KR950034340U - 반도체용 트랜스퍼 성형(Transfer Molding)장치 - Google Patents

반도체용 트랜스퍼 성형(Transfer Molding)장치

Info

Publication number
KR950034340U
KR950034340U KR2019940011455U KR19940011455U KR950034340U KR 950034340 U KR950034340 U KR 950034340U KR 2019940011455 U KR2019940011455 U KR 2019940011455U KR 19940011455 U KR19940011455 U KR 19940011455U KR 950034340 U KR950034340 U KR 950034340U
Authority
KR
South Korea
Prior art keywords
molding device
transfer molding
semiconductor transfer
semiconductor
transfer
Prior art date
Application number
KR2019940011455U
Other languages
English (en)
Other versions
KR0116194Y1 (ko
Inventor
최종혁
Original Assignee
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아남산업 주식회사 filed Critical 아남산업 주식회사
Priority to KR2019940011455U priority Critical patent/KR0116194Y1/ko
Publication of KR950034340U publication Critical patent/KR950034340U/ko
Application granted granted Critical
Publication of KR0116194Y1 publication Critical patent/KR0116194Y1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR2019940011455U 1994-05-23 1994-05-23 반도체용 트랜스퍼 성형(Transfer Molding)장치 KR0116194Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940011455U KR0116194Y1 (ko) 1994-05-23 1994-05-23 반도체용 트랜스퍼 성형(Transfer Molding)장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940011455U KR0116194Y1 (ko) 1994-05-23 1994-05-23 반도체용 트랜스퍼 성형(Transfer Molding)장치

Publications (2)

Publication Number Publication Date
KR950034340U true KR950034340U (ko) 1995-12-18
KR0116194Y1 KR0116194Y1 (ko) 1998-04-18

Family

ID=19383783

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940011455U KR0116194Y1 (ko) 1994-05-23 1994-05-23 반도체용 트랜스퍼 성형(Transfer Molding)장치

Country Status (1)

Country Link
KR (1) KR0116194Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100443316B1 (ko) * 2002-09-09 2004-08-09 한미반도체 주식회사 반도체 패키지 몰딩장치

Also Published As

Publication number Publication date
KR0116194Y1 (ko) 1998-04-18

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