KR950021402U - 반도체 팩키지의 리이드 성형용 금형의 펀치부 구조 - Google Patents

반도체 팩키지의 리이드 성형용 금형의 펀치부 구조

Info

Publication number
KR950021402U
KR950021402U KR2019930027228U KR930027228U KR950021402U KR 950021402 U KR950021402 U KR 950021402U KR 2019930027228 U KR2019930027228 U KR 2019930027228U KR 930027228 U KR930027228 U KR 930027228U KR 950021402 U KR950021402 U KR 950021402U
Authority
KR
South Korea
Prior art keywords
mold
semiconductor package
punch part
lead molding
molding
Prior art date
Application number
KR2019930027228U
Other languages
English (en)
Other versions
KR960009285Y1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR93027228U priority Critical patent/KR960009285Y1/ko
Publication of KR950021402U publication Critical patent/KR950021402U/ko
Application granted granted Critical
Publication of KR960009285Y1 publication Critical patent/KR960009285Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
KR93027228U 1993-12-10 1993-12-10 Punch structure of metal formation for lead forming in a semiconductor package KR960009285Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR93027228U KR960009285Y1 (en) 1993-12-10 1993-12-10 Punch structure of metal formation for lead forming in a semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR93027228U KR960009285Y1 (en) 1993-12-10 1993-12-10 Punch structure of metal formation for lead forming in a semiconductor package

Publications (2)

Publication Number Publication Date
KR950021402U true KR950021402U (ko) 1995-07-28
KR960009285Y1 KR960009285Y1 (en) 1996-10-16

Family

ID=19370554

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93027228U KR960009285Y1 (en) 1993-12-10 1993-12-10 Punch structure of metal formation for lead forming in a semiconductor package

Country Status (1)

Country Link
KR (1) KR960009285Y1 (ko)

Also Published As

Publication number Publication date
KR960009285Y1 (en) 1996-10-16

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