KR930022414U - 반도체 패키지성형용 금형의 로케이션핀 고정장치 - Google Patents

반도체 패키지성형용 금형의 로케이션핀 고정장치

Info

Publication number
KR930022414U
KR930022414U KR2019920004119U KR920004119U KR930022414U KR 930022414 U KR930022414 U KR 930022414U KR 2019920004119 U KR2019920004119 U KR 2019920004119U KR 920004119 U KR920004119 U KR 920004119U KR 930022414 U KR930022414 U KR 930022414U
Authority
KR
South Korea
Prior art keywords
mold
fixing device
semiconductor package
pin fixing
location pin
Prior art date
Application number
KR2019920004119U
Other languages
English (en)
Other versions
KR940007544Y1 (ko
Inventor
윤태호
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR92004119U priority Critical patent/KR940007544Y1/ko
Publication of KR930022414U publication Critical patent/KR930022414U/ko
Application granted granted Critical
Publication of KR940007544Y1 publication Critical patent/KR940007544Y1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR92004119U 1992-03-14 1992-03-14 반도체 패키지성형용 금형의 로케이션핀 고정장치 KR940007544Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92004119U KR940007544Y1 (ko) 1992-03-14 1992-03-14 반도체 패키지성형용 금형의 로케이션핀 고정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92004119U KR940007544Y1 (ko) 1992-03-14 1992-03-14 반도체 패키지성형용 금형의 로케이션핀 고정장치

Publications (2)

Publication Number Publication Date
KR930022414U true KR930022414U (ko) 1993-10-16
KR940007544Y1 KR940007544Y1 (ko) 1994-10-22

Family

ID=19330331

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92004119U KR940007544Y1 (ko) 1992-03-14 1992-03-14 반도체 패키지성형용 금형의 로케이션핀 고정장치

Country Status (1)

Country Link
KR (1) KR940007544Y1 (ko)

Also Published As

Publication number Publication date
KR940007544Y1 (ko) 1994-10-22

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