920001987Y1 KR920001987Y1 (ko) 1992-03-26

Family

ID=19286217

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019890006522U KR920001987Y1 (ko) 1989-05-19 1989-05-19 반도체칩의 컴파운드성형모울드

Country Status (1)

Country Link
KR (1) KR920001987Y1 (ko)

Also Published As

Publication number Publication date
KR920001987Y1 (ko) 1992-03-26

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